Taiwan Kong King, Co., Ltd.

1. EA up1200 (Hydrogen-Activated Fluxless Reflow Furnace)

• Maximum Process Temperature: 400°C / Temperature Uniformity: ±2°C
• Maximum Substrate Size: 12.8(L) × 12.8(W) inches
• Specifications：A. Wafer Size: 8" & 12" / B. Dimensions (W × D × H): 356 × 119 × 196 cm

2. UP1200 (8"/12" Wafer Bump Reflow Furnace)

• Maximum Process Temperature: 400°C / Temperature Uniformity: ±2°C
• Maximum Substrate Size: 12.5(L) × 12.5(W) inches
• Specifications：A. Wafer Size: 8" & 12" / B. Dimensions (W × D × H): 295 × 117 × 201 cm / C. Weight: 680 kg

3. FALCON 8500 (Optimized for 8" Wafer Bump Reflow)

• Maximum Process Temperature: 400°C / Temperature Uniformity: ±2°C
• Maximum Substrate Size: 8(L) × 11(W) inches
• Specifications：A. Wafer Size: 8" / B. Dimensions (W × D × H): 251 × 61 × 117 cm

4. FAlcon 1200 (Optimized for 12" Wafer Bump Reflow)

• Maximum Process Temperature: 400°C / Temperature Uniformity: ±2°C
• Maximum Substrate Size: 11.8(L) × 11.8(W) inches
• Specifications：A. Wafer Size: 12" / B. Dimensions (W × D × H): 164 × 61 × 114 cm

5. FAlcon 5c (Benchtop Reflow Furnace)

• Maximum Process Temperature: 400°C / Temperature Uniformity: ±2°C
• Maximum Substrate Size: 5(L) × 5.75(W) inches
• Dimensions (W × D × H): 135 × 64 × 66 cm

• 6. FAlcon ICS412 (In-Line Wafer Coating System)

• Designed for wafer bump flux coating applications, programmable servo-driven rotation speed: 1–2000 rpm
• Maximum Substrate Size: 11.8(L) × 11.8(W) inches
• In-line transport design compatible with various automation systems, including robotic arms, wafer handling systems, and other transfer equipment
• Specifications：A. Wafer Size: 4"–12" / B. Dimensions (W × D × H): 109 × 107 × 104 cm

1. Carrier Cleaner

• Uses DI Water (DIW) throughout the entire cleaning process.
• Suitable for cleaning carriers such as FOUP/FOSB, Magazine, Boat/Jig, Frame/Tray, Cassette, Frame CST, and Tray CST.
• High-pressure nozzles combined with software enable targeted cleaning.
• Adjustable nozzle angle and spray direction.
• Reduces process contamination.
• Saves up to 30% of floor space.
• Effectively removes particles, AMC, residual photoresist, and adhesive residues.

2. Wafer Flux Cleaner

• Designed for advanced packaging wafer cleaning processes.
• Equipped with nano-atomizing nozzles and matrix cleaning technology.
• Provides high-pressure or atomized cleaning according to product type and feature pitch.
• Enhanced localized cleaning capability based on process requirements.
• Cleans gaps as small as ≤ 40 μm.
• Targeted cleaning capability.
• Interchangeable nozzles to meet process requirements.
• Hybrid cleaning capability.

3. Die form cleaner

• Designed for 2.5D and 3D packaging processes for flux residue removal.
• Uses DI Water (DIW) throughout the entire cleaning process.
• Fully automated cleaning operation can be configured.
• Adjustable base plate tilt angle.
• Targeted cleaning capability.
• Adjustable nozzle angle.
• Cleans gaps as small as ≤ 40 μm.

1. Wafer Sorter

• High-cleanliness, high-performance wafer sorting system with flexible configurations to meet various application requirements: Infinite Freedom Series.
• Supports GEM300 communication protocol and automation standards.
• Equipped with an AC servo control system for high-speed and stable wafer handling operations.
• Flexible customized configurations.
• High-cleanliness environmental control.
• High-rigidity drive mechanism.

2. Wafer efem

• Provides automation integration services for semiconductor manufacturing equipment and can be configured with front-end automation modules for different wafer sizes.
• Compact footprint design.
• Equipped with an AC servo control system for high-speed and stable wafer handling operations.
• Flexible customized configurations.
• High-cleanliness environmental control.
• High-rigidity drive mechanism.

3. Panel EFEM

• Provides automation integration services for semiconductor panel manufacturing equipment and can be configured with front-end automation modules for different panel sizes.
• Compact footprint design.
• Equipped with an AC servo control system for high-speed and stable wafer handling operations.
• Flexible customized configurations.
• High-rigidity drive mechanism.

Features

• High-Speed Testing at Up to 100 points/sec.
• Featuring newly designed probes and precision control for half the impact mark depth of previsous designs.
• Rapid testing, regardless of board type: Easily position the target board and start testing, even for thin-film boards and thick, round boards.
• High-speed pattern testing using capacitance measurement.
• Methods for calculating the number of test steps.

1. mk-BP5000(Ball Placer/Ball mount)

• New Transfer System: Dual Table transfer system enables stable quality control and high productivity.
• Exclusive Technologies: Equipped with a rotary squeegee system and cyclone-type ball placement head for enhanced placement performance.
• Applicable Solder Ball Size: φ60 μm ～ φ600 μm (Other sizes available upon request.)
• Features: Automatic solder ball feeding system. / Automatic flux supply system.

2. mk-BP5000IR(Ball Inspection & Rework)

• New Transfer System: Dual Table transfer system achieves stable quality and high-speed production.

  Solder Ball Inspection System: High-speed and high-precision inspection capability.

  Solder Ball Rework System: Supports solder balls from φ45 μm ～ φ600 μm.
  Repairs missing balls, duplicated balls, positional shifts, and other placement defects.

  Repeatability Accuracy: ±10 μm

3. MK-D13(Printer)

• Solder Ball Forming Stencil Printer.

  Multi-Chip Printing Capability: Simultaneous printing of multiple units (Max. 60 pcs/tray). Enables multi-unit printing on a single PCB carrier tray.

  High Precision(±15 μm): Individual unit position correction through advanced image recognition technology.(Multi-unit alignment printing accuracy: ±25 μm.)

  High Throughput(UPH: Over 1,000 units.): Using a tray configuration of 50 pcs, achieves approximately 1.4× higher throughput compared with conventional equipment (maximum 24 pcs).

  Optional Feature: Rotary squeegee system available.