SBT Ultrasonic Q5541: New SAM on show
Overview
SBT Ultrasonic is a world-leading manufacturer of ultrasonic equipment, committed to delivering innovative and comprehensive solutions for the semiconductor industry and beyond. Our extensive product portfolio includes ultrasonic die bonding, wire bonding, welding, inspection (including advanced scanning acoustic microscopes), cleaning, and more.
With a strong global footprint, SBT Ultrasonic operates a subsidiary in Germany – Ultrasonic Technology (Germany) GmbH – and maintains multiple branches across Europe, East Asia, Southeast Asia, North America, and other key regions.
Looking ahead, we continue to push the boundaries of ultrasonic technology, developing new solutions that support safe, reliable, and high-precision manufacturing worldwide. Visit us at Booth Q5541 to experience our latest scanning acoustic microscope in action.
OUR PRODUCTS
- Wafer Level Scanning Acoustic Microscope(SAT)
- Ultrasonic Wire Bonder
- Ultrasonic Die Bonder
- Scanning Acoustic Microscope(SAT/C-SAM）
- IGBT/Sie Terminals uitrasonic Welder
- Pins Ultrasonic Welder
- Ultrasonic Dry cleaning system
- Laser Welding Process Monitoring Systems
- Laser Welding Depth Measurement System
SEMICON Taiwan 2026 Booth Number: #Q5541
Mobile: (86) 15901603231
E-mail: [email protected]
Website: www.sbt-ultrasonic.com
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