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Chroma ATE Inc.

Taoyuan City,  Taiwan
https://www.chromaate.com
  • Booth: K2576

Empowering future technologies for a better world

Overview

Founded in 1984, Chroma ATE Inc. is a world leading supplier of precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test & automation turnkey solutions marketed globally under the brand name "Chroma".

Significant markets served by Chroma include semiconductors, photonics, LED, photovoltaics, video & color, flat panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles, thermoelectrics, automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries.

Chroma has branch offices in Europe, the United States, Japan, Korea, China and Southeast Asia, chartered to fulfill and surpass global customers' needs with high value-added service.

At Chroma, we believe in the truth of measurements and the trust of partnerships. Using the most advanced solutions, we test and measure the quality of clients' products with ambition of making them better, more effective, and ultimately thriving in the marketplace. By delivering truth in constructive, open, and trusted partnerships, we enable the development of innovative products for the betterment of society and the world.

At Chroma, 
we advance excellence.


  Products

  • Chroma SoC Test System-3680
    Chroma’s 3680 SoC Test System offers flexible configurations and broad test coverage, enabling multiple device types to be tested on a single platform. Designed for high-throughput, high-parallel testing, it is ideal for fabless, IDM, and test houses....

  • Chroma's SoC Test System, the 3680, provides flexible configurations and a wide range of coverage, enabling you to test various device types on a single platform.

    The system is specifically designed for high-throughput and high parallel testing ability to provide the best solution for fabless, IDM and testing houses.

    With comprehensive test capability, high accuracy, powerful software, and excellent reliability, the 3680 is ideal for testing consumer devices, high-performance microcontrollers, analog devices and SoC devices.

    ■ 24 interchangeable slots for digital, analog and mixed-signal applications

    ■ Data rate up to 1Gbps

    ■ Up to 2048 sites parallel test

    ■ Up to 2048 digital I/O pins

    ■ 256 MW vector memory (512 MW option) (X2 mode)

    ■ Up to 64 CH PMU for high precision measurement

    ■ Per-pin timing measurement unit/PPMU/frequency measurement

    ■ SCAN up to 64 chains/16G depth

    ■ Edge placement accuracy (EPA): ±150ps

    ■ Up to 128 CH high density DPS32

    ■ High density HDADDA2 mixed-signal option

    ■ Efficient high power HCDPS analog option

    ■ High performance HDAVO option

    ■ High density HDVI analog option

    ■ High density HDRF2 option

    ■ Direct probing system*

    ■ Multi-time domain function*

    ■ Microsoft Windows® 10 OS

    ■ C#.NET and GUI programming interface

    ■ CRISPro, full suite of intuitive software tools

    ■ Test program and pattern converters for other platforms

    ■ Accept PIB and probe card of other testers directly

    ■ Support STDF data output and customized data format

    ■ Air-cooled, small footprint tester-in-a-test-head design

  • 7980/7981/7990 2D/3D WLP/PLP Metrology System
    Chroma’s WLP/PLP Measurement System uses White Light Interferometry (WLI) for nanoscale, non-destructive 3D metrology, enabling precise measurement of probe marks, VIAs, and RDLs for advanced packaging....

  • Chroma 2D/3D WLP/PLP Metrology System is built on patented BLiSTM technology, enabling nanoscale, non-destructive, and fast surface profile measurement and analysis. This 3D optical metrology technology delivers highly accurate and reliable profile data, specifically designed for advanced packaging applications.

    The system supports flexible integration of multiple probe types based on application requirements. In addition to the standard WLI (White Light Interferometry) probe, it can also be equipped with COLOR CONFOCAL, AFM, DUV, Reflectometer, and other probes to accommodate various specialized inspection tasks. Combined with a high-precision scanning system and innovative algorithms, it enables detailed surface profiling of micro- and nanoscale structures.

    The system features a high-precision active vibration isolation platform and a high-resolution XYθ motion stage, achieving sub-micron resolution in horizontal directions. This allows for extremely accurate observation and positioning of microstructures. The vibration isolation platform effectively eliminates the influence of external vibrations on measurement accuracy, while the fast momentum-balancing mechanism enables rapid and stable positioning between different measurement points, significantly enhancing throughput. In addition, the system offers a wide vertical and horizontal scanning range, making it suitable for fully automated measurement applications. Samples can be measured directly without any pre-treatment, supporting non-destructive, high-speed surface topography analysis—ideal for R&D, production, and process optimization environments.

    Equipped with a long-travel, ultra-precise Z-axis module with up to 60 mm travel, the system provides flexible adjustment capabilities for samples of various heights and thicknesses. The combination of ultra-high positioning accuracy and a fast auto-focus algorithm helps users quickly find the optimal focus point, improving usability and operational efficiency. The integrated QCM (Quality Control Management) system offers self-diagnostic and performance monitoring functions, enabling real-time system status tracking and ensuring measurement stability and reliability.

    For calibration, the system's measurement results are traceable to NIST standards, offering a high level of accuracy that complies with international measurement norms. The system includes built-in 3D profile analysis tools, supporting both 2D and 3D graphical displays, allowing users to intuitively observe and analyze dimensional features of interest. Additionally, the large-area image stitching function supports broader industry requirements for various sample types, enhancing overall application flexibility and efficiency.

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