東佑達自動化科技股份公司

http://www.toyorobot.com/

• Booth: J3054

FA & ROBOTS Maker

Overview

TOYO Group was established in 2000, is our Company Principle. With heavily invested in R&D and innovation, we gain the majority of customer acceptance and adoption. Especially in Taiwan and China market of robotics, we have become the brand of choice for customers. Also, TOYO successfully exporting Taiwan-made products to over 15 advanced countries, including Japan, United States, Italy, Korea…etc. and won a very good reputation in the market.

In order to keep improving the competitiveness, TOYO put a lot of investment in R&D, and developed a variety cost-effective controller combined single-axis and multi-axis Cartesian robots. In addition, in order to provide the rapid service to customers in the region around the world, we have set up production facilities in Tainan Taiwan, Suzhou China and Fukuoka Japan, Also has been co-operating with agents in more than nine countries, like the United States, Europe and Southeast Asia. Providing the Global Services System is our aim.

We are continuing research and develop the new products to solve the upcoming requirement of automation fields, which include the actuators with/without motor and controller, Automatic Guided Vehicle(AGV). Now we have more than 1,000 products. Precise positioning and speed control can achieve the high accuracy requirement of linear movement and pick and place movement. 

Electric Actuator

Servo Cylinder

  Press Releases

• 東佑達將展出 SEMICON Taiwan 2026-聚焦先進封裝、CPO耦光與奈米級精密定位技術 (Aug 26, 2026)

  精密傳動與自動化設備廠東佑達自動化科技股份有限公司（股票代號：7942）將於2026年9月2日至4日參加SEMICON Taiwan 2026國際半導體展，於台北南港展覽館1館1樓J3054攤位，展出涵蓋晶圓搬運、先進封裝、精密檢測、CPO光學對位及奈米級定位等半導體自動化解決方案，展現東佑達從關鍵零組件、精密運動平台到設備應用整合的完整技術實力。

  隨著AI、高效能運算（HPC）、先進封裝及矽光子技術快速發展，半導體設備對定位精度、運動穩定性、潔淨度及製程效率提出更高要求。東佑達持續投入高精度直線傳動、線性馬達、氣浮平台、驅動控制及多軸整合技術，協助設備商縮短開發時程，並提升設備精度、產能與製程穩定性。

  本次展出重點之一為CPO光電共封裝精密對位平台，可整合X、Y、Z及Rx、Ry、Rz六自由度微調控制，因應光纖與光學元件耦合所需的高精度定位需求。透過低重心、高剛性及模組化架構，可協助縮短尋光時間，提升耦光效率與製程一致性，適用於矽光子、光通訊及先進光學封裝設備。

  另一項重點為奈米級氣浮定位平台，結合氣浮軸承、真空預壓與線性馬達驅動，具備低摩擦、無接觸、免潤滑及低發塵等特性，可提供高穩定度掃描與精密定位，適用於晶圓AOI、Micro LED檢測、TGV檢測、精密量測及微加工等應用。

  針對晶圓搬運與先進封裝製程，東佑達亦將呈現線性馬達模組、電動缸、多軸平台、龍門系統及運動控制器等產品，應用範圍涵蓋Load Port、EFEM走行軸、晶圓清洗、FOUP與Cassette搬運、IC分撿、TIM貼合及FOPLP AOI等製程。透過模組化設計與自主開發的關鍵零組件，東佑達可依客戶行程、荷重、速度、精度、潔淨度及安裝空間需求，提供更具彈性的選型與客製化服務。

  東佑達表示，面對半導體製程持續朝向高精度、高速度及高整合度發展，公司將深化精密傳動、奈米定位與智慧控制技術，並結合全球生產與服務據點，協助半導體設備商加速產品開發與量產導入。展會期間，東佑達應用工程團隊將於現場提供技術交流與選型建議，歡迎半導體設備商、晶圓製造與封測業者、系統整合商及產業夥伴蒞臨J3054攤位參觀交流。

  展覽資訊
  展覽名稱：SEMICON Taiwan 2026
  展覽日期：2026年9月2日至4日
  展覽地點：台北南港展覽館1館1樓
  東佑達攤位：J3054

• TOYO Automation to Showcase Precision Motion Technologies for Advanced Packaging, CPO and Semiconductor Manufacturing at SEMICON Taiwan 2026 (Aug 26, 2026)

  TOYO Automation Co., Ltd. (Taiwan Emerging Stock Market: 7942), a leading provider of precision motion and factory automation solutions, will participate in SEMICON Taiwan 2026 from September 2 to 4 at Taipei Nangang Exhibition Center. Located at Booth J3054 on the first floor of Hall 1, TOYO will present semiconductor automation solutions covering wafer handling, advanced packaging, precision inspection, co-packaged optics and nanometer-level positioning.

  As artificial intelligence, high-performance computing, advanced packaging and silicon photonics continue to evolve, semiconductor equipment requires greater positioning accuracy, motion stability, cleanliness and production efficiency. TOYO continues to advance its precision linear motion, linear motor, air-bearing stage, motion control and multi-axis integration technologies to help equipment manufacturers shorten development cycles and improve process performance.

  A major highlight will be TOYO’s precision alignment solution for co-packaged optics. The platform integrates six degrees of freedom—X, Y, Z, Rx, Ry and Rz—to support highly precise alignment between optical fibers and photonic components. Its compact, low-center-of-gravity and high-rigidity structure helps shorten first-light search time, improve coupling efficiency and enhance process consistency for silicon photonics, optical communication and advanced photonic packaging applications.

  TOYO will also highlight its nanometer-level air-bearing positioning platform. Combining air bearings, vacuum preload and linear motor drive technology, the platform provides contactless motion with low friction, no lubrication and low particle generation. Its smooth and stable scanning performance makes it suitable for wafer AOI, Micro LED inspection, through-glass via inspection, precision metrology and micro-processing systems.

  For wafer handling and advanced packaging applications, TOYO will present a comprehensive portfolio of linear motor modules, electric actuators, multi-axis stages, gantry systems and motion controllers. These solutions can be applied to load ports, EFEM transfer axes, wafer cleaning systems, FOUP and cassette handling, IC sorting, thermal interface material bonding and fan-out panel-level packaging inspection.

  By integrating modular product design with self-developed key components and control technologies, TOYO can provide flexible product selection and customized solutions based on travel distance, payload, speed, positioning accuracy, cleanroom requirements and installation space.

  As semiconductor manufacturing advances toward higher precision, greater speed and tighter system integration, TOYO will continue to strengthen its precision transmission, nanometer positioning and intelligent motion control capabilities. Supported by its global manufacturing and service network, the company aims to help semiconductor equipment manufacturers accelerate machine development and volume-production deployment.

  TOYO’s application engineering team will be available throughout the exhibition to provide technical consultation and product selection support. Semiconductor equipment manufacturers, wafer fabrication and packaging companies, system integrators and industry partners are invited to visit Booth J3054.

  Event Information
  Event: SEMICON Taiwan 2026
  Date: September 2–4, 2026
  Venue: Taipei Nangang Exhibition Center, Hall 1, 1F
  TOYO Booth: J3054

  Products