Jiangsu Rongdaoshe Semiconductor Equipment Technology Co., Ltd.

This R515×510 Panel Level Packaging (PLP) fully automated equipment is designed for large-format panel packaging processes, featuring automated production of 515 mm × 510 mm substrates while supporting customized 310 × 310 mm substrates. It integrates the entire process flow—including pre-cleaning, adhesive dispensing, edge removal, curing, cooling, and development—and allows modular configuration to meet specific production line requirements, providing comprehensive support for advanced pre-lithography processing in panel packaging.
The equipment features a three-tiered modular layout, with the electrical control zone, process zone, and liquid circulation zone designed separately to ensure a clear structure that facilitates routine maintenance. The top tier houses industrial control computers, electrical components, communication systems, and power supply units; the middle tier contains the core process processing area, utilizing central robotic arms for full-process substrate handling; the bottom tier accommodates the complete piping network and chemical supply system, equipped with real-time level and leakage monitoring sensors and liquid collection trays to prevent chemical spills, ensuring safe and controllable production operations.
The equipment features a standardized EFEM automated loading/unloading unit with a FOUP box-type feeding design, enabling direct integration with overhead cranes and AGVs for seamless unmanned smart production line coordination, while supporting both automatic and manual operation modes.
Equipped with a 6-axis dual-arm precision manipulator, achieving substrate positioning accuracy of ±0.1 mm; complemented by a fully automated mechanical alignment mechanism with an alignment accuracy of ±0.2 mm, significantly reducing process defects caused by substrate misalignment. Each processing unit features an automatic light-shielding shutter to effectively prevent cross-contamination of chemical gases and ensure stable substrate processing conditions.
The entire production line is equipped with a high-level cleanroom control system, featuring FFU filters at the top with a filtration efficiency of ≥99.995% for 0.5 μm particles, ensuring continuous maintenance of an ultra-clean environment and eliminating particulate defects.
A complete ESD (Electrostatic Discharge) protection system with an electrostatic discharge time of <5 seconds and comprehensive voltage stabilization maintained within ±35 V, providing full protection for precision substrates and components from static electricity damage.
The device employs materials meeting the highest corrosion resistance standards in the semiconductor industry: the entire frame and carrier plate are constructed from 304 stainless steel, which is dust-free, resistant to acid and alkali corrosion, and easy to clean and maintain; chemical pipeline connections utilize PFA material to prevent metal ion leaching contamination at the source; the substrate contact surfaces are made of specialized polymer materials such as PPS, PI, and PTFE, which are soft enough not to scratch the substrate surface and ensure high product yield.
The device supports integration with the factory's MES production management system, comprehensively recording process data throughout the entire lifecycle of each substrate to enable full product traceability and intelligent digital control of production lines. Real-time digital monitoring of vacuum pressure and exhaust air pressure data across the entire process, coupled with visualized process parameters, facilitates rapid anomaly detection.
The underlying chemical pipelines are independently zoned, equipped with dual monitoring systems for leakage and liquid level detection with early warning functionality. The three-tier zoning structure isolates electrical systems from corrosive chemicals, significantly reducing equipment failures and safety risks. With dimensions of 7200 × 5500 × 2550 mm, the unit's length, width, and height can be customized to fit various factory space requirements, ensuring compatibility with different cleanroom configurations.
To meet diverse process requirements across different customers, this equipment allows customization of functional units, substrate dimensions, device geometry, and chemical supply configurations, enabling flexible adaptation for various board-level packaging mass production lines as well as R&D and pilot production lines. It serves as a core integrated processing system for advanced PLP packaging lithography processes.

The RPA-600 is a domestically developed Mask Aligner independently engineered by RDS , specifically designed for 4/5/6-inch wafer processing applications and tailored for specialized processes such as power devices, sensors, and MEMS. It breaks the overseas monopoly on small-to-medium-sized Mask Aligner equipment while delivering high precision, superior production capacity, and an integrated compact design.
