Teltec Semiconductor Pacific Limited

Shadow Moire is a non contact, full field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled white line light source at approximately 45° to the grating and a camera prependicular to the grating. Its optical configuration integrated with the heating chamber.

Flagship Models

• AXP3: Sample size up to 400×400 mm
• PS600T: Sample size up to 820×830 mm

Technical Features:

• Minimum Feature Size: 2mm x 2mm
• Up to 1.7 million data points per acquisition in 2 seconds
• Warpage resolution down to 500nm（300 LPI Grating）
• 2 zone temperature control on bottom, plus top heater on separate control loop
• Temperature range of -55°C to 350°C
• Maximum Heating Rate, 50°C to 250°C, 3.5ºC/s
• Maximum Cooling Rate, 250°C to 125°C, 2.25ºC/s
• Can integrate DFP and DIC technology

Automation

• Exhaust Speed is Software Controlled
• Larger Touch Screen HMI for Machine Control
• Shadow Moire Lens Automation
• Front Door Locking System
• New PLC Control System with Improved Thermocouple Control and Response
• Field of view can be freely set in the software, increasing the flexibility of use

Top/Bottom Heating Chamber

• Top and Bottom Heating Capacity with Top/Bottom/Lateral Uniformity <±5ºC
• Capable to measure unpainted surface
• Dual Cool Boost from Front and Back and Triple Exhaust Channel from Left, Right and Bottom creating faster and uniform cooling effect.

Digital Image Correlation - DIC3 Module

• Strain Resolution: <100 microstrain (Δ L/L x 10-6)
• Strain and CTE measurement module
• Data acquisition time ≤ 1 second
• In-Plane Resolution: 0.5µm
• Temperature Range: RT to 300°C
• Field of View: 225mm x 205mm
• NON Destructive FULL FIELD CTE Technique

Digital Fringe Projection - DFP3 Solution Module

• 16-megapixel camera achieves optimal 1.5 micron resolution measurement
• Capable of measuring step heights and discontinuous surfaces
• Capable of measuring any position within the FOV (Gantry fixture)
• Improved top/bottom temperature uniformity
• Applicable to solder ball coplanarity, non-continuous surface, and socket measurement
• Unpainted, no ball removal

Sub-Room Module – SRM

• Accommodates samples up to 200mm x 200mm
• Heats and cools from -55˚C to 300˚C
• Automatically controlled by Studio Surface Measurement
• Adjustable heating, cooling and airflow rates

Akrometrix Studio

Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP 3 surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses.

Studio Key Features

• Windows 11 OS
• Sample Auto-Focusing
• Automated Report Generator
• Greatly enhanced ability to detect samples without painting
• Multiple sampling areas (Multi-ROI) can be customized and tracked
• “3S Warpage” determines irregular surfaces by simple plus/minus signs (Signal Strength Sign)

Real Time Analysis (RTA) for Studio Software

Combines High Volume Testing with Go/No Go Criteria

• User-defined “Pass/Fail” limits
• Visual indicators immediately after measurement
• Works with Part Tracking for Multiple Part Testing
• Works at Room Temperature and During Thermal Profile

Room Temp Automated Metrology Solutions

TTSM

Technical Specifications:

• Measurement Technology: Shadow Moire
• Maximum Field of View (mm): 310*310mm
• Maximum Sample Size (mm): 330*330mm
• Maximum Measured Surface Coplanarity: 4mm
• Resolution, Z-axis (vertical displacement): 2.5μm
• Accuracy, Z-axis (vertiacal displacement): 2.5μm/2%
• Automated Data Collection: Yes
• Batch Data Analysis: Yes
• Data Acquisition (Measurement) Time, approx.: 2s
• Data Analysis Time per Acquisition, approx.: 2s

Key Features:

• Room temperature measurement
• Automatic measurement
• Part tracking function
• Optional loader/unloader
• Applicable to Jedec Tray
• For large panel (PCB) measurement
• Selected model before product shipment
• RTA function, and automatic Pass/Warn/Fail

TTDFP2

Technical Specifications:

• Measurement Technology: Digital Fringe Projection
• Maximum Field of View (mm): 192*240mm
• Maximum Sample Size (mm): 450*450mm
• Maximum Measured Surface Coplanarity: 50mm
• Resolution, Z-axis (vertical displacement): 2.5μm
• Accuracy, Z-axis (vertiacal displacement): 2.5μm/3%
• Automated Data Collection: Yes
• Batch Data Analysis: Yes
• Data Acquisition (Measurement) Time, approx.: 2s
• Data Analysis Time per Acquisition, approx.: 5s

