宏崴實業有限公司

Honway Materials specializes in high-performance Diamond Slurries engineered for the most demanding semiconductor applications. Utilizing premium polycrystalline or monocrystalline diamond particles, our slurries deliver exceptional material removal rates and superior surface finishes on ultra-hard substrates, such as Silicon Carbide (SiC), Gallium Nitride (GaN), and Sapphire.

Our advanced formulations feature optimized dispersants that prevent particle agglomeration, ensuring consistent abrasive distribution and minimizing "killer scratches." As a total solution provider, Honway tailors diamond grit sizes and chemical carriers to match specific customer requirements, helping to achieve Angstrom-level roughness while maximizing yield. Whether for wafer thinning or precision lapping, our diamond slurries provide the stability and efficiency needed to reduce Total Cost of Ownership (TCO) in next-generation power electronics and RF device manufacturing.

Honway Materials specializes in high-performance Diamond Substrates engineered for advanced thermal management in high-power semiconductor devices. As the industry moves toward higher power densities, synthetic diamond—boasting the highest known thermal conductivity (up to 1200~1800 W/mK)—has become the ultimate solution for heat dissipation in next-generation electronics.

Our Diamond Substrates are critical for GaN-on-Diamond transistors, High-Power RF devices, and High-Performance Computing (HPC). By integrating diamond heat spreaders near critical "hotspots," our solutions significantly reduce junction temperatures, preventing thermal throttling and extending device reliability. This is particularly vital for 5G/6G infrastructure, satellite communications, and Electric Vehicle (EV) power modules.

Honway Materials offers premium Diamond Wafer Grinding Wheels specifically engineered for high-precision thinning and back-grinding processes in the semiconductor industry. As wafers become thinner to support 3D packaging and compact device designs, our grinding wheels provide the mechanical stability and cutting efficiency required to achieve extreme flatness and minimal surface damage.

Core Capabilities

Our grinding wheels utilize high-grade synthetic diamond grit embedded in specialized resin, metal, or vitrified bonds. This advanced bonding technology ensures a consistent self-sharpening effect, allowing for stable material removal rates (MRR) throughout the wheel's lifespan.