Loading...

廣化科技股份有限公司

新豐鄉,  新竹縣 
Taiwan
http://www.sss-tech.com.tw
  • Booth: M1154

啟動無限可能

Overview

廣化科技總部位於台灣新竹，成立於1998年，實收資本額1,300萬美元。我們擁有一支120人的專業團隊，致力於為功率模組(power modules)及晶圓級封裝(Wafer-Level Packages)提供智能系統、解決方案與一流服務。

藉由提供全方位的可靠系統，包含真空回焊爐(Vacuum Reflow Ovens)、甲酸真空回焊爐(Formic Acid Vacuum Reflow Ovens)，以及針對多元封裝製程量身打造的整合式解決方案，協助客戶在追求極低氣泡率與可靠度的同時，亦能達成產能最大化與綠色製程的環保目標。

深獲業界領導企業信賴，廣化科技致力於成為全球客戶的可靠夥伴，服務對象涵蓋IDM、OSAT、EMS及Fabless大廠;憑藉遍及全球的服務網絡與在地專業團隊，我們能及時回應客戶需求，確保生產效率穩定並協同客戶共創技術高峰。

#領航半導體封裝，定義產業未來

  Press Releases

  • This prestigious recognition from the SBIR Program (driven by Taiwan's Ministry of Economic Affairs) highlights the outstanding innovation of our technology.

    At 3S, we tackle the demanding needs of high-end Automotive IGBT Modules through our core strategies: "Open Lab" and "Agile Response." We utilize a proprietary technological blend to set a new industry standard:

    ✅ High-Efficiency Heat Transfer for superior thermal control.
    ✅ Achieves an ultra-low soldering joint void rate of less than 1% for maximum reliability.
    ✅ Replaces traditional flux with pure formic acid gas to ensure a Clean Process (Flux-Free), fully aligning with international ESG trends. 🌎

    The support from SBIR fuels our mission. We are not just participating in the future of green manufacturing—we are creating it, delivering unmatched efficiency and quality to the industry. Let's build the future together!

    這份來自 SBIR 經濟部創新研發計畫 的專業肯定，高度彰顯了我們在技術上的卓越創新。

    在廣化科技，我們透過「開放實驗室 (Open Lab)」與「敏捷回應 (Agile Response)」兩大核心策略，直擊高階車用 IGBT 模組的嚴苛需求。運用獨家技術優勢，為產業樹立了全新標竿：

    ✅ 高效熱傳導：實現卓越的熱溫控精準度。

    ✅ 極致低氣泡率：達成小於 1% 的焊接氣泡率，確保最高等級的產品可靠度。

    ✅ 無助焊劑製程 (Flux-Free)：以純甲酸氣體完全取代傳統助焊劑，完美契合國際 ESG 綠色環保趨勢。🌎

    SBIR 的支持賦予我們更強大的動力。廣化科技不僅是綠色未來的參與者，更是創造者。我們將持續為產業提供無與倫比的效率與品質，讓我們攜手共創未來！

  • To fulfill our corporate responsibility and commitment to environmental governance, 3S Silicon Tech has officially completed the 2024 Greenhouse Gas (GHG) Inventory Report. This report covers the accounting of emissions within our operational boundaries and has been compiled and verified in accordance with the ISO 14064 international standard.

    The results of this inventory will serve as a foundation for formulating our carbon reduction action plans and tracking our carbon footprint, as we continue to move toward low-carbon manufacturing and a greener supply chain.

    We sincerely thank all our colleagues and partners for their support and participation. Let us continue working together toward a more sustainable future!

    為落實企業永續責任與環境治理，廣化科技正式完成2024年碳盤查報告，內容涵蓋公司營運範圍內的溫室氣體排放盤點結果，並依據 ISO 14064 國際標準進行編製與查驗。

    透過此次碳盤查，我們將作為制定減碳行動計畫與追蹤碳足跡的重要依據，持續邁向低碳製造與綠色供應鏈的目標。

    感謝所有同仁與夥伴的支持與參與，讓我們共同朝向永續未來邁進！

  • A heartfelt thank-you to our valued partner, SHUNKAWA, for their outstanding support and meticulous preparation, which made our participation at SEMICON Japan 2025 a tremendous success.

    It was rewarding to receive significant interest in specialized Formic Acid Vacuum Reflow Oven. We are proud to demonstrate how our solutions for void reduction directly address the critical reliability challenges faced by our customers today.

    To all the customers and partners who visited our booth, thank you for your continuous support and inspiring enthusiasm. We look forward to pushing the boundaries of technology and shaping the future of semiconductor packaging together!

    我們衷心感謝合作夥伴 SHUNKAWA 的卓越支持與精心籌備，因為有你們的鼎力相助，讓我們在 2025 年日本國際半導體展（SEMICON Japan 2025）取得了圓滿成功。

    在此次展覽中，我們的甲酸真空迴焊爐 (Formic Acid Vacuum Reflow Oven) 獲得了業界的高度關注與迴響。我們深感自豪，能向全球客戶展示我們的「降低氣泡率（Void Reduction）」解決方案，如何直接應對當前半導體製程中對於可靠性的嚴苛挑戰。

    感謝所有蒞臨展位的客戶與夥伴，您的持續支持與對技術的熱忱深深激勵著我們。我們期待能不斷突破技術疆界，與各位攜手形塑半導體封裝的未來！

  • Thank You for Joining Us at the Material Innovation Symposium!
    What an incredible day at the Material Innovation Symposium on Advanced Packaging! 🎉

