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ACE Solution Co., Ltd.

Jhubei City,  HsinChu County 
Taiwan
https://www.acesystek.com/web/index/index.jsp
  • Booth: L0609

Welcome to ACE Solution! Explore Semi, SiPh & Thermal test.

Overview

About ACE Solution

ACE Solution specializes in high-end system integration across semiconductor testing, Silicon Photonics (SiPh), high-speed digital, and wireless communications. Leveraging cross-disciplinary engineering expertise, custom test fixtures, and modular software platforms, we deliver comprehensive non-destructive failure analysis (FA), material analysis (MA), and high-throughput final test (FT) solutions. Addressing high-power chip and heterogeneous integration trends, we provide industry-leading micro-area thermal characterization, optical alignment, and high-frequency electrical/optical test architectures to optimize CapEx, elevate equipment utilization, and accelerate time-to-market.

SEMICON Taiwan 2026 Showcase Highlights

  1. Automated SiPh & CPO Test
    • Quantifi Photonics: Modular, high-density PXIe optical test solutions for Silicon Photonics and CPO transceiver validation.
    • Nexustest: Next-generation 1.6T 224G/lane optical module test platform integrating BERT, DCA, and CRU for high-throughput characterization.
    • YONATA: Nanometer-precision active optical alignment systems for wafer-level and package-level SiPh coupling.

  1. FA / MA Thermal Analysis
    • TherMap: Advanced TDTR/FDTR opto-thermal metrology for micro-area 3D thermal conductivity and interfacial thermal resistance analysis.
    • QFI (Quantum Focus Instruments): High-resolution thermal imaging and hotspot diagnosis for IC design and advanced packaging.

  1. Wafer & Advanced Packaging Non-destructive FA / MA / FT Test
    • TZ-Series: Non-destructive, non-contact Terahertz (THz) time-domain spectroscopy for wafer thin-film, dielectric, and internal 3D structural defect inspection.
    • EOTPR: Sub-micron electro-optical terahertz pulse reflectometry for non-destructive fault localization in 2.5D/3D ICs and advanced substrates.

  1. Compound Semiconductors

    • Teradyne ETS: High-precision test platforms for GaN & SiC power modules, power discrete devices, and mixed-signal PMICs, delivering high-voltage/high-current solutions for Final Test (FT) and Failure Analysis (FA).

  Press Releases

  • [Taipei, August 24, 2026] Driven by the surge in AI, HPC, and heterogeneous integration, chips face critical challenges in thermal bottlenecks, signal integrity, and yield. With over 20 years of test integration expertise, ACE Solution, alongside ACE Systemtek, will exhibit at SEMICON Taiwan 2026 (Sept. 2–4). The group provides turnkey solutions, from TDTR/FDTR thermal metrology and THz inspection to 1.6T SiPh/CPO testing and compound semiconductor characterization, helping clients overcome process bottlenecks, shorten FA/MA cycles, and optimize CapEx.

    Key Exhibition Highlights

    1. 1.6T SiPh & CPO Testing:
      1. Quantifi Photonics: Modular PXIe electro-optical platform bridging R&D to mass production.
      2. Nexustest 1.6T Platform: 8×224G BERT, DCA, and CRU with liquid-cooled MCB for high-speed transceivers.
      3. YONATA System: Multi-axis active optical alignment for high-efficiency SiPh coupling.
    2. FA/MA Thermal Analysis:
      1. TherMap Metrology: Dual-laser TDTR/FDTR non-destructive 3D thermal conductivity and interfacial resistance testing for 2.5D/3D ICs.
      2. QFI Thermal Imaging: High-resolution hotspot detection and die-level thermal mapping.
    3. Non-Destructive Packaging & Wafer Inspection:
      1. TZ-Series Terahertz System: Non-contact 3D structural defect and dielectric analysis.
      2. EOTPR System: Sub-micron non-destructive fault isolation for 2.5D/3D ICs, TSVs, and flip-chips.
    4. Compound Semiconductor Testing:
      1. Teradyne ETS Platform: High-voltage/high-current FT and FA testing for GaN, SiC, and PMICs.

