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岱鐠科技股份有限公司

台北市,  台北市 
Taiwan
https://www.dediprog.com/
  • Booth: K2886

Welcome to DediProg!

Overview

公司簡介

岱鐠科技股份有限公司(品牌名:DediProg)成立於 2005 年,擁有近 20 年深耕 IC 工程領域的經驗,早期專注於 IC 燒錄設備的研發製造。近年來,我們延伸技術實力,推出多款高精度 IC 測試座,應用於老化測試(Burn-in)、最終測試(Final Test)及工程驗證等環節,協助客戶提升測試效率與良率。

我們的測試座搭載自研導電膠(PCR)與彈簧探針(Pogo Pin),具備低接觸電阻、高訊號穩定性與耐用特性,深受全球半導體產業客戶信賴。

測試座產品

  • UltraConduct™ 導電膠探針測試座
  • PCR測試座 PCR Socket
  • 老化測試座 Burn-in Socket
  • 最終測試座 Final Test Socket
  • 開蓋式測試座 Open Top Socket
  • DDR5 模組測試座 DDR5 Module Test Socket
  • DDR4 模組測試座 DDR4 Module  Test Socket
  • 導電膠 Pressure Conductive Silicone Rubber (PCR)
  • 彈簧探針Pogo Pin


  Press Releases

  • DediProg Introduces UltraConduct™ Rubber Pin Test Socket for AI/HPC Chip Testing

    Patented PCR × Pogo Pin Hybrid Structure Delivers Low Contact Resistance, Reliable Contact Performance, and a Cost-Effective Test Interface
     

    August 6, 2026, Taiwan – DediProg Technology, a global leader in IC programming and testing solutions, today announced the launch of its new UltraConduct™ Rubber Pin Test Socket. Featuring DediProg’s patented PCR x Pogo Pin hybrid contact structure, the new solution combines low contact resistance, high-frequency signal integrity, solder ball protection, and long-stroke warpage compensation capability, providing a next-generation test interface for AI/HPC ICs.

    "DediProg invested in the development of its own pressure conductive rubber (PCR) several years ago. Leveraging its excellent signal transmission capability and cost-effectiveness, we have continuously expanded the applications of PCR in high-speed testing," said Chong Tsao, General Manager of DediProg Technology. "As testing requirements for large AI chip packages continue to evolve, we launched the UltraConduct™ Rubber Pin Test Socket, which has completed 100,000 contact cycle validation on our in-house production line, delivering a high-performance, reliable, and cost-effective test interface solution for the industry."

    UltraConduct™’s Four Core Technologies

    • <50mΩ Low Contact Resistance: In high-speed testing environments such as 112G+ (PAM4), conventional spring probe structures may compromise signal integrity due to parasitic inductance effects. UltraConduct™ adopts PCR contact and precisely controls the characteristic impedance of the overall socket structure, achieving contact resistance below 50mΩ while minimizing high-speed signal attenuation and test errors.
       
    • 0.6 mm Long-stroke Design: Featuring a 0.6mm probe compression stroke, UltraConduct™ maintains contact force at 20g with a ±20% tolerance, ensuring reliable contact for large BGA packages while minimizing mechanical stress.
       
    • Flexible, Mark-free Contact: Using a flexible PCR contact interface, UltraConduct™ reduces localized contact stress and leaves no probe marks after testing, preserving solder ball surface integrity while reducing the risk of SMT assembly quality issues and rework costs.
       
    • Wide Temperature Range Testing from -55°C To 150°C: The PCR × Pogo Pin hybrid structure of UltraConduct™ enhances test stability across high and low temperature environments. It can also be integrated with thermal management modules to meet the temperature control and reliability validation requirements of AI/HPC chips operating under high-power conditions.

    A New Approach to High-Speed Test Interface Challenges

    To address the testing requirements of high-speed signals, high-power chips, and large-package devices, the industry currently uses solutions including ultra-short high-frequency probes, PCR, and coaxial sockets. However, each approach has limitations: ultra-short probes may face mechanical strength challenges, conventional PCR may have limited contact stroke when testing large packages with coplanarity challenges, and coaxial sockets involve higher costs for high pin count applications.

    "PCR is an ideal contact interface for high-speed testing, offering low contact resistance and cost-effectiveness. However, maintaining stable contact becomes more challenging when package warpage or solder ball height variations are present," said WeiChu Chen, Operation Director of the IC Test Socket Business Unit at DediProg. "The UltraConduct™ Rubber Pin Test Socket combines the long-stroke capability of spring probes with the low contact resistance advantages of PCR, enabling customers to improve test stability more cost-effectively."

    DediProg will showcase the UltraConduct™ Rubber Pin Test Socket and its latest IC test solutions at SEMICON Taiwan 2026, taking place from September 2–4, 2026. Industry partners are invited to visit Booth K2886 at TaiNEX Hall 1 to explore the latest advancements in IC testing technology.