    We truly appreciate the enthusiasm for our Formic Acid Vacuum Reflow Oven and Vacuum Reflow Oven—your curiosity and engagement at the 3S booth made this event even more exciting!
    A special thanks to Indium for hosting this insightful event, and to Musashi and Kyzen for their support as co-organizers.
    Beyond sharing our insights on optimization and analysis of the semiconductor reflow process, we were thrilled to exchange ideas with industry experts on:
    - Materials for semiconductor packaging, heterogeneous integration, thermal management, and power electronics
    - Market trends in advanced packaging
    Let's keep driving innovation in material science together! 🚀 See you at the next industry event!
    3S MaterialInnovation SemiconductorTechnology TechSymposium MaterialScience

    感謝您參與本次2025的研討會！

    🌟 這是一場精彩絕倫的盛會！在研討會上，我們見證了滿滿的熱情與專業交流！🎉

    感謝大家對 3S 甲酸真空迴焊爐與真空迴焊爐的關注與討論，您們的熱情參與讓這次活動更加精彩！

    特別感謝Indium舉辦這場深具洞見的研討會，也感謝 Musashi 與 Kyzen 共同協辦，給予大力支持。

    除了分享我們在半導體迴焊製程優化與分析方面的見解，我們也很榮幸能與業界專家交流以下關鍵議題：

    • 半導體封裝材料、異質整合、熱管理與功率電子
    • 先進封裝市場趨勢

    讓我們攜手推動材料科學創新，共同迎向未來！🚀 期待在下次產業盛會與您相見！

    #3S #MaterialInnovation #SemiconductorTechnology #TechSymposium #MaterialScience

  Products

  • Stencil Printer/錫膏網印機
    High-throughput solder printing/針對高產能錫膏印刷設計

    ...

    • Capability
    1. Accuracy: ±50um
    2. Printing area: 200*300mm

    • Features
    1. Leadframe/stencil position auto alignment
    2. Multiple strip feeding with auto stencil cleaning
    3. Auto solder replenishment
    4. Solder paste inspection (position and uniformity)
    5. 2D&3D inspection

    • 性能
    1. 印刷位置精度: ±50um
    2. 印刷面積: 200*300mm

    • 特點
    1. 導線架/網版位置自動對位
    2. 多料片同時工作並可自動清潔網版
    3. 自動焊錫補充
    4. 錫膏印刷後檢測(位置與均勻性)
    5. 2D與3D檢測
  • Die Attach/固晶機
    High reliability power device bonding/針對高品質功率器件焊接而設計...

    • Capability
    1. Cycle time: <250 ms
    2. Accuracy: ±25um
    3. Die rotation: <1°

    • Features
    1. Pre/post bonding system
    2. Leadframe 300*100mm
    3. 6~12 inches wafer
    4. Flip chip bonding (optional)
    5. Wafer/strip mapping

    • 性能
    1. 循環時間:<250ms
    2. 精度:±25um
    3. 晶片旋轉: <1°

    • 特點
    1. 晶片放置前/後檢查
    2. 導線架工作範圍300*100mm
    3. 6~12吋晶圓
    4. 翻轉晶片(選配)
    5. 晶圓/生產履歷紀錄
  • Clip Attach/跳線撿放機
    Low Rds on interconnection/專為低Rds(on)導通阻抗互聯而設計...

    • Capability
    1. High throughput: 1~40 clips per punch
    2. Accuracy: ±50um
    3. Clip thickness: 0.15~1mm
    4. Multiple clip handling

    • Features
    1. Pre and post bonding inspection
    2. Strip mapping
    3. Post inspection for clip interconnecting

    • 性能
    1. 高生產量: 每次可沖切1至40個跳線
    2. 精度: ±50um
    3. 跳線厚度: 0.15至1mm
    4. 多跳線處理

    • 特點
    1. 晶片放置前/後檢查
    2. 生產履歷紀錄
    3. 跳線放置後檢查
  • Vacuum Reflow Oven/真空回焊爐
    Void-free soldering/最低氣泡率的最佳解...

    • Capability
    1. 36sec/cycle
    2. Void rate<2%

    • Features
    1. Conductive heating
    2. Maximum size of working area: 300x200 mm
    3. Carrier boat system (optional)
    4. Flux filter system

    • 性能
    1. 36秒-循環
    2. 氣泡率低於2%

    • 特點
    1. 接觸式加熱
    2. 最大工作區域尺寸: 300x200 mm
    3. 焊接乘載盤循環系統(選配)
    4. 焊油過濾系統
  • Formic Acid Vacuum Reflow Oven/甲酸真空回焊爐
    Flux-Free soldering/專為無助焊劑焊接工藝而設計
    GREEN X SAFE X INTELLIGENT/ 綠能X安全X智能...

    • Capability
    1. 45~180 secs/strip
    2. Void rate ≦2%
    3. Maximum size of working area: 300x400 mm
    4. 50 mm product height

    • Features
    1. Primarily conductive heating, supplemented by convention heating
    2. Formic acid exhaust gas catalytic treatment system
    3. safety design (FA, CO) detection / protection
    4. Carrier cycle system (optional)
    5. Oxygen meter (optional)
    6. Profile meter (optional)

    • 性能
    1. 每片45-180秒
    2. 氣泡率低於2%
    3. 最大工作區域尺寸: 300x400 mm
    4. 50mm產品高度

    • 特點
    1. 主要採接觸式加熱，輔以對流加熱
    2. 甲酸尾氣觸媒處理系統
    3. 安全設計(FA, CO)偵測/保護
    4. 載具循環系統(選配)
    5. 氧氣量測儀(選配)
    6. 溫度量測儀(選配)

產品種類

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Package Handling; Conveying Equipment
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Mount; Taping Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating

    • Send Email

    Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined