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Tokyo Diamond Tools Mfg. Co., Ltd.

目黒区,  東京都 
Japan
https://www.tokyodiamond.com/
  • Booth: Q6134

歡迎蒞臨東京鑽石工具製作所展位,探索高精度鑽石工具與先進加工解決方案,共創半導體製造新價值,期待與您交流,攜手開拓商機。

Overview

東京鑽石工具製作所 公司簡介

以鑽石科技驅動精密製造創新

東京鑽石工具製作所(Tokyo Diamond Tools Mfg. Co., Ltd.)創立於1932年,是日本歷史悠久且具代表性的專業鑽石工具製造企業之一。創業九十餘年來,公司始終專注於鑽石與CBN(立方氮化硼)超硬工具的研發、生產與銷售,致力於為全球製造業提供高精度、高效率及高可靠性的加工解決方案。總部位於日本東京都目黑區,在日本及海外設有多個生產、研發及銷售據點,產品廣泛應用於半導體、電子元件、汽車零組件、精密機械、醫療器材、光學元件及建築工程等產業。 

自成立以來,東京鑽石工具製作所始終秉持技術創新精神,將鑽石材料卓越的硬度、耐磨耗性及加工性能發揮至極致,透過「切割、研削、研磨、鑽孔」等核心技術,協助客戶提升產品品質、生產效率與製程穩定性。如今,公司已發展成為日本超精密加工領域的重要品牌,並持續向全球市場提供高附加價值的技術服務。 

深耕超硬工具領域九十餘年

東京鑽石工具製作所的歷史幾乎與日本現代精密工業的發展同步。自1932年創業以來,公司不斷因應產業升級與技術革新需求,持續投入研發資源,累積豐富的超硬材料加工經驗。從早期機械加工產業,到近代電子、資訊通訊及半導體產業快速崛起,公司皆站在技術發展最前線,提供關鍵加工工具與製程支援。 

多年來,公司憑藉精湛技術與穩定品質,在日本市場建立良好聲譽,並逐步拓展亞洲及全球市場。除了日本本土銷售網絡外,亦於泰國、新加坡等地建立海外據點,提供更即時的技術支援與客戶服務,滿足國際客戶日益增長的需求。 

全方位產品與解決方案

東京鑽石工具製作所提供完整的鑽石及CBN工具產品系列,包括:

  • 鑽石砂輪(Diamond Grinding Wheels)
  • CBN砂輪
  • 電鑄砂輪(Electroplated Wheels)
  • 切割刀具與切斷輪
  • 鑽石鑽頭與鑽孔工具
  • 單晶鑽石切削工具
  • 修整工具(Dressers)
  • 特殊客製化加工工具

上述產品可廣泛應用於矽晶圓、化合物半導體、陶瓷、玻璃、藍寶石、超硬合金、碳化矽(SiC)、氮化鎵(GaN)、石英及高硬脆材料等加工領域。 

除了標準產品之外,公司更重視客戶個別需求,透過客製化設計與共同開發模式,針對不同材料、設備與加工條件,提供最佳化工具方案,協助客戶解決實際生產問題,提升良率與降低成本。 

半導體產業的重要合作夥伴

隨著人工智慧、5G、高效能運算及電動車市場快速成長,半導體產業對於超精密加工技術的要求日益嚴苛。東京鑽石工具製作所在半導體領域長期累積深厚經驗,其工具廣泛應用於晶圓切割、晶圓研磨、封裝基板加工及先進材料製程。

尤其面對第三代半導體材料如SiC與GaN加工難度高、工具磨耗大等挑戰,公司持續開發高性能鑽石工具與創新製程技術,以滿足先進半導體製造對精度、效率及表面品質的要求,成為眾多半導體及電子產業客戶的重要合作夥伴。 

堅持技術研發與品質創新

技術力是東京鑽石工具製作所最核心的競爭優勢。公司設有技術研究機構及研發團隊,持續投入新材料、新製程及新工具開發,並與客戶共同研究加工課題。透過材料分析、加工測試及實際生產驗證,不斷提升產品性能與使用壽命。 

多年來,公司累積大量超硬材料加工知識與應用數據,能夠根據客戶需求提供完整技術諮詢服務,從工具選型、加工條件優化到量產導入,提供一站式解決方案,協助客戶縮短開發時間並提升市場競爭力。 

ESG與永續經營理念

東京鑽石工具製作所認為企業成長應與環境永續並行。公司經營理念強調「為自然循環作出貢獻」,在追求技術進步與商業成長的同時,也持續推動環境保護、能源節約及資源有效利用。

透過提升工具壽命、改善加工效率及降低材料浪費等方式,公司幫助客戶減少製造過程中的能源消耗與環境負荷,實踐綠色製造理念。此外,公司亦積極履行企業社會責任,致力於建立安全、健康、值得信賴的工作環境,促進企業與社會共同發展。 

