Flying probe testing has evolved from a specialized failure analysis tool into a mission-critical solution for modern high-reliability electronics manufacturing. As PCBAs become smaller, denser, and more complex, traditional fixture-based testing faces growing technical and economic limitations. A conventional bed-of-nails fixture may require weeks of design, significant mechanical construction costs, and expensive modifications whenever a circuit layout changes. Flying probe testing eliminates these constraints by using software-guided robotic test heads to directly access test points, removing physical tooling lead times and enabling engineers to begin electrical testing directly from standard CAD design data.

At its core, flying probe technology functions as a highly accurate in-circuit test (ICT) system. It verifies components such as resistors, capacitors, inductors, diodes, and integrated circuits against their electrical parameters, identifying placement errors, incorrect values, and polarity issues. Advanced signature-comparison algorithms can also detect short circuits across active circuit paths before power is applied, helping prevent damage to sensitive assemblies.

Modern flying probe systems extend beyond electrical testing by integrating structural and optical inspection capabilities. High-definition vision systems perform automated optical inspection (AOI) to verify component presence, orientation, markings, and barcodes. Integrated 3D laser technology measures component height and detects defects such as tombstoning or component tilt. For complex devices including BGAs, where connections are hidden beneath the package, flying probe systems can integrate with digital boundary scan technology to validate internal connections without requiring dedicated external test pads.

As electronics continue to advance, manufacturers increasingly face another challenge: the growing physical size of high-performance circuit assemblies. Server backplanes, telecommunications systems, and industrial electronics may use boards too large for conventional flying probe systems.

To address this requirement, SPEA developed the 4080L, featuring the largest active flying probe test area available in the electronics manufacturing industry. Its expanded testing capacity enables manufacturers to test extra-large PCBAs that cannot be accommodated by standard flying probe platforms, reducing the need for custom bed-of-nails fixtures even for large industrial assemblies.

Despite its extended test area, the SPEA 4080L maintains high speed and accuracy. A rigid natural granite chassis provides excellent vibration damping and thermal stability, minimizing alignment drift during high-speed movements. Linear motors combined with sub-micron optical encoders drive multiple independent flying heads with high acceleration and precise positioning.

The system can reliably contact targets as small as 50 μm while minimizing visible witness marks through specialized soft-touch vertical velocity control. Precise force management helps protect delicate circuit traces from scratching or damage, allowing the 4080L to safely test flexible circuits, thin multilayer backplanes, and sensitive high-power modules.

By integrating in-circuit measurements, power-on testing, optical inspection, thermal profiling, and a market-leading test footprint, the SPEA 4080L provides advanced electronics manufacturers with a comprehensive and versatile solution for testing increasingly large and complex circuit assemblies while maintaining high product quality.

The SPEA DOT800T Power Semiconductor Tester is designed for high-performance testing of next-generation power devices, including traditional Silicon, Silicon Carbide (SiC), and Gallium Nitride (GaN) technologies. It integrates high-voltage isolation, static DC characterization, and high-speed dynamic AC testing within a single production-ready platform, addressing the demanding voltage, current, frequency, and reliability requirements of applications such as electric vehicles, renewable energy, industrial drives, and power conversion systems.

DOT800T is based on a multi-core architecture and can be configured with one to six independent test cores. Each core has its own controller and can be assigned to ISO, AC, or DC testing according to specific test requirements and production flows. Tests can run in true parallel and asynchronous mode, with each core independently managing instruments, connections, and program execution. The system is scalable and field-upgradeable, allowing manufacturers to adapt its configuration as device requirements evolve.

The platform integrates specialized instrumentation for wide-bandgap semiconductor testing, supporting high voltages, high currents, high power, and high switching frequencies. High voltage and current can be supplied simultaneously, while sensitive current measurement and high-frequency digitizers provide accurate leakage and breakdown measurements. Local setup memory, embedded ramps and trigger macros, and system-wide hardware synchronization help reduce test time while maintaining reliable mixed-mode operation. Built-in alarms monitor conditions such as over-temperature, over-current, floating connections, and Kelvin contact issues.

