The best valued company which leads the future.
Overview
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide.
We currently hold the No.1 global market share in the TC BONDER market for HBM, a core component of AI semiconductor, and have also maintained the No.1 global position for 23 consecutive years in micro SAW & VISION PLACEMENT (mSVP), which are essential back-end semiconductor equipment.
Headquartered in Incheon, South Korea, and operating a total of seven manufacturing plants, HANMI Semiconductor sustains its competitive edge through a fully vertically integrated manufacturing system that connects the entire value chain-from iron casting production, design, parts processing, software, assembly and inspection, through to distribution and sales.
The product and service offering is as follows:
1. HBM TC BONDER
2. 2.5D TC BONDER 120
3. 2.5D TC BONDER 40 C2S
4. 2.5D TC BONDER 40 C2W
5. FC BONDER 75
6. VISION PLACEMENT
7. micro SAW
8. EMI SHIELD
9. META GRINDER
10. LASER