辛耘企業股份有限公司

Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 5nm IC design rules and beyond.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide.

For more detail, please refer to http://www.scientech.com.tw

Our Mission：

•  Minimum Removal Rate
•  Maximum Return Rate
•  Minimum Return Time
•  Robust Quality System
•  Accurate Tracing System
•  Quick Respond System

辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有高達 5,000平方公尺的現代化生產製造廠房，並配備Class 10等級無塵室，全力為客戶打造最完善的機台及製程驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用，應用領域包括:

Single Wafer單晶片式濕製程設備 ( Polar Series ):

• Applications :

• Semiconductor FEOL & BEOL, Wafer Reclaim, Mask Shop
• 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics, CoWoS, SoIC, Heterogeneous Integration
• Compound SEMI : SiC / GaN / GaAs / InP / ...

• Process:

• Etch : UBM, Solder, Metal, Oxide, Immersion & Spin Etch
• Clean : Pre-Clean, Post-Clean, Final-Clean , Polymer Removal, Scrubber, Flux Clean, Frame Clean, Mask Clean, Ozone Clean
• Stripper : PR Stripper (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)

Wet Bench批次式濕製程設備 ( WSE Series):

• Applications :

• Semiconductor FEOL & BEOL, Wafer Reclaim, Mask Shop
• 2.5D/3D IC, Advanced packaging, Bumping, Si Photonics, CoWoS, SoIC, Heterogeneous Integration
• Compound SEMI : SiC / GaN / GaAs / InP / ...
• MEMS
• LED / mini LED / micro LED

• Process :

• Etch : Metal, Oxide, Nitride
• Clean : Pre-Clean, Post-Clean, Middle-Clean, Flux Clean, Ozone Clean.
• Stripper : PR/PI Stripper (EKC, IPA, NMP, SPM, DMSO, Non-DMSO,..)
• Plating: Electro-less plate (Zn/Ni/Pd/Au)

辛耘公司的特色：

客製化軟硬體設計服務

專業與快速的售後服務

安全設計兼具簡易操作

主動協助客戶快速量產

辛耘企業自2015 年起開始投入玻璃解離層塗佈設備(Release Layer Coater)的研發與製造，可為晶圓薄化(Wafer Thinning)、BGBM (Backside Grinding & Backside Metallization)及半導體先進封裝製程中的玻璃解離層塗佈提供解決方案，已深獲國內晶圓代工與封測大廠的廣泛採用與肯定。

辛耘目前擁有達5,000平方公尺的現代化生產製造廠房，並配備Class 10等級無塵室，全力為客戶提供最完善的機台與製程驗證平台。

• Applications :

• 2.5D/3D IC, Advanced packaging, Fan Out, CoWoS, Heterogeneous Integration
• Wafer Thinning Process (IGBT, Power Device…)
• BGBM (Back-Side Grinding and Back-side Metallization) Process

• Process:

• Release Layer Formation

辛耘公司的特色：​​​

客製化軟硬體設計服務

專業與快速的售後服務

安全設計兼具簡易遭做

主動協助客戶快速量產

亞亞科技(YAYATECH)致力於半導體先進封裝之自動化光學檢測設備研發與製造，其設備已廣泛應用於國內外晶圓廠及先進封裝廠(OSAT)。

在面對AI晶片時代Chiplet異質整合與HBM垂直堆疊所帶來之良率挑戰，本公司因應市場需求，研發出缺陷檢測系統，例如Post-Dicing Wafer IR 檢測系統(型號：DSI-3000T)，此系統突破傳統AOI無法穿透切割膠帶之根本盲區，為先進封裝產線提供非接觸式、高效能之產品內部缺陷檢測解決方案。如下為缺陷檢測系統解決方案設備

1）Post-Dicing Wafer IR檢測系統：

應用：

• Advanced Packaging, Heterogeneous Packaging, WLCSP
• Post-Dicing Inspection for 12-inch Wafer on Dicing Tape & Metal Frame

檢測能力：

• Chipping Detection: Die Edge Crack / Corner Break
• Crack Detection: Micro-crack / Sub-surface Crack
• Residue Detection: Tape Residue / Particle Contamination

2）Reel IR 檢測系統：

應用：

• Wafer Level Chip Scale Packaging (WLCSP)
• FanOut Packaging

檢測能力：

• Penetrate Tape Inspection
• AI Review 自動分類判圖

3）Strip/Tray/PKG IR 檢測系統：

應用：

• Heterogeneous Packaging, SiP (System in Package)
• Strip / Tray 包裝之封裝體缺陷檢測

檢測能力：

• Defect Mapping
• AI Review 自動分類判圖

Mask / Reticle

Mask Dry Etcher, CD / Overlay Metrology, Defect Inspection, E-beam Writer, Reticle Cassette

Lithography Process

Stepper, Coater / Developer, Mercury Lamp / Nanoimprint Lithography (NIL)

Etch Process

Dry Etcher, Plasma Cleaning / Descum, End Point Detection

Thin Film & Plating Process

Electro-Plating System, PECVD, PVD, CVD, IBD, CMP, Pulsed Laser Deposition

Diffusion & Thermal Process

High Pressure Annealing Systems, RTP

Metrology & Inspection

Optical / Stylus Profiler, Standards, 3D X-Ray Microscopy, Isolation Systems, Stress Meter, CD / Overlay Metrology, Defect inspection, 2D/3D AOI

Back-end Process

Ball Mounter, Reflow, EMI Tape, SMT Scope, Paste & Sheet, 2D/3D AOI, Baking Oven, Plasma Clean & Descum ESD Solution, Solution for Silicon Photonic

Sub-Systems & Others

Laser Marker, Power Supply, RF Generator, Robot, EFEM, Pressure Sensor, Valves, Metal Cassette, Magazine, KVM, ESD Solution, Optical Filter, O2 Analyzer, Power Conditioner, Motor, Linear Rail System, Encoder

Flat Panel Display

Dry Etch, PECVD, Annealing Furnace, PI Curing Furnace, PVD, Mask / Cassette Cleaner, Optical / Stylus Profiler, AP Plasma Clean, PVD Sputter, Dry Etcher, PI curing

Panel Level Package

Dry Etcher, Plasma Cleaning / Descum , Dip Coater ,Laminator , Oven , PVD Sputter , PI curing, Pressure Sensors, X-ray inspection

Analytical Inst.

Particle Sizer, Pre-Treatment, Element Analyzer