Key Features:

• No need remove solder ball
• Automatic function optional
• Part Tracking function
• AI device measurement available
• Solve the problem of spray painting (no need for spray painting treatment)

DFP2-LS

Technical Specifications:

• Measurement Technology: Digital Fringe Projection
• Maximum Field of View (mm): 585*468mm
• Maximum Sample Size (mm): 600*600mm
• Maximum Measured Surface Coplanarity: 95mm
• Resolution, Z-axis (vertical displacement): 20μm
• Accuracy, Z-axis (vertical displacement): 20μm/2%
• Automated Data Collection: Yes
• Batch Data Analysis: Yes
• Data Acquisition (Measurement) Time, approx.: 2s
• Data Analysis Time per Acquisition, approx.: 10s

Key Features:

• Warpage measurement for large bare PCB
• Wafer level package Warpage measurement
• Warpage measurement for large PCB panel of reflowed
• Part tracking function
• RTA function
• Interface analysis software(option)

SU-8 3000 Series - Permanent High Aspect Ratio Negative Resists

• Wide range of film thicknesses in a single coat: 4-100µm
• Aspect ratio: >5:1
• Reduced coating stress
• Improved substrate adhesion
• High thermal stability (<250°C)
• High chemical stability (After hard bake)
• Broad Application: MEMS, Opto-electronics, DRIE etch mask, Microfluidics, Displays etc.

SU-8 TF 6000 Series - High Resolution Thin Resists

• High resolution i-Line patterning capability (sub-0.5 µm lines/ spaces)
• Low defect coatings with film thicknesses ranging from ~ 0.4 to 16 µm in a single coat
• Broadband sensitive (i, g and h-line)
• Low temperature cure (<150°C), photo thermal or thermal only cure
• Highly uniform thin coatings
• Good adhesion to rigid and flexible substrates

SU-8 XFT Series - Ultra Thick Resists

• 50 to >200 µm film thickness in a single coat
• i-line (365 nm) and broadband processing
• High aspect ratio imaging of ultra-thick structures (>5:1)

KMPR® 1000 Series - Temporary/Permanent High Aspect Ratio Negative Resists

KMPR is used as the DRIE etching mask with high aspect ratio pattern. It has also been widely used as a plating mold for MEMS and biological devices. Compared with SU-8, because KMPR reduces cross-link density, make it easier to strip before hard baked. KMPR can be developed in any PMGEA or TMAH developer.

• High aspect ratio imaging (>5:1) with vertical sidewalls
• 5-100µm in a single spin coat
• Excellent metal adhesion
• Excellent plating bath stability

PermiNex® - Permanent Wafer Bonding Adhesives

PermiNex® 1000 - Solvent Base Develop

PermiNex® 2000 - Aqueous Base Develop

PermiNex 1000 and 2000 series are Photo Imageable Wafer Bonding Adhesive, can be used to make the cavity structures. For example, the BAW / SAW / CIS packaging and microfluidic applications requiring precision alignment and low-temperature processes

Material Attributes:

• Permanent Wafer Bonding Adhesives for Non-Hermetic Applications
• Negative Resists
• Low-metal corrosion
• Aspect ratio up to 3:1
• Low process temperature (<200°C)
• High-quality, void free bonding
• Superb adhesion to Silicon and Glass
• Work well with subsequent processes (cutting, welding, etc.) and high reliability (HAST, TST)

Permanent Photo-Patternable Low k Dielectrics - Advanced Packaging

KMSF®1000 - Low Stress Photo-dielectric

Material Attributes:

• Negative-tone, photoimageable dielectric
• Low temperature cure (≤200 °C)
• Low residual stress and ultra - low warpage
• High elongation to failure and moderate tensile strength
• Excellent resistance to standard chemicals
• Low shrinkage on cure and good thermal stability
• Good adhesion to Si, SiO2, SiN, Cu and PI
• Applications : Stress buffer, passivation, RDL

KMSF® 2000 - Low Dk/Df Photo-dielectric

Material Attributes:

• Negative - tone, photoimageable dielectric
• Low temperature cure (≤200°C)
• 5-10 µm film thickness after cure
• Solvent development in PGMEA
• Good thermal and chemical stability
• Can replace polymide film
• Application : Wafer Level Package

Temporary Lift-Off Resists

PMGI & LOR - Bi-Layer Lift-Off Resists

Material Attributes:

