Mixx Technologies : I2923
SxC ultra-high-density connector
Overview
Mixx Technologies — SEMICON Taiwan 2026
Connecting Intelligence
Mixx Technologies was incorporated in 2023 by the team that took multiple optical products to volume. Mixx builds full-stack optical interconnect for AI data center infrastructure, solving the biggest bottleneck in scaling AI: moving data as fast as accelerators can process it.
AI compute is scaling faster than the interconnect that feeds it. Each generation of accelerators arrives with greater processing power and a larger appetite for data movement, and each meets the same physical limits.
Mixx addresses bandwidth density, energy efficiency, and manufacturability together, designing the optical path as one integrated system. Our products share the 5DS Platform, a unified design foundation spanning optics, electronics, packaging, and control software.
OUR PRODUCTS:
sXc™ is our ultra-high-density EBO connector, moving maximum fiber count through minimum aperture. One architecture serves backplane, front panel, patch panel, and shuffle box applications.
HBxIO™ is our silicon level optical engine, bringing photonics progressively closer to the compute die to raise bandwidth density and lower energy per bit.
STxIQ™ is our software platform, delivering link management, telemetry, calibration, and diagnostics so operators can monitor, tune, and trust photonics in production.
Mixx is headquartered in the United States, with operations in Hsinchu, Taiwan and Bangalore, India.
Visit Mixx at Booth I2923 for the public debut and live demonstration of sXc™.
sXc™ — Ultra-High-Density EBO Connector
Key features:
- Ultra-high fiber density in a compact EBO form factor
- One connector architecture serving backplane, front panel, patch panel, and shuffle box applications
- Ultra High Radix
- Robust Reliability
Write to us at: [email protected]