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주식회사 쎄크

水原市,  京畿道 
Korea (South)
http://www.seceng.co.kr
  • Booth: Q6343

來自韓國的半導體與HBM X光檢測解決方案

Overview

SEC Co., Ltd. 設計並製造工業用X光檢測系統，廣受全球半導體、汽車、SMT及電池產業龍頭製造商信賴。
自1991年創立以來，總部位於韓國水原，擁有逾30年檢測技術專業，包含20年以上X光系統設計經驗，以及15年以上韓國唯一自主研發X光管的開發歷程。並在美國、歐洲、中國及越南設有全球辦事處，為世界各地客戶提供頂級解決方案。
X光檢測（X-eye系列）

Off-line X光：適用於半導體PKG、SMT、壓鑄及汽車零件的2D/3D CT系統（5000N、SF160、PCT、Nano-CT系列）
In-line AXI：結合深度學習AI演算法，適用於工業4.0智慧工廠的高速自動化檢測（6100/6200/6300AXI、NF120A/AW系列）
奈米焦點X光：焦點尺寸達200nm，適用於晶圓級PKG、TSV、微凸塊及銅柱檢測

HBM檢測（Semi-Scan-SW）
SEC近期開發了Semi-Scan-SW，一款用於HBM生產的內嵌式X光檢測系統。該系統可在HBM堆疊製程中檢測3～5μm範圍內的缺陷，並支援玻璃基板的TGV製程檢測，以及晶圓級封裝中晶片與中介層之間的接合檢測。
SEC專有的無損檢測技術（Damage-Free Technology），基於專利準直器與濾波器設計，實現對先進記憶體元件的無損檢測。X光管、LINAC系統及桌上型SEM等關鍵零組件均為自主開發與製造。

  Press Releases

  • (Jun 04, 2026)

  Products

  • NF120AW
    Auto X-ray Inspection System optimized for wafer & semiconductor packages, featuring nano-scale focal spot technology for ultra-precise defect detection of TSV, Micro Bump, and Solder Bump....

    • X-eye NF120AW – Auto X-ray Inspection System

    ■ Key Features

    - 100% defect detection, under 2% underkill & overkill
    - High-speed 2D X-ray inspection for wafer-level packages
    - Off-line automated standalone system 
    - EFEM-equipped full auto inspection
    - Oblique CT inspection capability

    ■ Inspection Items
    - TSV, Micro Bump, Solder Bump: Void, Short, Bridge, Big ball, Missing - Bump Via: Via Distance, Extra Via
    - WLP (Fan-In / Fan-Out), Cu Pillar Bump (Non-wet)

    ■ Specifications
    - X-Ray Tube: Open Tube, Max 120kV / 200uA / 24W
    - Focal Spot Size: Min. 200nm
    - Detector: 12" FPXD, 9M resolution, 14bit grayscale
    - Table Size: 300×300mm / T-axis: 70° / R-axis: 360°
    - Max Sample Weight: 5kg
    - Footprint: 2,380×1,910×2,580mm

    ■ Service & Support
    - Minimize downtime with core parts (Tube, Detector) in stock
    - 40 global partners worldwide
    - Reduced maintenance cost via proprietary X-ray Tube technology 

產品種類

203 Equipment, Inspection & Measurement
  • Package Inspection; Lead Scanners
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 700 Manufacturing Services
  • Measurement; Inspection Service

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