• Enables high resolution (<0.25µm) metallization lift-off
• Enables thick metal deposition (>3µm)
• Excellent adhesion to Si, GaAs, GaN substrates
• High thermal stability (<300°C)
• Clean lift-off, even after very high temperature processing
• Often used in the metal deposition process in III-V, microLED and other applications

LOR C - Trench/Via Fill Polymer

• Complete filling of hole / trenches of aspect ratio (> 1:5) without voids/ bubbles
• The surface flattening effect can be achieved by high heat reflow
• Excellent adhesion to Si, GaAs, GaN substrates
• High thermal stability (<300°C)
• Clean lift-off, even after very high temperature processing

UniLOR® N - Single Layer Lift-Off Resist

• Negative Photoresists for Single Layer Lift-off Processes
• 1 to 5 µm film thickness in a single coat
• Adjustable sidewall profile angle
• Aqueous alkaline development (standard 0.26N TMAH developers)
• Pattern thermal stability up to 200°C
• Clean removal with standard photoresist removal chemistries
• Suitable for metal evaporation physical vapor deposition
• Good adhesion to various substrates

PMMA & Copolymer (MMA (8.5) MAA) - Positive E-Beam Resist

PMMA (Polymethylacrylate) is a polymeric material well-suited for many imaging and non-imaging micro-electronic applications. PMMA is commonly used for direct write e-beam processes such as T-gate fabrication. PMMA is also used for temporary wafer bonding processes such as wafer thinning, where it's used as a protective layer and the temporary adhesive.

PMMA resists are PMMA polymers of specific molecular weights that are dissolved in a solvent, such as anisole (a safer solvent) and then filtered. Exposure, direct write e-beam or X-ray typically, causes a chain scission of the polymer, resulting in a solubility differential between the exposed and unexposed regions of the resist film, leading to very high resolution patterning.

• Well suited for direct write e-beam & X-ray
• High resolution: <0.1µm
• Wide range of molecular weights and viscosities available
• Applications include e-beam writing, multi-layer T-gate lift-off, wafer thinning, etc.

Copolymer resists are based on a mixture of MMA and 8.5% methacrylic acid. Copolymer (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off processes where independent CD control of the bi-layer resist stack is required. Standard copolymer resists are formulated in ethyl lactate and are available in a broad range of viscosities (film thicknesses).

Temporary Plating Resists

Advanced Packaging

• High power and high frequency devices demands thicker copper with >2.5:1 aspect ratio, higher density for RDL and interconnects
• Specific growth opportunities exist in thicker RDL and Bump Plating, which the TempKoat N Series is targeting

The SU-8 Dry Film (DFR) Series is a family of negative-tone dry film photoresists based on photosensitive epoxy resins designed for permanent structures.
These materials use low-halogen epoxy resins and do not contain antimony.
They are used to form chemically and thermally stable structures, such as walls and caps (roofs) for cavity packages, and lids for microfluidic channels.

Key Features of SU-8 3000CF DFR

SU-8 3000CF DFR is a negative-tone, epoxy-based dry film photoresist that can be patterned using UV light.
It offers performance suitable for semiconductor manufacturing and MEMS devices.

• High-definition patterning: negative-tone photoresist compatible with photolithography
• Low-halogen formulation: total chlorine content below 900 ppm; designed as an antimony-free material
• High resolution and high aspect ratio: vertical sidewalls with an aspect ratio of 3 or higher at a 20 μm film thickness
• Excellent heat resistance: stable under high-temperature conditions
• Low-temperature processing: hard bake at 180°C for 1 hour
• Solvent development: compatible with solvent developers; PGMEA is recommended

These properties make SU-8 3000CF DFR suitable for applications that require high precision and durability, including MEMS, SAW/BAW filters, and semiconductor packaging.

SU-8 3000CF DFR Product Features

High-Precision Lithography Performance

SU-8 3000CF DFR is a chemically amplified, negative-tone photoresist designed for i-line (365 nm) exposure.

• High UV transmittance enables the formation of thick structures over 100 μm
• Stable pattern profiles with vertical sidewalls
• Accurate pattern formation with no loss of film thickness from development or curing shrinkage

Cavity Structure Formation and Thick-Film Capability

SU-8 3000CF DFR is a semi-solid, sheet-type photoresist that can be laminated at room temperature.

• Can be laminated without filling underlying cavities
• Enables easy formation of complex or cavity structures that are difficult to achieve with liquid resists
• Supports thick-film fabrication through multilayer DFR lamination, which is challenging with liquid resists

Typical Applications: SAW/BAW filters, structures on TSV/TGV substrates, and MEMS devices.