For dynamic AC testing, DOT800T supports voltages from 2 kV to 4 kV, pulse currents up to 3 kA, and short-circuit testing up to 10 kA. Up to eight independently programmable gate-drive circuits and 2-to-8 multi-pulse sequences enable detailed evaluation of switching behavior, thermal decay, and gate characteristics. Integrated digitizers provide sampling rates up to 10 GS/s for accurate capture of high-speed voltage and current waveforms.

The system is engineered with ultra-low stray inductance throughout the active signal path, minimizing parasitic effects and voltage overshoot during fast switching. This is particularly important for safely testing high-speed SiC and GaN devices.

DOT800T also simplifies system maintenance and upgrades through configurable hardware architecture. Its software environment supports code-free test development, pre-validated test routines, waveform visualization, and real-time modification of test parameters without recompiling the complete program.

Combining high-power instrumentation, parallel multi-core testing, advanced dynamic measurement, safety monitoring, and flexible software, the SPEA DOT800T provides a scalable and reliable solution for high-volume power semiconductor testing from development through mass production.

專為半導體高階製程打造，本設備廣泛應用於製程前期的表面特性檢測：在 FAB 廠中，能精準評估光阻前經 HMDS 處理後的Wafer表面疏水性；在封裝製程，則完美勝任 Plasma 清潔後的潔淨度驗證。系統搭載專利自動水滴輪廓演算法，能即時實現高精度量測。

我們提供從手動、半自動到全自動的完整產品線，全面滿足 Substrate、Leadframe、Wafer及 CoWoS、FOPLP 等封裝需求。全自動系列完美對接無人工廠，支援OHT及 EFEM 自動取放，實現自動控制體積、自動滴水定位與自動補水，以極致的精準度與自動化效率，為您的半導體良率封裝守護最後一道防線！

Designed specifically for advanced semiconductor processes, this system is widely used for surface property inspection during critical pre-process stages. In wafer fabrication, it precisely evaluates wafer surface hydrophobicity after HMDS treatment prior to photoresist coating. In semiconductor packaging, it provides reliable cleanliness verification following plasma cleaning. The system features a patented automatic droplet contour analysis algorithm, enabling real-time, high-precision measurement.

We offer a complete product portfolio ranging from manual and semi-automatic to fully automated systems, supporting a wide range of applications including substrates, leadframes, wafers, CoWoS, and FOPLP packaging.

The fully automated series is designed for seamless integration into unmanned smart factories, supporting automated loading and unloading via OHT and EFEM. With automatic droplet volume control, dispensing position alignment, and water replenishment, the system delivers outstanding measurement accuracy and automation efficiency, providing a critical final safeguard for semiconductor process control and packaging yield.

專為半導體高階DRAM封裝製程打造，本設備傲視業界提供「一次印刷四片產品」技術，將最大產能大幅提升至 300 strips/hr，尊享業界最高產能優勢，目前已成為台灣、中國各大廠印膠製程的主力設備。
 
我們具備深厚的印膠、膠型/ 膠厚量測之整線導入經驗，能為客戶提供最完整的製程整合能力。機台整合伺服馬達刮刀與雙 CCD 高解析對位，達到 ±25μm 的極致精準度；全自動化流程涵蓋自動鋼板清洗與點膠補料，並可支援 SECS/GEM，完美對接智慧工廠，以極致效率與頂級良率助您搶佔市場先機！

Engineered specifically for advanced DRAM packaging processes, this system features an industry-leading four-strip simultaneous printing technology, delivering a maximum throughput of up to 300 strips per hour. With its outstanding productivity, it has become a key dispensing and printing solution adopted by major semiconductor manufacturers in Taiwan and China.

Leveraging extensive experience in complete production-line integration for adhesive printing, adhesive profile inspection, and thickness measurement, we provide customers with comprehensive process integration capabilities. The system integrates a servo-driven squeegee with dual high-resolution CCD alignment, achieving positioning accuracy of up to ±25 μm.

The fully automated process includes automatic stencil cleaning and adhesive replenishment, while SECS/GEM support enables seamless integration with smart factory environments. Combining exceptional throughput, precision, and automation, the system helps manufacturers achieve superior process efficiency and yield for advanced DRAM packaging.