    About DediProg Technology

    Founded in 2005, DediProg is a global provider of IC programming and testing solutions, offering a range of solutions, including automated programming systems, engineering programmers, IC test sockets, and PCR (pressure conductive rubber) solutions. Guided by its mission of “Invent for Users,” DediProg combines hardware and software integration capabilities with technical expertise to help customers improve production efficiency and product reliability. With a global service network, DediProg provides professional technical support and services to customers worldwide. For more information, please visit: https://www.dediprog.com.


    Contact us to learn more about UltraConduct™ Rubber Pin Socket or request a test sample.
     


    Product Information:

    UltraConduct™ Rubber Pin Socket
    UltraConduct™ Rubber Pin
     


    Learn More: 
    【Articles】How to Choose IC Test Interfaces? PCR vs. Pogo Pin
    【Case Study】PCR Conductive Rubber Boosts Automotive Chip Yield and Reduces Reflow
    【Case Study】Customized PCR as an SMA Interposer for High-Frequency RF Testing
    【Case Study】Replacing High-Frequency Probes with PCR for 112Gbps PAM4 Testing

     

    Contact us

  • 突破AI/HPC高速晶片測試挑戰!岱鐠推出全新UltraConduct™導電膠探針測試座

    PCR × Pogo Pin專利混合結構,兼具低接觸電阻、高可靠接觸與成本效益的新一代測試介面
     

    岱鐠科技宣布推出全新UltraConduct™導電膠探針測試座,採用獨家專利PCR x Pogo Pin混合式接觸結構,兼具低接觸電阻、高頻訊號完整性、錫球保護與高度補償能力,為 AI/HPC晶片提供新一代高效能測試介面方案。

    2026年08月06日,台灣 –全球領先的晶片燒錄與測試解決方案供應商岱鐠科技(DediProg Technology)宣布推出全新UltraConduct™導電膠探針測試座,採用獨家專利PCR x Pogo Pin混合式接觸結構,兼具低接觸電阻、高頻訊號完整性、錫球保護與高度補償能力,為 AI/HPC晶片提供新一代高效能測試介面方案。

    岱鐠科技總經理曹忠勇表示:「岱鐠早在數年前即投入自主導電膠研發,憑藉優異的高速訊號傳輸能力與成本效益,逐步拓展導電膠於高速測試領域的應用範圍。如今面對大型AI晶片封裝測試的需求升級,我們推出全新UltraConduct™導電膠探針測試座,並完成自有量產產線10萬次接觸循環測試驗證,為市場提供兼具高效能、可靠度與成本效益的新一代測試介面選擇。」 

    UltraConduct™四大核心技術 滿足大型封裝AI晶片測試需求

    • <50mΩ低接觸電阻,提升高速訊號完整性:在112G+(PAM4)等高速測試環境下,傳統彈簧探針結構可能因寄生電感效應影響訊號品質。UltraConduct™採用專利導電膠接觸技術,在Socket整體結構設計上精準控制特性阻抗,實現低於50mΩ的接觸電阻,減少高速訊號衰減與測試誤差。
       
    • 0.6mm大行程補償,支援大型封裝測試:具備0.6mm極佳的探針壓縮行程,下壓接觸力穩定控制於20g±20%之公差範圍,即使面對大尺寸BGA封裝與翹曲挑戰,也能兼顧穩定接觸與低機械應力。
       
    • 柔性無針痕接觸,保護高價值IC錫球:採用柔性導電膠接觸介面,降低局部接觸應力,測試後不留針痕,維護錫球表面完整性,降低後續SMT貼裝品質風險與重工成本。

      UltraConduct™導電膠探針測試座採用柔性導電膠接觸介面,降低局部接觸應力,測試後不留針痕,維護錫球表面完整性,降低後續SMT貼裝品質風險與重工成本。
       
    • 支援-55°C 至150°C廣溫域測試環境:UltraConduct™透過PCR × Pogo Pin混合結構,提升高低溫環境下的測試穩定性,並可整合熱管理模組,滿足AI/HPC晶片於高功率條件下的溫度控制與可靠度驗證需求。
       

    突破傳統高速測試介面限制 填補市場應用缺口

    針對高速訊號傳輸、高功耗運算晶片與大型封裝測試需求,業界目前主要採用極短高頻探針、PCR導電膠及同軸測試座等方案,但各自存在不同限制。極短高頻探針具備一定的高速訊號傳輸能力,但Socket針盤會因薄板設計導致強度不足;傳統導電膠具備低接觸電阻、錫球保護及成本優勢,但面對大型封裝與High Pin Count晶片時,較短接觸行程可能受限於晶片翹曲與錫球高度差異;而同軸測試座(Coaxial Socket)雖效能優異,但單價較高,在數千Pin甚至上萬 Pin的測試座應用中,導入成本可能大幅增加。