KPM DFR Series

The KPM Series provides structure formation and substrate bonding in a single material

The KPM DFR Series is a negative-tone dry film resist based on epoxy resin and developed for use as a permanent structural layer.

Its low-halogen, antimony-free formulation enables the formation of chemically and thermally stable structures. The material also offers strong adhesion to substrates, allowing it to function as a patternable bonding material through standard exposure processes.

Typical applications include wall formation for cavity structures in sensor packages, microfluidic channels, and various bio-device components. The series has demonstrated very low cytotoxicity, as confirmed by ISO-10993-5 testing.

Key Features of KPM-500 DFR

• Negative‑tone, photosensitive resist designed for wafer‑to‑wafer bonding
• Sensitive to broadband and i‑line exposure
• Compatible with 2.38% TMAH developer
• Enables void‑free bonding at low temperature (150°C)
• Excellent adhesion to a wide range of substrates

Product Formats

• Uses high‑purity, low‑halogen resin supplied by Nippon Kayaku
• Suitable as a chemically and thermally stable bonding material for sensor packages and microfluidic devices

Advantages of Dry Film for Si‑Glass Bonding

It provides excellent thickness uniformity, enabling defect‑free bonding across the entire substrate, including the outer edges. This improves the number of usable chips per wafer and can contribute to overall cost reduction.

The Cee® suite of wafer processing equipment is a complete system for developing production quality processes in R&D, laboratory, or low volume production environments.

INTEGRATED

The Cee® X-Pro II Workstation is compatible with all Cee® standard process modules: Spin Coaters, Bake Plates, and Developers. An all-in-one solution for handling fume control, waste management, chemical storage, and more!

CUSTOMIZABLE

(x4) 200mm process modules [or] (x2) 300mm process modules [or] a combination of both

FLEXIBLE

Whether you need one tool or ten, the Cee® X-Pro II Workstation is available in a 2 bay, 4 bay, or combinable configuration for ultimate accomodation of your needs.

PLUG & PLAY

You'll be up & running in virtually no time.

Apogee® Temporary Bonding System

▪      Carrier and device are separated during pre-bond evacuation

▪      Self-leveling platens minimize total thickness variation

▪      Substrate size range: 50-300 mm

▪      Dual heated platens minimize thermal defects

▪      Evacuated bond chamber eliminates voids

▪      DataStream™ technology

▪      Designed for low volume production

Apogee® Mechanical Debonder

▪      Compact design for minimized footprint

▪      In-house debonding of fully processed thinned device wafers

▪      Device wafer debonding on film frame to fully support device wafer and minimize handling risk

▪      Low stress to device wafer

▪      Substrate sizes (round): 50 mm to 300 mm

▪      DataStream™ technology

▪      Developed for low-mid volume production

▪      High uptime

▪      Rapid wafer size changes

▪      Up to 3 tools can be supported by 1 operator

Apogee® 300 Bake Plate

▪      Substrate sizes: up to 300 mm round; 12” square

▪      Temperature range: ambient to 300°C (400°C optional)

▪      Temperature uniformity: ±0.3% across working surface

▪      Smart Pins for programmable height control

▪      Temperature resolution: 0.1°C

▪      DataStream™ technology

▪      Smaller size model available

Apogee® 450 Spin Coater

▪      Substrate sizes: 450 mm round; 14” x 14” square

▪      High-density polyethylene (HDPE) spin bowl for

▪      Spin speed acceleration: 0 to 30,000 rpm/s unloaded

▪      Multiple simultaneous automated dispense capability

▪      Compact design for minimized footprint

▪      Full-color touchscreen graphical user interface

▪      DataStream™ technology

▪      Smaller size model available

Apogee® 450 Spin Developer

▪      A virtually unlimited number of user-defined recipe program steps

▪      High-density polyethylene (HDPE) spin bowl for material compatibility

▪      Enhanced lid-lift assist feature (gas spring opens ≥ 45°)

▪      Substrate sizes: 450 mm round; 14″ x 14″ square

▪      Spm Speed: 6,000rpm

▪      Full-color touchscreen graphical user interface

▪      Compact design for minimized footprint

▪      DataStream™ Technology

▪      Smaller size model available

Veeco is the leading provider of atomic layer deposition (ALD) systems for research and industry worldwide, delivering comprehensive services and versatile, turnkey systems that are accessible, affordable and accurate to the atomic scale. Thin film deposition is our expertise. Our Savannah® Series of thin film deposition tools exemplifies these competencies.

