東洋技術股份有限公司

全自動減薄拋光貼模一體機專為半導體晶圓超精密加工設計，整合減薄、乾式拋光與貼膜等關鍵製程，可有效提升加工效率、穩定性與良率，適用於先進封裝、功率半導體、MEMS 與高階晶圓製程。

設備採用主軸進給式磨削加工技術，搭配高剛性氣浮主軸與高精度承片系統，可降低振動並提升晶圓平整度與厚度均勻性，TTV 可穩定控制於 1.5μm 以下。Z 軸採用精密滾珠螺桿、線性導軌及高精度伺服電機控制，最小解析度達 0.1 μm/s，並結合測厚系統進行即時監測，確保加工穩定可靠。

乾式拋光技術可減少化學液體使用與設備維護需求，提升操作便利性與生產效率。設備同時整合全自動貼膜功能，降低人工搬運造成的污染與破片風險，整體破片率低於 1/10,000。友善的人機介面（HMI）可快速完成參數設定與製程管理，有助於降低教育訓練與人力成本。

The Fully Automated Thinning, Polishing, and Mounting System integrates grinding, dry polishing, and mounting into a single platform for advanced semiconductor wafer processing. Featuring in-feed spindle grinding, high-rigidity air-floating spindle, and precision Z-axis control, the system achieves stable TTV below 1.5 μm with excellent process reliability. Dry polishing improves efficiency while reducing maintenance and chemical consumption. The fully automated workflow minimizes contamination and wafer breakage, achieving breakage rates below 1/10,000. With a user-friendly HMI and stable automation design, the system enhances yield, reduces labor cost, and supports high-volume semiconductor manufacturing.

PLP-700 Vacuum Lamination Platform 是 Takatori 專為新世代先進半導體封裝製程打造的高精度真空貼合設備，主要應用於 HBM（High Bandwidth Memory）、CoWoS（Chip on Wafer on Substrate） 與 Panel Level Packaging（PLP） 等高階封裝技術。

設備透過高真空環境進行貼合，有效排除氣泡與殘留空氣，大幅提升貼合品質、材料均勻性及封裝可靠度，同時降低缺陷率並提高整體良率。PLP-700亦具備高精度定位、穩定壓力控制及優異製程重複性，可因應大型面板與多樣化封裝材料需求，提升生產效率並降低製造成本。

隨著AI、高效能運算（HPC）、資料中心及高速通訊市場快速成長，HBM與CoWoS封裝需求持續增加。PLP-700可支援先進封裝量產，協助半導體製造商建立高品質、高效率且具競爭力的智慧製造產線。
 

PLP-700 Vacuum Lamination Platform is Takatori's advanced vacuum lamination system designed for next-generation semiconductor packaging applications, including HBM (High Bandwidth Memory), CoWoS (Chip on Wafer on Substrate), and Panel Level Packaging (PLP).

The system performs lamination under a high-vacuum environment to minimize trapped air and voids, ensuring excellent bonding quality, uniformity, and package reliability. Featuring precise alignment, stable pressure control, and high process repeatability, the PLP-700 supports large-panel processing while improving production yield and manufacturing efficiency.

Designed for AI, HPC, data center, and advanced packaging applications, the PLP-700 enables semiconductor manufacturers to achieve reliable, high-throughput, and cost-effective production for next-generation advanced packaging technologies.

JCA（Jiangsu JCA Electronic Technology Co., Ltd.） 致力於高精度半導體切割、減薄及智慧製造設備的研發與製造，產品包含 Dicing Saw（晶圓切割設備）、Grinding System（晶圓減薄設備） 以及客製化自動化生產線，可滿足6吋、8吋及12吋晶圓製程需求。

JCA設備廣泛應用於功率半導體、MEMS、LED、光電元件、IC、化合物半導體及先進封裝產業，具備高精度定位、低損傷加工、高穩定性及高產能等優勢。除標準設備外，亦可依客戶製程需求提供客製化整線方案，整合自動上下料、AOI檢測、搬運系統及智慧控制，大幅提升生產效率與產品良率。

JCA持續投入核心技術研發，致力提供兼具品質、效率與可靠性的半導體製造設備，協助客戶建構智慧化、高效率及具競爭力的生產環境，並已獲得多家國際半導體企業採用。

JCA (Jiangsu JCA Electronic Technology Co., Ltd.) specializes in the development and manufacturing of high-precision semiconductor dicing, wafer grinding, and customized automation equipment. Its product portfolio includes dicing saws, wafer grinding systems, and fully automated production solutions for 6-inch, 8-inch, and 12-inch wafer processing.