    岱鐠科技測試治具部營運處長陳威助補充:「傳統導電膠在高速測試中具備低接觸電阻與成本優勢,但面對晶片翹曲或錫球高度差異時,較難維持穩定接觸。UltraConduct™ 導電膠探針測試座,便是結合彈簧探針的大行程補償能力與導電膠的低電阻優勢,讓客戶能以更具成本效益的方式提升測試穩定性。」

    岱鐠科技將於2026年9月2日至4日 SEMICON Taiwan 展示 UltraConduct™及相關IC測試解決方案,誠摯邀請業界夥伴蒞臨台北南港展覽館1館 K2886攤位,深入了解最新晶片測試技術。


    關於岱鐠科技(DediProg Technology)
    岱鐠科技(DediProg)成立於2005年,是全球IC燒錄與測試解決方案的領導品牌,提供自動化燒錄設備、手動燒錄器、IC測試座及PCR導電膠等多元產品。秉持「以使用者為核心」的理念,岱鐠結合軟硬體整合能力與深厚技術經驗,協助客戶提升生產效率與產品可靠度。岱鐠科技服務據點遍佈全球,致力提供即時、高效且可靠的技術支援與服務。更多關於岱鐠資訊,請瀏覽:https://www.dediprog.com。


    歡迎聯繫我們了解更多資訊或申請測試樣品。
     


    產品介紹:

    UltraConduct™ 導電膠探針測試座
    UltraConduct™ 導電膠探針
     


    延伸閱讀:


    【產業知識】IC 測試介面怎麼選?導電膠 PCR vs. 彈簧探針Pogo Pin
    【案例分享】PCR導電膠助力車用晶片測試:提升良率、降低迴焊需求
    【案例分享】PCR 於高頻 RF 測試之客製化應用——SMA 接頭 Interposer
    【案例分享】導電膠取代高頻探針之應用案例——解決112Gbps PAM4高速測試挑戰
     

    聯絡我們


  Products

  • 導電膠 Pressure Conductive Silicone Rubber
    Pressure Conductive Silicone Rubber (PCR) is a common contact solution for IC testing. Characterized by low contact resistance, high current capacity, and a non-marring surface, PCR is an ideal choice for high-speed signal transmission....

  • 導電膠(Pressure Conductive Silicone Rubber, PCR)是IC封裝測試中常用的接觸元件,其運作原理在於將導電微粒均勻分散於矽膠基材中,透過施加壓力,即可促使內部微粒緊密接觸並形成低阻抗導電路徑,使其無需焊接即可在IC晶片與PCB之間建立穩定的電性連接。
    導電膠具有低電阻、耐大電流、無壓痕,及易於更換耗材等特性,尤其適用於高速訊號傳輸及 High Pin Count 測試需求。

    Pressure Conductive Silicone Rubber (PCR) is a common contact solution for IC package testing. It operates through a matrix of conductive particles uniformly dispersed within a silicone base. Under compression, these particles align to create a low-impedance path, establishing a stable electrical connection between the IC chip and the PCB without the need for soldering.
    Characterized by low contact resistance, high current capacity, and a non-marring surface, PCR is an ideal choice for high-speed signal transmission and high-pin-count applications.

    Learn more: https://www.dediprog.com/product/PCR

    DediProg PCR | Rapid Customization × MIT Quality × IC Industry DNA

    DediProg PCR Strengths

  • 老化測試座 Burn-in Socket
    DediProg's Burn-in Socket features a modular design that allows for the installation of a heatsink or ITC module according to testing needs, and includes thermal analysis for close evaluation....

  • DediProg的老化測試座(Burn-in Socket)採用模組化設計,可依測試需求安裝散熱器或ITC模組,並透過熱分析進行評估。內含高性能彈簧針,可提供穩定和廣溫域測試表現。針對高腳數測試,我們亦提供專利的省力結構,讓使用更加便捷。

    DediProg's Burn-in Socket features a modular design that allows for the installation of a heatsink or ITC module according to testing needs, and includes thermal analysis for close evaluation. It contains high-performance spring-loaded pins that provide stable testing performance across a wide temperature range. For high pin count testing, we also offer a patented labor-saving structure to enhance ease of use.
     

    Learn more: https://www.dediprog.com/product/Burn-in-Socket

  • PCR 掀蓋型測試治具 PCR Clamshell Socket
    The PCR Clamshell Socket delivers excellent high bandwidth and low resistance performance, making it especially suitable for engineering testing, programming, chip analysis, and other applications....