The equipment is equipped with a self-developed optical lens featuring a numerical aperture of 0.158 and an ultimate resolution of 1.5 μm, enabling stable transfer of intricate circuit patterns. Its exposure wavelength range covers three bands: i-line at 365 nm, h-line at 405 nm, and g-line at 436 nm, compatible with most positive and negative photoresist processes as well as various process requirements including thick films, thin films, and passivation layers. The optical module optimizes the light distribution path, maintaining light intensity uniformity within 3%, ensuring consistent exposure dose across the entire wafer and effectively reducing process defects such as line dimension deviations and color variations. With a focal depth range of 6–8 μm, the system demonstrates exceptional adaptability for wafers with complex topographies and thick-film processes. Equipped with a fully automated visual alignment module, it achieves overlay alignment accuracy of ≤0.6 μm (3σ), ensuring stable yield rates in multi-layer pattern stacking processes. The overall production capacity reaches 100 WPH, meeting continuous manufacturing demands for both pilot and mass production lines. The mask stage supports universal switching between 5-,6-, and 7-inch masks without hardware replacement, significantly reducing setup time. The wafer holder is compatible with standard 4-,5-, and 6-inch wafers, enabling single-unit operation for diverse production specifications and flexible configuration across multi-product lines.
The RPA-600 features a highly integrated design with a footprint of less than 4 m², reducing its size by nearly half compared to traditional imported Mask Aligners. It can be easily deployed in small and medium-sized workshops, laboratories, or pilot production lines, significantly conserving valuable space in cleanrooms. Equipped with mobile casters and shock-absorbing support feet at the base, the device facilitates easy relocation and layout adjustments. Its built-in vibration isolation system effectively mitigates ground vibrations that could compromise optical precision, ensuring minimal accuracy degradation during prolonged operation.
This equipment is widely used in the manufacturing processes of MOSFETs, IGBTs, diodes, pressure sensors, microfluidic chips, and optoelectronic devices, replacing similar imported low-end Mask Aligners. Its core software and hardware are fully self-developed and controllable, with faster after-sales maintenance and parts supply response times, significantly reducing corporate equipment procurement and operational costs. Combining capabilities for both laboratory R&D prototyping and mass production, it meets the needs of small-scale trial production in research institutions as well as large-scale manufacturing in factories, making it the core Mask Aligner solution for domestic substitution in specialized semiconductor production lines.

The RDS COATER & DEVELOPER (models R822, R840, R804) is designed for 6-inch and 8-inch wafers, with model configurations capable of meeting 8-inch processing requirements, making it a core equipment for the front-end processes in semiconductor lithography. It is compatible with various semiconductor substrates including silicon wafers, glass, sapphire, gallium arsenide, gallium nitride, and silicon carbide, supporting the full range of lithographic processes—G-line, i-line, KrF, ArF, and PI—and enabling complete gel coating and development procedures for both positive and negative resists. Its applications span power semiconductors, optical communication chips, laboratory research, LED chips, RF integrated devices, MEMS microelectromechanical systems, and other industries, catering to both R&D prototyping and large-scale production needs.
The equipment host is modularly divided into two major units: the feeding block (CSB) and the processing block (PRB). It comes standard with multiple process stations including 1 EFFM, 2 C, 2 D, 1 AD, 4 CP, 10 LHP, and 2 TRS, with production capacity customizable to meet specific process requirements. The servo motor system is fully optimized for ARM high-speed transfer needs. The core gel homogenization and development motor features a water-cooled design, achieving a maximum speed of 6000 rpm, an acceleration of up to 30,000 rpm/s, and rotational accuracy of ±1 rpm, ensuring uniform film consistency.
Hierarchical temperature control configuration: The standard LHP module supports a maximum temperature of 180°C; the optional HHP module reaches up to 250°C when paired with a PCH temperature control unit, all featuring precise 0.1°C adjustment and PID closed-loop regulation for stable temperature control. Both rubber pumps and flow meters can be selected based on customer requirements for photoresist viscosity and process flow rates, with hardware compatibility with various commercial photoresist consumables.