JCA equipment is widely used in power semiconductors, ICs, MEMS, LEDs, optoelectronics, compound semiconductors, and advanced packaging applications. The systems offer high positioning accuracy, low-damage processing, stable performance, and high productivity. In addition to standard equipment, JCA provides customized turnkey solutions integrating automated loading/unloading, AOI inspection, material handling, and intelligent process control to improve manufacturing efficiency and yield.

With continuous investment in advanced manufacturing technologies, JCA delivers reliable, high-performance semiconductor equipment that supports smart manufacturing and next-generation semiconductor production.

Takatori Back of Line（BOL）半導體後段製程設備提供完整且高度整合的晶圓加工解決方案，涵蓋晶圓保護膠帶貼附（BG Tape Lamination）、晶圓背面研磨（Back Grinding）、Temporary Bonding、保護膠帶剝離（Tape Removal）、DAF（Die Attach Film）貼附、晶圓貼框（Wafer Mounting）、晶圓切割（Dicing）、UV照射（UV Irradiation）及Temporary Debonding等關鍵製程。

Takatori設備具備高精度定位、穩定搬送、自動化控制及優異製程重複性，可有效降低晶圓翹曲、破片及加工缺陷，提升超薄晶圓與先進封裝製程的可靠性。產品支援8吋、12吋晶圓及多種封裝材料，廣泛應用於HBM、CoWoS、Fan-Out、Panel Level Packaging（PLP）、MEMS、功率半導體及AI、高效能運算（HPC）等新世代半導體應用。

Takatori亦可依客戶需求提供客製化設備整合與自動化生產方案，協助建構高效率、高良率且智慧化的半導體製造產線。

 

Takatori Back of Line (BOL) Semiconductor Equipment provides a comprehensive solution for wafer back-end processing, covering BG tape lamination, wafer back grinding, temporary bonding, tape removal, DAF (Die Attach Film) lamination, wafer mounting, dicing, UV irradiation, and temporary debonding.

Designed for high-precision semiconductor manufacturing, the systems feature accurate positioning, stable wafer handling, advanced automation, and excellent process repeatability. They help reduce wafer warpage, breakage, and processing defects while improving yield and production efficiency for ultra-thin wafers.

Takatori's BOL solutions support 8-inch and 12-inch wafers and are widely used in HBM, CoWoS, Fan-Out Packaging, Panel Level Packaging (PLP), MEMS, power semiconductors, AI, and High-Performance Computing (HPC) applications. Customized automation and turnkey integration services are also available to meet diverse manufacturing requirements.

Plasma Cleaning System 為半導體、電子及先進封裝製程的重要前處理設備，結合**RF Plasma（射頻電漿）與Microwave Plasma（微波電漿）**兩大技術，可依不同材料及製程需求提供最佳清潔與表面改質方案。

RF Plasma Cleaning System主要應用於晶圓、基板及封裝材料的表面清潔與活化，可有效去除有機污染物、微粒及殘留物，提高材料表面能，增強Die Bonding、Wire Bonding及Underfill等製程的接著強度與可靠性，並具備高均勻性、高產能及低損傷等優勢。

Microwave Plasma Cleaning System則適用於去除氧化層、光阻（Photoresist）、聚合物殘留及微量有機污染物，具備高密度電漿、非破壞性清潔及優異去氧化能力，可提升後續鍍膜、鍵合及封裝品質。

產品提供Batch Type、Stand-alone及Inline全自動設備，可依產線需求彈性配置，廣泛應用於先進封裝、HBM、CoWoS、Fan-Out、Power Semiconductor、MEMS、Lead Frame及PCB等製程，協助客戶提升製程穩定性、生產效率與整體良率。

 

Plasma Cleaning System provides advanced surface cleaning and activation solutions for semiconductor manufacturing by integrating RF Plasma and Microwave Plasma technologies. The systems effectively remove organic contaminants, particles, oxides, photoresist residues, and polymers while improving surface energy and adhesion performance.

The RF Plasma Cleaning System is designed for surface activation and contamination removal before semiconductor packaging processes. It delivers excellent cleaning uniformity, high throughput, and enhanced bonding strength for applications such as Die Bonding, Wire Bonding, Flip Chip, Underfill, and Molding.

The Microwave Plasma Cleaning System features high-density plasma technology for efficient oxide removal, photoresist stripping, polymer cleaning, and non-destructive surface treatment. It significantly improves bonding quality, coating performance, and package reliability.

Available in batch, stand-alone, and fully automated inline configurations, the systems are widely used in HBM, CoWoS, advanced packaging, MEMS, power semiconductors, lead frames, and PCB manufacturing, helping customers achieve higher yield, productivity, and process reliability.