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GAIN-TEK SEMICONDUCTOR MATERIAL CO., LTD.

新竹縣,  Taiwan
http://gtcsemi.com.tw/
  • Booth: I2006

Overview

Focus on the agency and manufacturing of main materials for semiconductor packaging and testing plants such as IC packaging carrier boards, test wafers , wafer frames , Thermal caps (BASF), etc. Sensofar signed the exclusive general agent in Taiwan to more comprehensively serve the precision measurement needs of the front, middle and backend of semiconductors. 


  Press Releases

  • S neox is a 3D optical profilometer that features multiple technologies for surface metrology in the same sensor head to provide areal measurements for surface texture, form, geometry, and general dimensional characterization.
    The profiler includes a 5Mpx camera to acquire high-resolution images and a patented optical design and technology that allows the use of a digital illuminator to illuminate the sample in different modes, including confocal, brightfield, HDR, and other focusing modes upon user choice. These illumination capabilities, in combination with the brightfield and interferometric lenses, transform it into a multi-technology system, integrating Confocal, Ai Focus Variation, and different Interferometry techniques (CSI, PSI, and ePSI). Additionally, the optional piezo scanner of the system allows for a 4th technology (Spectroscopic Reflectometry). All technology selections are controlled by the user through the acquisition software.
    Implementing such different measurement techniques in the same head and through the same optical path allows the maximum versatility required to measure any sample with no limitations regarding reflectivity, surface roughness, and geometry (undulation and shape). The generation of images and measurements through digital illumination takes place without any moving part inside the head, with great advantages in terms of robustness, reliability, and optical efficiency (there are no rotating pinhole disks and no galvanometric scanners).
    The profilometer is designed to provide traceable measurements. The graphical user interface contains a calibration environment, which offers calibration according to ISO 25178 for all operating modes, including Ai Focus Variation.
    In addition to topographic measurements down to the micro/nanoscale, the instrument allows the measurement of the thickness of transparent and semi-transparent layers, with thickness >1.5 μm in full field and, with the appropriate option, from 50 nm to 1.5 μm on a single point, in the center of the imaged field of view.
    The system can be purchased in different configurations to account for different user requirements in terms of sample size, weight, or measurement accuracy. These configurations include different possible XY stages, a piezoelectric Z stage, an isolation table, a ring light accessory, and a Differential Interference Contrast (DIC) module. The system is prepared for upgrades, like the possibility of integrating a rotational module and obtaining the 5-axis system for expanded measurement possibilities.
    The equipment comes with proprietary acquisition software and data analysis software. Optional software for quality control purposes, advanced analysis features, remote control, or software customization are also available.

  Products


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