面向未來的全球發展

面對數位化、智能製造、人工智慧及新能源產業快速發展的新時代,東京鑽石工具製作所持續強化全球布局,深化研發能力,並積極開拓半導體、電子元件、新能源車、醫療及高端精密製造等成長市場。 

未來,公司將持續以「超越客戶期待的解決方案供應商」為目標,結合九十餘年的技術積累與創新精神,提供更高效率、更高精度及更具永續價值的加工工具與技術服務,攜手全球客戶共同推動先進製造產業發展。

東京鑽石工具製作所,運用鑽石的力量,連結尖端科技與未來製造。


  Press Releases

  • (Jul 16, 2026)
  • (Jul 16, 2026)

  Products

  • “VEGA” Porous Vitrified Bond Wheel for Wafers Fini
    Higher surface roughness realized by intermediate processing and final processing of SiC and GaN wafers
    ■Higher surface roughness
    ■Spontaneous blade generation...

  • Longer wheel life in "rough machining" prior to surface grinding of SiC wafers

    [Issues in rough machining of SiC wafers]

    The production of compound semiconductor wafers, which are used as substrates for power devices, is expected to grow steadily in the trend toward power saving in a low-carbon society. The key to this growth is the processing cost of wafers, which requires a longer wheel life due to the large amount of allowance in the rough machining prior to surface grinding.
     

    [Solution with porous vitrified bond wheel]

    Our porous vitrified bond wheel "VEGA" has both a larger pore diameter and a higher porosity than conventional wheels, maximizing the biting performance to work materials. It is particularly suitable for surface grinding of SiC wafers and can grind 6" SiC wafers without dressing. The excellent wear resistance increases the number of wafers that can be machined per wheel and contributes to the reduction of wafer machining costs.
  • Diamond notch wheel for semiconductor wafers
    This wheel is used for chamfering and finishing the notch of semiconductor wafers.
    The runout accuracy of the diamond layer to the shank is excellent due to our original processing technology....

  • Diamond notch wheel for semiconductor wafers

    This wheel is used for chamfering and finishing the notch of semiconductor wafers. The runout accuracy of the diamond layer to the shank is excellent due to our original processing technology. In addition to silicon wafers, we also provide wheels with various specifications for compound semiconductor wafers such as SiC (silicon carbide) and LT (lithium tantalate), which are becoming larger nowadays, and for quartz wafers.
     

    [Applicable materials for diamond notch wheels]

    Silicon, SiC (silicon carbide), LT (lithium tantalate), LN (lithium niobate), Quartz, and Sapphire

    ■Grain size : #400 - #3000
    *It is possible to manufacture wheels usable for both roughing and finishing.
    Outer diameter : Up to φ4 ( Groove bottom diameter Min φ2 )
    ■Shank diameter tolerance : h6
    ■Total length : Up to 35L
    ■Deflection accuracy : ≥  5 um @Min
    ■Groove angle tolerance: Tolerance ≥ 0.5 degrees (one side angle)
    ■Number of grooves : Up to 5 grooves

  • Diamond wheels for edge grinding semicon wafers
    This wheel is used for edge grinding (beveling) semiconductor wafers....

  • Diamond wheels for edge grinding (beveling) semiconductor wafers

    This wheel is used for edge grinding (beveling) semiconductor wafers.
    We offer "ME" bond for wheels for chamfering silicon wafers with excellent sharpness and high maintenance of groove shape. The finished surface roughness is excellent, and the amount of polishing after chamfering is reduced, leading to lower total processing costs by reducing the post-process time and consumables.

    For wheels for chamfering SiC and sapphire wafers, we offer bond wheels with excellent sharpness and grinding durability. Electrodeposition bond chamfering wheels are also available for small and medium volume production.

    For wheels for chamfering LT and LN wafers, we offer bond specifications that suppress the occurrence of chipping on brittle wafers.

    In addition to general R-shaped (round/full round) and T-shaped grooves, special shapes such as asymmetrical shapes are also covered, so please consult with us.
     

    [Applicable materials for diamond beveling wheels]

    Silicon, SiC (silicon carbide), Sapphire, LT (lithium tantalate), LN (lithium niobate), GaN (gallium nitride), GaAs (gallium arsenide), and Quartz
  • Diamond blade for package board cutting
    Precision blade for cutting package boards....

  • Diamond blade for package board cutting

    Precision blade for cutting package boards.
    We offer a rim saw type blade with a metal base (base metal) and an all-blade type.
    Metal bond blade with good sharpness and cutting quality.
    Stable sharpness without deterioration due to copper adhesion prevents cracking and chipping of package boards.

    Depending on the blade thickness and particle size, the V-face shape of the cutting edge has the effect of suppressing the occurrence of initial chipping of the board.
    We can also offer a dress board for dressing blades and propose the most appropriate dress board for the blade specifications.
    It is widely used for machining of not only package boards, but also laminated ceramics, magnetic materials, and optical glasses.

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