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LiVe Optronics Company Limited

  • Booth: T9404

Lighting up the future with advanced laser chips

Overview

LiVe Optronics Company Limited is a Taipei-based laser-chip design company delivering advanced laser chips for optical communication and precision sensing. Partnering with Taiwan's leading academic photonics laboratories and leveraging Taiwan's mature compound-semiconductor supply chain, we are committed to high-quality volume manufacturing of advanced laser chips in Asia.

Our portfolio covers two core product lines. Our 850 nm VCSEL arrays span 25 Gb/s to 224 Gb/s PAM-4, designed for 400G / 800G / 1.6T Ethernet, AI high-speed transport and active optical cables. Our 1310 / 1550 nm DFB lasers provide high-power CW and narrow-linewidth sources for silicon-photonics integration, co-packaged optics (CPO), FMCW LiDAR and long-reach optical communication.

Built on in-house III-V photonic chip design, close academic collaboration and deep supply-chain integration, LiVe Optronics enables the high-power, high-reliability laser light sources at the heart of the AI era.


  Press Releases

  • 徠晶光電股份有限公司(LiVe Optronics)今日宣布參加 SEMICON Taiwan 2026,將於晶片新創特區(Silicon Startups Zone,攤位 T9404,南港展覽館二館 7 樓)展出,並於展期 9 月 2 至 4 日在 Silicon Startups Stage 進行專題發表。

    隨著 AI 資料中心邁向矽光子與共封裝光學(CPO),外部連續波(CW)雷射光源已成為光連結中關鍵且供給受限的元件——其輸出功率、效率、噪聲與免製冷可靠度,直接決定整個光引擎的表現與成本。徠晶光電專注於解決此瓶頸,與台灣頂尖學術光電實驗室合作,並善用台灣成熟的化合物半導體供應鏈,實現亞洲高品質量產。

    展出產品亮點

    高功率 1310 nm CW-DFB 雷射:由 100 mW 級到超高功率 >350 mW 級,免製冷操作 −5 ~ 85 °C(無需 TEC)、轉換效率(PCE)達 30 %、邊模抑制比 50 dB,作為矽光子收發模組與 CPO 的外部光源(ELS)。

    • 1550 nm 窄線寬 CW-DFB 雷射:實測線寬約 50 kHz,25 °C 輸出功率達 94 mW、SMSR 高達 55 dB,適用於 FMCW LiDAR 與長距離同調光通訊。

    • 850 nm 高速 VCSEL 陣列:涵蓋 25 Gb/s 至 224 Gb/s PAM-4;112 Gb/s 元件於 25 °C 展現 25.7 GHz 小訊號頻寬、於 800G 光模組 TDECQ 低於 2.0 dB,適用於 400G/800G/1.6T Ethernet、AI 傳輸與 AOC 主動光纜。

      徠晶光電代表人表示:雷射光源是 AI 光通訊世代真正的瓶頸。我們的使命,是讓高功率、高可靠度的雷射晶片能從亞洲供應鏈穩定供給。此次於 SEMICON Taiwan,我們將分享實測成果,以及邁向 224 Gb/s VCSEL 與超高功率 1310 nm CW-DFB 的產品藍圖。

    關於徠晶光電

    徠晶光電股份有限公司是一家總部位於台北、以設計雷射晶片為主的公司,為光通訊與精密感測提供先進 VCSEL 與 DFB 雷射晶片。公司與台灣頂尖學術光電實驗室合作,並善用台灣成熟的化合物半導體供應鏈,致力於亞洲先進雷射晶片的高品質量產。更多資訊請見 www.liveoptronics.com。


  Products

  • 25Gb/s 850nm VCSEL
    25Gb/s 850nm VCSEL...

  • LiVE's high-speed multimode VCSEL array is specifically designed to meet the demand for high-speed data communication. The VCSEL is available in 1×1 chips or 1×4 arrays for the development of single-channel and parallel fiber optical communication links. The device emits multiple transverse modes with low spectral width and a circularly symmetric beam with low divergence, enabling efficient optical coupling into 50‑μm/125‑μm multimode fiber with high optical power and superior dynamic performance across wide temperature ranges.
  • 53Gb/s 850nm PAM-4 VCSEL
    53Gb/s 850nm PAM-4 VCSEL...

  • 53Gb/s PAM-4 (26.56GBaud) 850-nm Oxide GaAs based Chip/Array Multi-mode VCSEL designed for high-speed data communication. The device supports single-channel and parallel fiber optical communication links with multiple transverse modes, low spectral width, and circularly symmetric beam output for efficient coupling into standard multimode fiber.
  • 106Gb/s 850nm PAM-4 VCSEL
    106Gb/s 850nm PAM-4 VCSEL...

  • 106Gb/s PAM-4 (53GBaud) 850-nm Oxide GaAs based Chip/Array Multi-mode VCSEL designed for next-generation high-speed data communication. Available in 1×1 chips or 1×4 arrays, the device delivers multiple transverse modes with low spectral width and circularly symmetric beam with low divergence for efficient coupling into multimode fiber.
  • High Power 1310nm CW-DFB Laser
    High Power 1310nm CW-DFB Laser...

  • This series is a high-power, single-mode, edge-emitting Distributed Feedback (DFB) laser diode chip designed for uncooled operation in O-band applications. The facets are coated with an anti-reflection (AR) coating on the front facet and a high-reflection (HR) coating on the rear facet. Designed for high reliability, this chip is suitable for use in non-hermetic environments and silicon photonics (SiPh) integration.
  • 400 mW Ultra High Power 1310nm CW-DFB Laser
    400 mW Ultra High Power 1310nm CW-DFB Laser...

  • The series is a high-power, single-mode, edge-emitting Distributed Feedback (DFB) laser diode chip, specifically engineered for high-performance O-band applications. This chip is optimized for high-density Silicon Photonics (SiPh) optical transceivers and Co-Packaged Optics (CPO) integration. To maximize output efficiency, the facets are processed with an advanced anti-reflection (AR) coating on the front and a high-reflection (HR) coating on the rear. Built for superior reliability, the DFB Laser is designed for robust operation in non-hermetic environments, making it an ideal light source for next-generation, high-speed optical interconnects.
  • Narrow Linewidth 1550nm DFB Laser
    Narrow Linewidth 1550nm DFB Laser...

  • The Narrow Linewidth 1550nm DFB Laser chip is an edge-emitting laser designed for eye-safety LiDAR and advanced sensing applications. The device delivers single-mode operation with low noise and narrow linewidth performance characteristics suitable for demanding optical applications including FMCW-LiDAR and optical sensing technology.

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