    Partner Collaboration: TherMap Solutions

    Strategic partner TherMap Solutions will co-exhibit its flagship opto-thermal metrology system at the UK Pavilion (Booth I3000), demonstrating patented thermoreflectance technology to resolve multi-layer thermal dissipation and hotspot challenges.

    Event & Contact Information

    • Dates: September 2–4, 2026
    • Venue: Taipei Nangang Exhibition Center
    • Booths: ACE Solution (L0609, 4F) | TherMap Solutions (I3000, 1F, UK Pavilion)
    • ACE Solution: [email protected] | +886-3-5500909 | Website
    • ACE Systemtek: [email protected] | +886-3-5500909 | Website
     

    Contact ACE Solution, Co., Ltd.

    About ACE Solution

    ACE Solution focuses on high-end system integration across semiconductor testing, Silicon Photonics (SiPh), high-speed digital, and wireless/mobile communications. Leveraging multidisciplinary expertise, we provide smart automation solutions integrating precision instrumentation, custom fixtures, and AMR/robotic arms. In response to high-power chips and heterogeneous integration trends, we offer world-leading high-resolution thermal imaging and micro-region failure diagnostic services to optimize CapEx, enhance equipment utilization, and minimize R&D risk.

    Contact ACE Systemtek Co., Ltd.

    About ACE Systemtek

    ACE Systemtek Co., Ltd. specializes in high-end system integration solutions spanning wireless communications, mobile communications, semiconductor testing, Silicon Photonics, high-speed digital transmission, and optical communications. With robust cross-disciplinary integration capabilities, we provide precision instruments, custom test fixtures, and smart automation systems integrated with robotic arms and Autonomous Mobile Robots (AMRs).

    Addressing high-power dissipation and heterogeneous integration trends, ACE Systemtek offers world-class high-resolution thermal imaging and micro-region failure diagnostic technologies (including advanced thermal imaging systems and thermal characterization solutions) to accurately monitor thermal behaviors. Through tailored test architectures, we are committed to maximizing equipment utilization, optimizing CapEx, and mitigating R&D risks—serving as your most trusted strategic partner in technological innovation.

  • 【2026年8月24日 / 台北訊】隨著人工智慧（AI）、高效能運算（HPC）與異質整合技術的爆發性成長，晶片朝向超高功耗、極限頻率與高密度立體封裝演進，為半導體製造、先進封裝及光通訊產業帶來嚴峻的散熱瓶頸、訊號完整性與良率挑戰。深耕測試整合逾20年的高階系統整合領導廠商筑波科技（ACE Solution）攜手集團中聚焦半導體方案筑波系統（ACE Systemtek），將於9月2日至9月4日參與SEMICON Taiwan 2026 國際半導體展。

    筑波集團憑藉跨領域專業工程團隊與深厚技術底蘊，具備客製化軟硬體治夾具開發與整合能力，提供從微區光熱量測（TDTR/ FDTR）、紅外/ 光學熱分析、太赫茲（THz）非破壞檢測、電光脈衝反射（EOTPR）到 1.6T 次世代矽光子（SiPh）/ CPO 高速光通訊測試及化合物半導體量測的一站式全方位解決方案，協助客戶突破製程瓶頸、縮短失效分析（FA）與材料分析（MA）週期，加速產品上市並優化資本支出（CapEx）。

