AEM Singapore Pte. Ltd.

AMPS-High Parallel Test Cell Series is a high-power, high-throughput automated high-parallel test system designed for advanced semiconductor devices. Powered by AEM’s patented PiXLTM intelligent thermal management technology, AMPS series delivers precise, scalable thermal control for the most demanding test environments.

Key benefits:

Fully automated modular system – Capable of simultaneous high voltage stress testing of hundreds of devices in parallel.
Patented Multi-zone Intelligent Thermal Control (ITC). Scalable to >2KW per device, with precision control for thermal stability during test.
Purpose-built test instrumentation – Optimized to deliver higher device yield and shorter test times.
Individual device test control and instrumentation allow for asynchronous operation, pattern changing on the fly, and high system utilization.

PiXLTM – Ensures thermal accuracy and stability for high-power devices, improving test reliability, yield, and throughput. 

Know more about AMPS:
https://aem.com.sg/solutions/burn-in-solutions/

CWP is a unique system for wafer-level testing of cryogenic quantum devices, electronics, and detectors. As a probing solution for up to 12” wafers, it enables testing in sub-2K temperatures. The system provides a means for fast sample characterization with a throughput up to 100 times faster than commonly used cryogenic chambers as well as the possibility for volume probing of entire 300mm wafers.

Together with Afore’s low-temp probe cards our unique active alignment system allows users to locate and contact devices automatically anywhere on the wafer.

A modern and intuitive user interface provides direct control and full overview. The 4 servo-controlled axes of the probe station can be switched off during measurements to minimize electronic noise and the load lock system allows fast wafer to change in cryogenic temperatures.

The CWP was developed as a cooperation between Afore and Bluefors, the Finnish company for “dry” cryogenic cooling.

ATOM-IC Handler, the small footprint fits easily on a test bench or over any ATE tester with a custom roll cart designed and built to fit your tester. With its simple and reliable configuration, accuracy and repeatability are optimized.

Key benefits:

• Lightweight, compact and versatile
• Cost effective and lower overhead costs
• Replaces Hand Test
• Extremely Accurate Active Thermal Control to perform tri temp testing and device characterization
• Benchtop and ATE Support
• Highly customizable and configurable to any test setup
• Easy to use computer interface

NESTEK PIN can be produced with barrel outer diameter of ø0.15~7.0 and length of 1.5~93.0mm.

It is used for O/S (Open, Short) test, function test, and SLT test of various semiconductor packages including BGA, LGA, QFN, QFP, as well as various types of inspection of various camera modules and display modules.