The 2026 SEMICON Taiwan Semiconductor Show is just around the corner! Teen Yu is all set to make a splash from September 2 to 4 at Booth H23 in Hall 1 of the Taipei Nangang Exhibition Center. Riding the wave of AI and HPC, Teen Yu will focus on advanced processes, CoWos packaging materials, and silicon photonics technology, offering a full supply chain solution from wafer manufacturing to packaging and testing.。
Teen Yu continues to deepen its presence and strengthen its market share in advanced materials, while developing adhesives and high thermal conductivity materials needed for advanced packaging processes. This helps semiconductor and packaging companies improve process yield and stability, showcasing a forward-looking approach in advanced processes and emerging technologies. They are also building a one-stop service to assist semiconductor companies from design to product, promoting low-carbon manufacturing and ESG sustainable operations, and moving toward the global market together with partners.。
High-end packaging materials make a big breakthrough, boosting AI computing power
Facing the rapid development of advanced packaging technologies like CoWoS and High Bandwidth Memory (HBM), Teen Yu is actively expanding its high-end materials portfolio, aiming to help customers improve packaging efficiency and process yield. Teen Yu General Manager,Vincent Lin, pointed out, "For advanced packaging processes like CoWoS, which require materials such as underfill and high thermal conductivity materials, Teen Yu has a complete lineup in the advanced packaging field, and it's been well received in the market.
In terms of packaging materials, TEEN Yu show cases the use of CoWoS advanced packaging, featuring materials with high yield, heat resistance, and stability. The underfill can effectively strengthen the mechanical connection between the chip and the substrate, preventing solder joints from being damaged by thermal stress or external forces, and improving the reliability of packaged products; it also provides good support and protection for the chip.
The cooling solution is also a key highlight of Teen Yu's packaging heat dissipation area this time. Teen Yu provides high thermal conductivity materials from Germany's WACKER, with a thickness of 20–40 microns, closely fitting the heat spreader to effectively eliminate the thermal resistance caused by air gaps, ensuring the stability and reliability of chip operation. This further demonstrates Teen Yu 's competitiveness in the high-end packaging materials market.
In response to AI servers needing high-bandwidth signal transmission, Teen Yu has launched Silane with high heat resistance, low dielectric constant, low loss, and excellent flame-retardant stability, meeting the substrate requirements for high-frequency transmission. 'The AI server upgrade wave is driving the boom in high-end PCB manufacturing. With better performance and lower loss in high-speed and high-frequency applications, we believe there will be explosive growth by 2027.
Focusing on silicon photonics technology, heading into a new era of high-speed computing
With the rapid development of artificial intelligence (AI) and high-performance computing (HPC), the demand for high-speed data transmission has surged. Traditional electronic signal transmission is gradually facing bottlenecks due to insufficient bandwidth and high power consumption. "Silicon photonics" has become an important solution to break through these limitations.
One of the biggest challenges in silicon photonics packaging is the precise alignment between chips and optical fibers. Teen Yu has introduced a high-precision Germany's HOENLE UV adhesive, which can effectively improve coupling stability, mass production efficiency, and packaging yield. The company has been working closely with wafer foundries, optoelectronic research institutions, and major testing and packaging companies to help customers accelerate the mass production applications of next-generation high-speed optical communication and AI chips.。
TEEN YU has been cultivating advanced semiconductor materials for many years, from TIM 1, Underfill to UV materials, and has already accumulated extensive achievements with semiconductor clients. It's expected that by 2026, the full-year revenue and profits will reach new heights and continue to grow.