Tian Yu Responds to the AI and HPC Wave
Facing the rapid growth of AI and High-Performance Computing (HPC), Tian Yu focuses on advanced manufacturing processes, CoWoS packaging materials, and silicon photonics technologies. From wafer fabrication to semiconductor packaging and testing, Tian Yu provides comprehensive material supply chain solutions.
Tian Yu continues to strengthen and consolidate its market share in advanced materials by developing adhesives and high thermal conductivity materials required for advanced packaging processes. These solutions help semiconductor manufacturers and packaging houses improve process yield and production stability, demonstrating Tian Yu's forward-looking strategy in advanced manufacturing and emerging technologies. In addition, Tian Yu provides one-stop services to support semiconductor manufacturers from design to finished products, promoting low-carbon manufacturing and ESG sustainability while partnering with customers to expand into the global market.
Advanced Packaging Materials Break Through to Enable High-Speed AI Computing
As advanced packaging technologies such as CoWoS and High Bandwidth Memory (HBM) continue to develop rapidly, Tian Yu is actively expanding its advanced materials portfolio to help customers improve packaging efficiency and process yield. Tian Yu has completed the development of underfill materials and thermal management materials required for CoWoS packaging processes. With a comprehensive layout in the advanced packaging market, the company has also received an excellent market response.
In packaging adhesives, Tian Yu showcases packaging materials designed for CoWoS advanced packaging applications, featuring high yield, excellent heat resistance, and high stability. The Underfill material effectively enhances the mechanical strength between the chip and substrate, preventing solder joints from being damaged by thermal stress or external forces, improving package reliability, and providing excellent support and protection for the chip.
Thermal management solutions are also one of the highlights of Tian Yu's packaging thermal solutions area. Tian Yu provides WACKER's high thermal conductivity materials from Germany, with a thickness of 20–40 μm. The material fits closely to the heat spreader, effectively eliminating thermal resistance caused by air gaps and ensuring the stability and reliability of chip operation, further demonstrating Tian Yu's competitiveness in the advanced packaging materials market.
To meet the high-bandwidth signal transmission requirements of AI servers, Tian Yu offers Silane materials featuring excellent heat resistance, low dielectric constant, low transmission loss, and outstanding flame-retardant stability to satisfy the requirements of high-frequency substrate applications. The AI server upgrade trend is driving the rapid growth of high-end printed circuit board (PCB) manufacturing, delivering better performance in high-speed transmission and high-frequency applications while reducing signal loss.
Focusing on Silicon Photonics to Embrace the New Era of High-Speed Computing
With the rapid development of Artificial Intelligence (AI) and High-Performance Computing (HPC), demand for high-speed data transmission continues to increase. Traditional electrical signal transmission is gradually facing the challenges of limited bandwidth and excessive power consumption, making silicon photonics an important solution for overcoming these limitations.
To address the greatest challenge in silicon photonics CPO packaging—precise alignment between optical fibers and semiconductor chips—Tian Yu introduces a high-precision German UV FAU bonding adhesive. The material effectively improves coupling stability, mass production efficiency, and packaging yield. Tian Yu has also established close cooperation with semiconductor foundries, photonics research institutes, and semiconductor assembly and testing companies to help customers accelerate the mass production of next-generation high-speed optical communication and AI chip applications.
Having cultivated the advanced semiconductor materials market for many years, Tian Yu has accumulated extensive experience with TIM 1, Underfill, and UV materials among semiconductor customers. The company expects to achieve even greater success and continue its steady growth.