Welcome to TAKAI Buffing Solution for de-flash process
Overview
Company Introduction
KD Group was established in 2008 and comprises four subsidiaries: COSEI Technology, Takai Precision, GOTEX Electroptic, and TAKANAMI Trading. Our business scope covers PCB and substrate buffing consumables, buffing equipment for PCB, substrate, and IC packaging applications, as well as contract manufacturing and operations in China.
With over a decade of experience in grinding-related technologies, we are capable of delivering professional and practical solutions tailored to customer needs. Maximizing product value is one of our core strengths, while our efficient and flexible service capabilities have enabled us to stand out in the industry and earn a strong reputation as a grinding solution expert.
Solution Offering
We provide professional solutions for the removal of resin burrs and package overflow in QFN/DFN and other package types. Our technology serves as an alternative to conventional chemical deflash (CD) processes, effectively reducing environmental impact, secondary contamination, and post-treatment challenges.
Products