SE Technologies Corp.

Hsin-Chu,  Taiwan
http://www.se-group.com

• Booth: K2043

Welcome to Hall 1 , 1 F, K2043 SE TECHNOLOGIES CORP.

Overview

Advanced equipment, Timely Support

Originated from engineers, seeing test requirements from an engineer's perspective~~

SE strives to provide customers with more complete advanced equipment and professional services .

About SE 

Founded on Jan. 1st, 1993, SE originated from engineers and understands the needs of engineers.

From RF/Microwave, Semiconductors, High Precision Electronics, and Opto-Electronics torecent MEMS and Nano Technologies, SE introduces the world's leading solutions to the Greater China area engineers.Finding the best tools to help engineers become successful has been SE's mission and honor for 30 years. SE Technologies isthe world's leading solution provider in the fields of RF/Microwave, Semiconductors, Optoelectronics and Electronics. 

SE Provision

■  Wafer-level high-precision probe station and related peripheral devices

■  Micro-nano pitch probe, probe card, locator (probe holder)

■  PCB signal integrity test and high-frequency probe

■  ESD electrostatic discharge test equipment

■   Advanced channel simulator (simulator)

■  Ground and satellite wireless system RF link analogy

■  RF/microwave test fixture, PCB test fixture

HsinChu

   TEL：+886-3-579-9029               FAX：+886-3-579-9030

   Mail：[email protected]

  Press Releases

• Semiconductor Test Probe Station (May 15, 2026)

  Semiconductor Test probe station

  Manual & Semi-automatic, 4/6/8/12 inch Precision DC/RF Probe Station

  Application

  ■ Wafer & chip level probing with precision positioning

  ■ Power and wide-bandgap device probing

  ■ Optoelectronic & optical communication chips / RF & millimeter-wave devices

  ■ Chip / Package / Module measurement

  Test Project

  ■ DC parameters, high-frequency parameters

  ■ High voltage & high current test, IV / CV measurement

  ■ Load pull, noise parameter testing

  ■ Failure analysis, reliability testing

  Features

  ■ Temperature Range: -65℃ ~ 600℃

  ■ Low leakage: fA level

  ■ Frequency Range: DC ~ Terahertz

  ■ Nano-resolution probe mount

  Professional probe station equipment supplier

  Contact SE TECHNOLOGIES CORP.  

     Mail：[email protected]

• Resistivity Measurement System (May 15, 2026)

  Four-Point Probe Resistivity Measurement System

  Measuring Items:

  ■ Sheet Resistance

  ■ Film Thickness

  ■ Resistivity

  ■ Temperature Coefficient of Resistance (TCR)

  ■ Van der Pauw Four-Point Measurement

  System Features

  ■ Manual, semi-automatic and automatic positioning measurement

  ■ Optional measurement range: 1μΩ ~ 10GΩ

  ■ Optional temperature range: Room temperature ~ 600℃

  ■ Display of 2D and 3D resistance distribution maps

  ■ Standard TCR test with Kelvin probes or probe cards

  ■ Optional with various types of four-point probe heads

  More Product Information

  Welcome to contact us by phone or email for further inquiries.

  Email: [email protected]

• 2D Transistor Characterization with Micro-Four Point Probe Test System (May 15, 2026)

  Rapidly measure transistor behavior of 2D materials  without device fabrication

  Purpose:

  No device fabrication required; enables rapid characterization of transistor properties for 2D materials.

  With Xallent’s 10 µm pitch four-point probe contacting the thin film, it measures I-V characteristics, Kelvin resistance, sheet resistance, and field-effect transistor (FET) characteristics.

  It completely bypasses the traditional sample preparation process.

  Reduce R&D costs while accelerating time-to-market of new advanced materials and devices

  Combining with the Xallent SAKYIWA NanoProbe,

  Four probes can perform rapid electrical testing at the micrometer and nanometer levels on thin, patterned, and unpatterned wafers

  Product Details ~ Welcome to inquire by phone or email.

  SE Technologies,  See Your Needs！

   [email protected]

• Signal Integrity/ Power Integrity & Microwave Probes (May 15, 2026)

  Signal Integrity/ Power Integrity

  Large, medium, and small test boards,Measurement on testing fixtures, connectors, and device packaging

  ■ High speed connectors, transmission lines

  ■ Various types of circuit boards

       -Flat, upright, motherboard, daughter board, mother and child board

       - 2D, 3D board, orthogonal board

  ■ Chip Packaging - Inverted Chip, BGA Packaging

  ■ Multi sided and three-dimensional detection, measuring 180 degree rotation from top to bottom

  Welcome to inquire by mail /phone

   [email protected]        +886-3-579-9029

• Test Socket/Test Fixture Solution (May 18, 2026)

  Robson Technologies, Inc. (RTI) designs and provides custom test solutions for the semiconductor and high-tech industries.

  RTI designs and builds test communication interfaces for small devices such as BGA, LGA, QFN, QFP, WLCSP, CSP, and bare dies.

  It offers a wide variety of test communication interfaces to support user-specified test applications, including ATE, burn-in, characterization, device programming, fault analysis, production testing, and more.

  ■ Extremely fine pitch: ≤0.3mm

  ■ Temperature range: -45°C to +140°C, device pin count >3700 pins

  ■ General purpose array IC test fixture

  ■ CSP, WLCSP, BGA, PGA, QFN, TSSOP, SOIC....

  ■ Bare die, flip chip, lead frame, multi-chip module (MCM), MEMs device....

  Contact SE

  HsinChu

     TEL：+886-3-579-9029

     FAX：+886-3-579-9030

     Mail：[email protected]

  Products