SBT ULTRASONIC to Showcase Advanced Packaging and Semiconductor Inspection Solutions at SEMICON Taiwan
TAIPEI, Taiwan – [Sep. 2-Sep. 4] – SBT Ultrasonic Technology Co., Ltd. (SBT ULTRASONIC, Stock Code: 688392), a world-leading pioneer in ultrasonic equipment and advanced non-destructive testing (NDT), today announced its participation in SEMICON Taiwan, taking place from September 2 to September 4 at Taipei Nangang Exhibition Center.
At the event, SBT ULTRASONIC will exhibit its cutting-edge semiconductor portfolio, designed to address critical manufacturing challenges in advanced packaging (2.5D/3D, Wafer-to-Wafer, and Die-to-Wafer bonding), power semiconductors, and automotive electronics. Visitors can explore their latest breakthroughs in ultrasonic bonding and high-precision Scanning Acoustic Microscopy (SAM/SAT) technology.
Redefining Quality Control with High-Precision SAM/SAT Technology
As the semiconductor supply chain shifts toward dense, multi-layer architectures, ensuring structural integrity has become paramount. SBT ULTRASONIC’s flagship Wafer400 Series fully automatic in-line SAM/SAT systems leverage proprietary intelligent algorithms to detect sub-micron internal defects non-destructively. This equipment serves as a cornerstone for identifying voids, micro-bubbles, layer delamination, and substrate cracks in high-end packages.
Comprehensive Semiconductor Portfolio on Display
Alongside its industry-validated inspection systems, the company will showcase an expansive matrix of core ultrasonic equipment built with entirely self-developed generators, transducers, and software algorithms:
Ultrasonic Wire Bonders (Aluminum/Copper): Offering high-precision interconnect solutions featuring advanced linear motor tech and real-time Active Loop Control (ALC) for maximum consistency.
Ultrasonic Die Bonders: Optimized for high-speed pick-and-place and pre-sintering attachment for Silicon Carbide (SiC) and IGBT power modules.
Pin & Terminal Welders: Specifically engineered for heavy-duty automotive electronics and next-gen new energy battery systems.
SEMICON Taiwan represents an essential hub for global chip supply chain innovation," said a representative of SBT ULTRASONIC. "We look forward to engaging with global partners, foundry leaders, and OSAT providers to show how our advanced ultrasonic systems are empowering the industry to scale production safely, increase yield, and meet the strict reliability demands of modern computing."
SBT ULTRASONIC cordially invites all clients, media partners, and industry professionals to visit their booth to see live demonstrations and discuss customized ultrasonic solutions with their team of technical experts.
Event Details:
Event: SEMICON Taiwan
Dates: September 2 – September 4
Location: Taipei Nangang Exhibition Center, Taipei, Taiwan
SBT ULTRASONIC Booth: Q5541
About SBT ULTRASONIC
SBT Ultrasonic Technology Co., Ltd. is a leading global provider of comprehensive ultrasonic application solutions. Spanning over 18 years of technological innovation, the company develops state-of-the-art systems across semiconductors, new energy batteries, automotive wire harnesses, and medical industries. Headquartered in China with a specialized subsidiary in Germany—Ultrasonic Technology (Germany) GmbH—and global support networks, SBT Ultrasonic is dedicated to driving reliable, high-performance global manufacturing.
Media Contact:
Name: Adien Fang
Title: Marketing Manager
Email: [email protected]
Website: www.sbt-ultrasonic.com