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Smiths Interconnect

Singapore,  Singapore
http://www.smithsinterconnect.com
  • Booth: K2054

Welcome to our booth K2054 for advanced test solutions

Overview

Smiths Interconnect is a Molex company, a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage.

Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level
and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with
very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.

Smiths Interconnect is part of Molex, which combined, includes over 90 plants across 22 countries with a global headcount to over 55,000 employees.


  Press Releases

  • Smiths Interconnect, a Molex company, announces its top performing distributors in 2025. The Distribution Awards program honors distributors which have made a meaningful impact on the growth of Smiths Interconnect across its three key regions: the Americas, EMEA, and Asia.

    Award recipients in each region are selected based on their outstanding performance compared to the previous fiscal year and on outstanding local service and support. This year, the strong commitment and dedication shown by our distributors worldwide have resulted in a larger group of recognized companies. Seven distributors in total have been distinguished for their exceptional achievements.

    Americas
    In the Americas, FDH Electronic Products Group, LLC. has been named Distributor of the Year for the second consecutive year.
    This recognition reflects FDH’s outstanding performance, strong partnership, and unwavering commitment to delivering exceptional service and support to our customers.
    Over the past year, FDH achieved impressive sales growth, demonstrating not only market strength but also a deep dedication to driving our mutual success.
    Their ability to navigate challenges, adapt quickly, and maintain focus on execution has been instrumental in delivering consistent results and strengthening our partnership.

    The second distributor recognized in the Americas as Highly Commended Distributor for Business Growth 2025 is Arrow Electronics.
    Through a focused and strategic customer approach, Arrow has delivered impressive business growth, reinforcing their position in driving market expansion and customer engagement.
    Arrow’s commitment to collaboration, responsiveness, and execution has played an important role in achieving these results.
    Their team has consistently demonstrated the ability to identify opportunities, adapt to evolving customer needs, and deliver value across our joint initiatives.

    EMEA
    In the EMEA region, Smiths Interconnect has recognized two distinct distributors for their outstanding growth throughout the year.
    RFMW Ltd is recognised for delivering the strongest growth in 2025 across our RF component product lines, reflecting exceptional commercial execution and deep customer engagement.
    Their results in key South European territories were achieved through a close, collaborative partnership that enabled both organisations to navigate a highly competitive landscape effectively.
    RFMW consistently converted design activity into revenue while expanding presence in our target markets, demonstrating a shared commitment to technical excellence, partnership, and sustained value creation.

    For the Connectors product line, the top performing distributor was Heilind Electronics GmbH, which supported sales growth with a strong focus on the DAC countries.
    This success was also driven by well-managed inventory levels, enabling fast deliveries and reliable local support for customers.

    Asia
    Last but not least, Asia was one of the most active areas from a distribution standpoint.
    Three key distributors were appointed: Fusoh Shoji Co., Ltd, Bizmile Co. Ltd, and Conn-Tek Electronics Inc.

    • Fusoh Shoji Co., Ltd: Fusoh Shoji Co.,Ltd was named Distributor of the Year 2025 for Fiber Optic and Components product lines. Fusoh has demonstrated outstanding performance in expanding these product lines in Japan, playing a key role in strengthening its market presence and supporting a solid foundation for future growth.

    • Bizmile Co. Ltd: Bizmile Co. Ltd was named Distributor of the Year 2025 for the Connectors product line.Bizmile has been awarded for its outstanding contribution to business growth, design-in excellence, and value delivery in Korea. The company demonstrated exceptional support to key accounts, driving significant growth through strong inventory commitment and strategic project support. Bizmile also excelled in design-in activities, successfully contributing to major defense programs, while consistently delivering measurable value to customers. Its strength in commercial execution, strategic account development, and ecosystem-driven approach has enabled sustained growth, improved profitability, and strong future demand visibility.

    • Conn-Tek Electronics Inc: Conn-Tek Electronics Inc was named Distributor of the Year 2025 for the Semiconductor Test product line for the second consecutive year. Conn-Tek has been awarded in recognition of its exceptional performance across business growth, design-in excellence, and strategic market development. The company achieved remarkable revenue growth in both China and international markets, while demonstrating strong leadership in design-in activities with key customers. Conn-Tek also experienced significant expansion in high-value product segments with DaVinci coaxial test socket and successfully penetrated new customer markets.Its design-led, partnership-driven approach has delivered sustained growth, improved profitability, and enhanced strategic value across the Asia region.

  • Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance computing and artificial intelligence semiconductor chips.

    This strategic contract supports the customer’s upcoming global launch of their next-generation AI semiconductor chips, designed for data centre GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.

    Smiths Interconnect’s DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect’s test socket technology.

    The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer’s previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect’s position as a trusted technology partner in the semiconductor industry.

    Brian Mitchell, Vice President of Smiths Interconnect’s semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."

    Smiths Interconnect’s test sockets play a critical role in testing semiconductor chips, otherwise known as ‘AI chips’, which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks. 

    As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown — and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.


  Products

  • Array High Speed Test - DaVinci Micro Test Socket
    DaVinci Micro fully shielded signal path negates the effects of cross-talk during test, allowing an immediate yield enhancement over non-DaVinci products....

  • Features

    • Spring probe technology using homogenous alloy ​
    • Short signal path 2.85 mm Test Height ​
    • Impedance tuning, can match system or defined as needed, 40, 45, 50 Ohm impedance (single ended)  ​
    • Cross-talk suppression IM housing  ​
    • Tri-temp socket design to support -40 °C to +125 °C​
    • Consistent stable contact resistance 120 mΩ (Ave)​
    • Designed for manual test, bench test, and HVM Production Test using the same socket ​
    • Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm​
    • Floating base or Hi Low configuration to protect spring probes during use

    Benefits

    • Tested to 500K
    • Short contact path for excellent DC performance​
    • RF Bandwidth up to 30 GHz @ -1dB IL ​
    • Reduction in pin-to-pin noise (cross-talk)  ​
    • Precision-machined socket housing ensures robust mechanical performance  ​
    • Field repairable, replace a single probe or full array without the need for additional training ​
    • Patented Insulated Metal socket housing for optimal signal integrity performance and strength ​
    • Match existing PCB socket footprint and test hardware led to cost-saving for customers

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