The system integrates an industrial control computer with a 17-inch touchscreen display, featuring a pre-installed Windows graphical user interface that supports programmable editing. The process menu can be freely edited, stored, and accessed, providing intuitive visualization of operational status throughout the entire workflow for seamless human-machine interaction. The system includes comprehensive real-time video monitoring and full-process operation log recording capabilities, automatic pop-up alarms for faults, and multiple safety protection mechanisms that ensure strong anti-interference performance, convenient daily maintenance, and significantly reduced equipment downtime for repairs.
The communication and information system features standard Ethernet interfaces equipped with SECS/GEM-compliant modules, enabling direct integration with factory MES automation systems for seamless equipment data interoperability and remote production line control. It fully complies with international SEMI GEM industry standards and is designed for intelligent unmanned factories. The plant-side unit includes standardized I/O interfaces for water, electricity, gas, and liquid supply, ensuring simple and efficient on-site installation.
The equipment features a compact and integrated mechanical structure, ensuring stable and reliable long-term continuous operation. It incorporates multiple safety interlock protection mechanisms throughout the entire process to mitigate production risks such as wafer fragmentation and process anomalies. Additionally, it offers highly customized services that allow adjustment of workstation layouts and addition or removal of process modules based on specific customer requirements for particular processes, wafer sizes, or temperature zones, thereby meeting diverse R&D and mass-production needs. This makes it a versatile, high-end coating and development system suitable for wide-spectrum applications, multiple substrates, and various processing techniques.

The STRIPPER (RS12, RS8, RS6) is a dedicated core device for semiconductor stripping processes, compatible with up to 12-inch wafers and adaptable to smaller sizes such as 8-inch and 6-inch wafers, meeting diverse chip production requirements. It supports all types of semiconductor substrates including Si, Glass, Sapphire, GaAs, InP, GaN, and SiC, with its core design optimized for PAD lift-off stripping processes and capable of reliably handling precision manufacturing at line widths ≥1 μm. This equipment is applicable across multiple industries, including power devices (IGBTs), optical communications (VCSELs), MEMS systems, LED chips, and general-purpose integrated circuits for both production and R&D. The system integrates three independent process units—immersion, adhesive removal, and cleaning—with production capacity flexibly adjustable according to customer-specific process cycles, catering to both small-batch laboratory prototyping and large-scale factory production.
The device features a clearly modular layout, comprising an LP wafer cassette station, a six-axis robotic chip-transfer manipulator, an IMM immersion unit, an ST adhesive removal unit, an SR cleaning unit, an integrated liquid supply system, and a main control unit, enabling fully automated dry-in/dry-out wafer handling.
The process temperature control system maintains the set temperature with a stability of ±2°C. The centrifugal motor operates at a maximum no-load speed of 4500 rpm, with a minimum adjustment range of 1 rpm and a speed accuracy of ±2 rpm, ensuring uniformity on the wafer surface after detachment. The CHUCK holding mechanism features multi-point support combined with edge-limiting design, integrated with an MCA automatic mechanical alignment system to effectively reduce risks of fragmentation and misalignment. The waste liquid section incorporates a six-stage filtration and two-stage sedimentation system for metal recovery, enabling efficient utilization of precious process materials, thereby reducing production costs while balancing environmental sustainability and economic efficiency.
The equipment is equipped with a comprehensive set of industrial safety protection mechanisms, featuring continuous video surveillance and real-time flame detection systems, along with dedicated fire extinguishers and robust electrical safety circuits to mitigate production hazards such as chemical exposure, high temperatures, and fire risks at the hardware level. Each process unit incorporates an independent intelligent monitoring module that collects real-time data on temperature, rotational speed, chemical solution flow rate, and robotic arm position; it triggers automatic alarms and shutdowns upon detecting abnormal conditions while maintaining complete operational logs for fault diagnosis and maintenance. The entire pipeline system includes factory-provided liquid supply interfaces and standardized I/O ports for water, electricity, gas, and fluid systems, ensuring convenient and efficient on-site wiring and integration testing.
