筑波科技股份有限公司

TherMap is an advanced opto-thermal metrology platform designed to tackle thermal bottlenecks in heterogeneous integration and advanced packaging (AI/HPC, SiPh, GaN/SiC). By leveraging transient pump-probe laser techniques, Time-Domain (TDTR) and Frequency-Domain (FDTR) Thermoreflectance, TherMap delivers precise, non-destructive measurements across complex multi-layer stacks.

Key Features & Capabilities:

• Multi-Layer Thermal Characterization: Measures thermal conductivity, diffusivity, and boundary resistance from 100 nm to millimeter depths.
• Layer & Interface Decoupling: Decouples thermal properties of buried layers and bonded interfaces.
• Defect Inspection: Detects buried voids, delaminations, and thermal anomalies in die attach layers and microbumps.
• High-Fidelity Simulations: Provides accurate physical data to feed thermal simulations, accelerating R&D and predicting chip thermal behavior prior to mass manufacturing.

QFI is the industry-leading multi-technique microscope platform for non-contact temperature measurement, reliability, and semiconductor failure analysis (FA), optimized for advanced devices and high-power Ultra Wide Band-Gap (UWBG) materials (GaN/SiC). Key Features & Capabilities: • InfraScope™ Temperature Mapping: Delivers true 2D emissivity-corrected IR temperature maps (2 µm spatial resolution) and high-speed transient IR for hot spot detection and dynamic thermal analysis. • QuantumScope™ All-in-One FA: Integrates emmi™ Photoemission Microscopy (320 nm–1,900 nm), XIVA™ LSIM ohmic defect detection (up to 3 kV capability), and Thermal-HS lock-in thermography on a single system. • Multi-Modal Characterization: Features Thermoreflectance (250 nm resolution) and Raman temperature point measurement (0.5 µm spot size). Direct sensor-to-lens turret couples NIR, Visible, and MWIR lenses for maximum throughput. • Partner Synergy: Combines with TherMap Solutions for full 3D thermal profiling.

The TZ-Series utilizes advanced Terahertz (THz) time-domain and frequency-domain technologies to deliver non-destructive, non-contact inspection solutions for advanced semiconductor manufacturing and packaging.

Key Features & Capabilities:

• Non-Destructive 3D NDT: Penetrates internal structures to detect hidden voids, delaminations, and structural anomalies in sub-surface layers. 
• Material & Thin-Film Characterization: Accurately analyzes wafer thickness, dielectric properties, and multi-layer material consistency. 
• Advanced Packaging Integrity: Supports non-invasive quality verification for complex heterogeneous integration, interposers, and IC substrates. 
• Fast & Non-Contact Workflow: Ensures accurate measurements without sample preparation, improving yield and accelerating failure analysis (FA).

EOTPR (Electro-Optical Pulse Reflectometry) is a high-precision failure analysis (FA) system specifically designed for sub-micron fault localization in next-generation advanced packaging architectures, including 2.5D/3D ICs, TSVs, and flip-chips.

Key Features & Capabilities: 

• Sub-Micron Fault Localization: Pinpoints open/short circuits, microcrack anomalies, and high-resistance faults with micrometer-level accuracy. 
• Non-Destructive Analysis: Allows precise internal interconnect testing without physical cross-sectioning or damaging the DUT. 
• High Temporal Resolution: Enables accurate impedance profiling across long trace lengths and complex multi-die stackings. 

The 1.6T test solution by ACE Systemtek and Nexustest integrates a BERT, DCA, and CDR. It meets cutting-edge 1.6T development demands and flexibly supports 800G/400G applications, comprehensively satisfying test requirements from R&D to production.
 

Key Features & Capabilities: 

• High-Speed BER Analysis: Supports 8×224G BER testing with ms-level transient capabilities to capture burst errors, plus comprehensive PCS/RS-FEC pre/post BER analysis.
• Electro-Optical Integration: Seamlessly coordinates the 1.6T BERT (PBT3058), 65GHz DCA (DCA1065), and 120GBaud CRU (CR3302) into a complete 1.6T measurement chain.
• Flexible MCB & Cooling: Pairs with direct-plug OSFP/QSFP-DD MCBs with built-in water cooling, effectively reducing hardware integration and heat dissipation costs.

Teradyne ETS is a premier high-performance test platform specifically architected for compound semiconductors (GaN, SiC), power discrete devices, power modules, and mixed-signal PMICs. Leveraging ACE Solution’s custom test fixture integration and turnkey application engineering, it delivers exceptional test throughput and reliability from wafer sort to final package test. 

Key Features & Capabilities: 

• High-Voltage & High-Current Capability: Delivers high-power pulsing and precision multi-quadrant V/I sourcing for next-generation wide band-gap power devices. 
• True Mixed-Signal Architecture: Combines high-speed digital, precision analog, and high-power instrumentation on a flexible, scalable matrix. 
• Comprehensive FT & FA Testing: Enables rapid dynamic switching, static Rds(on), breakdown voltage, and thermal stress characterization for automotive and industrial ICs.