Savannah® has become the preferred system for university researchers worldwide engaged in ALD and looking for an affordable yet robust platform. We have delivered hundreds of these systems in the past decade. Savannah®’s efficient use of precursors and power-saving features substantially reduces the cost of operating a thin film deposition system.

Key features include:

• In-Situ Ellipsometry
• In-Situ QCM
• Self Assembling Monolayers
• 2-Second Cycle Times
• Integrated Ozone
• Low Vapor Pressure Deposition
• Batch Processing
• Glove Box Integration

Savannah® is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode™ for thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1. Savannah® is available in three configurations: S100, S200, and S300. Savannah® is capable of holding substrates of different sizes (up to 300mm for the S300). The Savannah® thin film deposition systems are equipped with heated precursors lines and the option to add up to six lines. Savannah® is capable of handling gas, liquid, or solid precursors.

Fiji – Plasma Enhanced ALD for R&D

Advanced Capabilities for Advanced Research

Fiji® series is a modular, high-vacuum thermal ALD system that accommodates a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The Fiji G2 is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition.

Fiji’s advanced features include:

• Proprietary Chamber Turbo Pumping System
• Improved Plasma Design
• Ergonomic Operator Interface
• In-Situ Ellipsometry
• In-Situ Quartz Crystal Microbalance
• Integrated Ozone
• Glove Box Interface

The Fiji® is available with up to six precursor lines that can accommodate solid, liquid or gas precursors, and six plasma gas lines, offering significant experimental flexibility in a compact and affordable footprint.

Phoenix – Batch Production ALD

Production Capabilities

The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design makes the Phoenix® the practical choice for those with batch production ALD requirements.

Key features include:

• Precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates
• Patented ALD Shield™ vapor trap to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment
• Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects
• Low cost of ownership with minimal startup and operational costs
• Compact footprint that conserves valuable clean room space
• Standard recipes and ALD materials readily available
• Comprehensive support and services worldwide from technical team and PhD scientists
• CE, FCC, and CSA compliant with many built-in safety features

Key Capabilities

• Flexible Inputs & Outputs: Picks die from wafers on film frames/grip rings (up to 300 mm), waffle packs, Gel-Paks, or custom trays. It can output directly into carrier tape (8–24 mm width with heat or pressure seal), waffle packs, Gel-Paks, or JEDEC trays.
• Traceability & Mapping: Features integrated wafer mapping software supporting multi-project wafers (pizza masks/reticle masks) while maintaining strict input-to-output die-level traceability.
• Delicate Handling: Offers optional Non-Surface Contact (NSC) edge grippers for handling ultra-fragile or sensitive surfaces (like MEMS or GaAs die with air bridges) without top vacuum touch.

Technical Specifications

• Die Size Range: 0.2mm² to 25 mm² for tray placement; 0.5 mm² to 17 mm² for tape placement.
• Placement Accuracy: ±12.5 microns repeatability.
• Throughput: Minimum cycle time of 2 seconds per cycle (application-dependent).
• Optional Features: 180-degree die inverter (flipping), post-place vision inspection of die in carrier tape, and top/bottom/edge surface inspection.

Royce 650 Universal Bond Tester

Applications & Test Modules

The Royce 650 is a versatile, high-end instrument capable of executing a full range of standard and custom mechanical tests:

• Wire Pull & Ribbon Bond Testing: Designed for standard to high-power devices.
• Shear Testing: Includes ball bond shear, solder ball (bump) shear, zone shear, and heavy-duty die shear up to 200 kgf.
• Pull Testing: Includes tweezer/gripper pull and stud pull testing.
• Component Strength Testing: Performs die strength 3-point bend (push) tests.
• Specialized Testing: Accommodates heated testing and custom testing tailored to user specifications.
• Module Features: Built with robust test modules that feature range switching, onboard calibration memory, and built-in tool protection.

Technical Specifications

• Physical Dimensions: Height 635 mm (25 in) x Width 432 mm (17 in) x Depth 585 mm (23 in).
• Weight: 55 kg (120 lbs).
• Stage Travel: Large 305mm x 155mm stage that easily accommodates 300 mm wafers, substrates, or lead frames.
• Power Supply Requirements: 90–264 VAC, 47–63 Hz.
• Pneumatic Supply Requirements: 420–550 kPa (60–80 psi).
• Vacuum Supply Requirements: 500 mm Hg, 67.7 kPa (20 in Hg).