The system integrates an industrial control computer with a 17-inch touchscreen display, preloaded with the Windows graphical human-machine interface. It supports independent editing, storage, and invocation of process programs, as well as programmable logic for customized process configurations. The communication module incorporates built-in Ethernet and SECS/GEM interfaces, enabling direct integration with factory MES automation systems for device data upload, remote status monitoring, and production line coordination—all fully compliant with semiconductor smart factory standard specifications.
This equipment features a highly integrated mechanical structure and stable operation. Its six-axis, multi-degree-of-freedom manipulator enables precise execution of the entire process—including wafer retrieval, rotation, and transportation—with a smooth wafer-to-wafer transfer mechanism that minimizes risks of chip scratching and contamination. Additionally, it supports customized modifications to accommodate specific chemical solutions, dimensions, or high-precision detachment requirements by adjusting unit configurations or adding/removing filtration modules, making it an exceptionally versatile specialized device for precision semiconductor adhesive removal and detachment.

The SC-6 program-controlled spin coater is specifically designed for precision spin-coating applications in laboratories, capable of processing substrates up to 150 mm in diameter and covering mainstream sample sizes including 2-inch, 4-inch, and 6-inch wafers. The equipment operates within a rotational speed range of 100–12,000 rpm with an adjustment accuracy of ±1 rpm, and acceleration can be freely set between 100–3,000 rpm/s. It supports a maximum single-step operation duration of 3,000 seconds, offering exceptional process customization flexibility.
The device demonstrates excellent uniformity in measured film thickness: when processing 4-inch wafers with AZ1500 photoresist, the intra-wafer variation is ±0.51% and inter-wafer variation is ±1.05%; when preparing 6-inch wafers using SPR220 photoresist solution, the intra-wafer variation is ±1.18% and inter-wafer variation is ±1.86%, ensuring consistent thickness of the photoresist film for stable production that meets high-precision lithography requirements.
The entire unit features a mirror-finish stainless steel exterior and an interior constructed from imported corrosion-resistant materials, providing protection against various photoresist and organic solvent corrosions while ensuring easy cleaning and maintenance. With a compact size of only 292 mm × 380 mm × 246 mm, it is designed for desktop placement without occupying significant laboratory space. Standardly equipped with three vacuum loading trays (10 mm, 25 mm, and 2-inch), it can accommodate samples of different sizes without requiring additional components. The housing incorporates optimized designs to prevent adhesive ingress and clogging, effectively avoiding leakage into motors or pipelines that could cause blockages or damage, thereby extending the equipment's service life.
The device features a 7-inch full-color touchscreen interface for intuitive and user-friendly operation. Its core drive employs an industrial-grade BLDC brushless motor paired with microcontroller-based closed-loop control, ensuring smooth and vibration-free rotational speed output. It supports both single-step and multi-stage operational modes, allowing users to independently edit and store up to 10 complete process programs for one-click retrieval and reuse, significantly simplifying repetitive experimental procedures.
An optional high-precision automatic dispensing module can be upgraded to achieve precise automated gel application, reducing film thickness variations caused by manual dripping and enhancing experimental consistency, making it ideal for long-term standardized R&D experiments.
The SC-6 program-controlled spin coater features a dual safety interlock mechanism: the vacuum switch is interlocked with the chamber lid opening; opening the lid during operation immediately stops the machine to prevent high-speed rotating substrates from flying out, thereby eliminating safety hazards such as debris or adhesive splashing. The entire system employs circuit and motor zoning isolation, providing strong anti-interference performance and ensuring stable, low-noise operation over extended periods.
