Material Performance
Constructed from semiconductor-grade high-purity quartz, the product has an extremely low content of metallic impurities with no ion leaching under high-temperature conditions. It features an ultra-low coefficient of thermal expansion, capable of enduring sustained temperatures above 1200°C, alongside excellent thermal shock resistance to resist cracking during alternating hot and cold cycles. With stable chemical properties, it resists corrosion from acids, alkalis, etching gases and various process chemicals.
Process & Specifications
The tube is formed by integral drawing or precision welding, featuring uniform wall thickness, burr-free smooth inner walls and outstanding air tightness. Customization is available for outer diameter, wall thickness and length, together with machined structures such as flanges, bevels and branch pipes to fit horizontal and vertical high-temperature furnace equipment. Fine surface polishing effectively prevents particle shedding.
Production Standards
Machining, cleaning and packaging are completed in a Class 1000 cleanroom in strict accordance with semiconductor cleanliness standards, fully meeting the requirements of advanced manufacturing processes.
Application Scope
It is mainly used as furnace tubes, gas delivery pipelines and reaction chamber sleeves for semiconductor high-temperature furnaces, matching core processes including diffusion, oxidation, LPCVD and annealing. It also serves the production of photovoltaics and special electronic components.