  • PCR Clamshell Socket掀蓋型測試治具,使用精密射出成型技術並結合高性能導電膠(PCR),提供低成本且高效能的測試解決方案。其卓越的高頻寬與低電阻特性,特別適用於工程測試、程式燒錄、晶片分析等應用。

    The PCR Clamshell Socket utilizes precision injection molding technology combined with Pressure Conductive Silicone Rubber (PCR), providing a cost-effective and high-performance testing solution. Its excellent high bandwidth and low resistance characteristics make it especially suitable for engineering testing, programming, chip analysis, and other applications. 

    Learn more: https://www.dediprog.com/product/PCR-Clamshell-Socket

  • DDR5模組測試座 DDR5 Module Test Socket
    As the transmitting speed for DDR5 SDRAM is upgraded, the DDR5 socket applies the Ultra-thin Pressure Conductive Silicone Rubber (PCR) to achieve excellent performance in high-speed signal transmitting (>6000MHz)....

  • 隨著DDR5 SDRAM 所需之傳輸速率提升,岱鐠採用超薄型導電膠(PCR),實現DDR5 模組測試座高速訊號傳輸(>6000MHz)之絕佳表現。SDRAM 晶片常見尺寸有9x11、9.5x11、10x11等不同的封裝尺寸,岱鐠提供快速更換的限位框設計,方便使用者能在最短的時間內完成更換。

    As the transmitting speed for DDR5 SDRAM is upgraded, the DDR5 socket applies the Ultra-thin Pressure Conductive Silicone Rubber (PCR) to achieve excellent performance in high-speed signal transmitting (>6000MHz).

    SDRAM's package is standard with a scale of 9x11, 9.5x11, and 10x11 mm. The DDR5 Socket is designed via an efficient limit frame, minimizing the replacement time via fast removal functions.

    Learn more: https://www.dediprog.com/product/DDR5-Module-Test-Socket

  • 最終測試座 Final Test Socket
    Final Test Sockets can be applied to various types of testing environments, including high-frequency, high-speed transmission, and wide-temperature range testing. The Pogo pin utilize special material technology, significantly improving the test yield....

  • Final Test Socket 採用高性能彈簧探針和工程塑膠,確保高頻寬、廣溫域以及高使用壽命之產品效能。客戶可以選擇雙扣旋鈕、掀蓋旋鈕或掀蓋壓塊類型的手測蓋。

    最終測試座可以根據晶片性能、封裝類型、測試環境進行客製化,適用於各種測試環境,包括高頻、高速傳輸和寬溫度範圍測試。彈簧針採用專門的材料技術,亦顯著提高了測試良率。

    The final test socket features high-performance pogo pins and durable engineering plastic, ensuring extensive bandwidth, a wide temperature range, and an extended product lifespan. You can choose a socket lid from the knob, double latch, or single latch types.

    The final test socket can be customized according to the chip performance, package type, and testing environment. This model is suitable for various testing environments, including high-frequency, high-speed transmission, and wide temperature range tests. The pogo pins use specialized material technology, significantly improving test yield. 

    Learn more: https://www.dediprog.com/zh-tw/product/Final-Test-Socket
     
  • UltraConduct™ Rubber Pin Socket 導電膠探針
    專為AI/HPC晶片打造的測試治具,採用PCR × Pogo Pin混合式結構,兼具優異的高頻高速訊號傳輸、錫球保護與翹曲補償能力。
    Designed for AI/HPC IC testing, combining PCR and Pogo Pin technology to provide high-speed signal performance, solder ball protection, and package warpage compensation.
    ...

  • UltraConduct™ 導電膠探針測試座是一款專為 AI/HPC 高頻高速晶片測試打造的新世代測試方案,採用 Pogo Pin 與導電膠 PCR(Pressure Conductive Silicone Rubber/Elastomer)混合結構,兼具低接觸電阻、高頻寬傳輸與錫球保護能力。透過大行程補償設計,可有效克服大型 BGA 封裝翹曲變形所造成的接觸不良問題,確保高階晶片測試所需的訊號完整性與長期可靠性。

    靈活的模組化設計可適用於研發階段的手動測試,或是產線量產的 ATE 自動化測試,並可依測試條件新增散熱模組。

    DediProg's UltraConduct™ Rubber Pin Socket is a next-generation test socket solution engineered for high-speed, high-frequency AI and HPC IC testing. Featuring a hybrid contact structure that combines Pogo Pins with Pressure Conductive Rubber (PCR), it delivers low contact resistance, exceptional signal integrity, wide bandwidth performance, and superior solder ball protection.

    Its long-stroke compliance design effectively compensates for package warpage commonly found in large BGA devices, ensuring stable electrical contact and reliable test performance for advanced ICs. 

    Featuring a modular design, the socket supports both manual engineering validation and high-volume ATE production testing. Optional thermal management modules can be integrated to meet demanding high-temperature testing requirements.

     

    Learn more: https://www.dediprog.com//product/rubber-pin-socket


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