This spin coater is designed for use in university laboratories, research institutes, and corporate R&D centers, tailored for small-sample applications such as photolithography, thin film preparation, and material coating development. Compared to large-scale mass-production coating systems, the SC-6 Program-Controlled Spin Coater features a compact size, high cost-effectiveness, and easy calibration; its precise rotational speed control combined with excellent uniformity performance strikes an optimal balance between experimental accuracy and operational cost, while supporting customizable upgrades—making it the preferred compact solution for spin-coating processes in semiconductor and optical materials laboratories.

The SC-8 high-precision, program-controlled spin coater can process substrates up to 200 mm in diameter, compatible with various wafer sizes including 2-inch, 4-inch, 6-inch, and 8-inch samples, making it ideal for multi-specification lithography experiments and small-scale pilot production. The equipment operates within a rotational speed range of 20–10,000 rpm with a minimum adjustment increment of 1 rpm, and an acceleration range of 20–50,000 rpm/s. Each processing stage supports operation for up to 3,000 seconds, featuring extensive adjustable speed and acceleration curves tailored to diverse spin-coating requirements for thick or thin films.
The equipment demonstrates outstanding performance in achieving uniform film thickness accuracy: for 4-inch wafers using RZJ304 dilution adhesive, the intra-wafer error is ±0.48% and inter-wafer error is ±0.52%; for 6-inch wafers with AZ1500 adhesive solution, the uniformity error is ±0.71% intra-wafer and ±0.90% inter-wafer; for 8-inch wafers using the same adhesive formulation, the errors are ±0.90% intra-wafer and ±1.08% inter-wafer, ensuring stable film thickness that fully meets high-precision lithographic thin-film preparation standards.
The device features a mirror-like stainless steel housing with an interior constructed from imported corrosion-resistant material, resistant to erosion by various photoresists and organic solvents, ensuring easy cleaning and maintenance. With overall dimensions of 410 mm × 508 mm × 296 mm, its compact design supports embedded installation in a glove box, lowers operational height, and is compatible with special experimental environments such as vacuum or inert gas atmospheres. The unit incorporates a bidirectional rotation function to optimize adhesive layer distribution along wafer edges and minimize residual adhesive issues; it comes standard with three vacuum loading trays (10 mm, 25 mm, and 2 inches) that are ready-to-use for small samples and standard wafers upon opening.
The device employs an industrial PLC as the main controller paired with a high-precision servo motor drive, delivering stable rotational speed output and high process repeatability. It features a 7-inch full-color touchscreen for intuitive operation, enabling straightforward program editing and parameter modification. The system supports storage of up to 100 process files, each containing 100 step-by-step programs; its process logic is freely expandable, and multiple batch experiments can be initiated with a single click, significantly enhancing R&D and mass production efficiency. The unit is equipped with four dedicated automatic dispensing ports, allowing for optional upgrades to multi-channel automated quantitative dispensing modules, eliminating errors associated with manual dispensing and enabling fully automated, standardized spin-coating processes.
The SC-8 high-precision, program-controlled spin coater boasts exceptional scalability and can be equipped with various process modules tailored to customer requirements: an optional back cleaning and edge adhesive removal unit eliminates excess adhesive film on wafer backsides and edges, enabling compatibility with industrial-grade lithography processes; or an integrated splash-proof hood module combining cleaning and development functions, which streamlines operations from spin coating to cleaning and development while consolidating multiple steps and reducing equipment footprint. Its fully modular design requires no modification of the main unit, making it highly adaptable for diverse applications including university laboratories, material research centers, and semiconductor pilot production lines.
The SC-8 high-precision programmable spin coater differs from compact desktop models by combining cutting-edge research accuracy with industrial scalability. Its servo motor ensures long-term operational stability, the stainless steel housing provides chemical corrosion resistance, and the integrated design is optimized for specialized laboratory environments. Widely used in semiconductor lithography, optical coatings, MEMS devices, and new material coating applications, this equipment serves both small-scale experimental research needs and can be equipped with expansion modules to establish miniaturized automated production lines, making it a versatile medium-to-large precision spin coating system that balances cost-effectiveness, precision, and customization capabilities.