和亞智慧科技股份有限公司

New Smart Agent is an Edge AI device assistant designed for smart manufacturing equipment. It embeds AI capabilities directly into equipment and integrates equipment data, SOPs, troubleshooting records, and production information to improve equipment visibility and operational efficiency.

New Smart Agent provides three key applications:

On-Demand Query
Quickly accesses SOPs, troubleshooting records, and equipment knowledge, reducing time spent manually searching for information.

Scheduled Reports
Automatically organizes information such as yield rate statistics and production status, helping users monitor equipment and production conditions.

Abnormal Alerts
Provides equipment malfunction alarms and abnormal records to support faster issue identification and response.

With Edge AI Deployment, equipment data can be captured and processed locally for real-time feedback. Secure & Local Processing keeps data on site to enhance security and management flexibility, while Seamless Integration enables connection with existing equipment systems and production workflows.

Combining AI Edge Computing, Knowledge Management, lightweight deployment, and easy operation and maintenance, New Smart Agent helps improve equipment visibility, accelerate abnormal response, and reduce daily equipment management overhead.

Wafer AOI Solutions – OSD T200 Series is designed for wafer and panel wafer inspection. It integrates multiple optical inspection capabilities to detect surface, sub-surface, thickness, and warpage defects, helping users improve process judgment and inspection reliability.

The system features three core inspection capabilities:

1. DIC Differential Interference Contrast
Enables imaging and detection of micro scratches on reflective surfaces, improving the visibility and identification of fine defects.

2. 2D + 3D Integrated Inspection
Combines surface imaging with depth measurement for TTV (Total Thickness Variation) and warpage judgment. It also supports applications such as coplanarity, blind via residual copper depth, and die tilt measurement.

3. SWIR Short-Wave Infrared Imaging
Supports 900 nm to 1700 nm imaging to reveal hidden sub-surface cracks and internal structural anomalies. It is suitable for SiC and GaN applications and can also be used to inspect package transparency, sub-surface defects, light spots, scratches, and pits.

The OSD T200 Series also provides configurable inspection modules to meet different optical conditions and inspection requirements, making it suitable for advanced semiconductor and high-end wafer inspection processes.

Gimbal Integrated Solution integrates EO visible imaging, LWIR thermal imaging, Edge AI, and 3-axis stabilization for UAV payloads, industrial inspection, and day/night smart monitoring applications.

The solution provides four core capabilities:

1. 3-Axis Stabilization
Pitch, Roll, and Yaw stabilization helps reduce image disturbance caused by platform movement and vibration, providing stable imaging for long-range observation and inspection.

2. EO Visible + LWIR Thermal Imaging
Integrates EO visible and LWIR thermal imaging. EO configurations support 1080p or 4K optical zoom, while LWIR supports up to 640 × 512 resolution with a 12 μm pixel pitch for day, night, and various operating environments.

3. Edge AI & Image Fusion
Supports Edge AI detection of persons, vehicles, and targets, together with EO + IR + AI image fusion for enhanced multi-sensor imaging and real-time monitoring.

4. Flexible System Integration
Depending on configuration, the solution supports LRF, Ethernet, UART, and SDK interfaces for integration with UAVs, mobile platforms, and smart monitoring systems.

Gimbal Integrated Solution supports equipment and factory inspection, UAV aerial and long-range imaging, and day/night smart monitoring, providing an integrated multi-sensor solution from imaging and thermal sensing to AI recognition and system integration.