    SEMICON Taiwan 2026 核心展出重點與最新成果

    筑波集團將於展會現場完整呈現針對先進封裝、異質整合、化合物半導體與次世代光通訊所打造的關鍵解決方案與最新成果：

    1. Automated SiPh & CPO Test（1.6T 矽光子與共同封裝光學測試）
    • Quantifi Photonics 矽光子（SiPh）與 CPO 測試方案：提供高密度、模組化且高度可擴充的 PXIe 電光混合測試平台，支援多通道光功率、光譜與高速傳輸特性驗證，無縫接軌研發到量產測試。
    • Nexustest 1.6T 224G/lane 光模組測試平台：整合超高速 1.6T 誤碼儀（BERT）、數位通訊分析儀（DCA）與時脈回復單元（CRU），支援 8×224G 誤碼率、眼圖與 TDECQ 分析，並搭配直插式水冷 MCB，全面滿足高速光模組的高能效測試需求。
    • YONATA 矽光子自動化光學對準系統：搭載奈米級高精度多軸運動控制與光功率即時反饋演算法，實現 SiPh 晶圓級/封裝級光纖與光波導的快速主動對準（Active Alignment），大幅提升 CPO 耦合測試與封裝效率。

    2. FA/ MA Thermal Analysis（IC 熱流與微區熱阻分析）

    • TherMap 光熱量測系統（TherMap Opto-Thermal Metrology System）：採用先進 TDTR/ FDTR 雙雷射技術，針對 2.5D/3D IC 與異質整合提供奈米至微米深度 3D 熱導率、熱擴散率與介面熱阻非破壞性量測，精準檢測晶圓鍵合層空洞與微凸塊熱異常。
    • QFI（Quantum Focus Instruments）高階熱影像分析系統：專為晶片級熱流與失效分析打造高解析度熱分析方案，精準捕捉局部微小熱點（Hotspots）與溫度分佈，提供 IC 設計與封裝熱管理關鍵驗證數據。

    3. Wafer & Advanced Packaging Non-destructive FA / MA / FT Test（晶圓與 3D 先進封裝非破壞性測試）

    • TZ-Series 太赫茲檢測系統（TZ-Series Terahertz Inspection System）：利用非破壞、非接觸式太赫茲（THz）穿透檢測技術，精確分析晶圓薄膜厚度、介電常數與材料均勻度，實現先進封裝基板與異質整合內部微結構缺陷的 3D 透視分析。
    • EOTPR 先進故障分析系統（EOTPR Advanced Failure Analysis System）：專為 2.5D/3D IC、TSV 與覆晶封裝設計的電光脈衝反射儀，具備亞微米級（Sub-Micron）高精度定位能力，無需破壞性物理切片即可精準定位內部走線開短路、微裂紋及高阻抗異常，大幅縮短失效分析週期。

    4. Compound Semiconductors（化合物半導體 FT / FA 測試）

    • Teradyne ETS 化合物半導體與功率元件測試方案：針對 GaN、SiC 等寬能隙化合物半導體以及電源管理 IC，提供高電壓、大電流的高精度終測（FT）與失效分析（FA）量測平台，確保車用、工控與綠能晶片的極致可靠度與良率。

    攜手英國合作夥伴 TherMap Solutions：雙展位共探前瞻熱管理技術

    面對 AI、高效能運算（HPC）與矽光子晶片熱功耗持續攀升的挑戰，精準的微區熱阻量測與多層結構散熱分析已成為先進封裝研發與良率提升的決勝關鍵。筑波科技重要策略合作夥伴 TherMap Solutions 本次亦將同步於英國館（UK Pavilion，攤位號碼：I3000） 展出旗艦級 TherMap 光熱量測系統。透過專利光熱反射（Thermoreflectance）技術，TherMap 能夠非破壞性地解構微奈米級多層堆疊結構與鍵合介面的熱特性，為業界提供精準的熱導率、熱擴散率與介面接觸熱阻數據，有效解決晶片熱點（Hotspots）與散熱瓶頸。

    展出與攤位資訊

    筑波集團誠摯邀請半導體、封裝測試、光通訊及智慧製造領域的業界專家與合作夥伴蒞臨參觀交流。集團旗下聚焦半導體測試與尖端量測的筑波系統（ACE Systemtek），具備跨領域系統整合軟硬體實力，專注於高階熱顯像分析、微區失效診斷與智慧自動化方案，致力於協助客戶精準掌握元件熱行為並優化資本支出。誠邀各界攜手探討如何透過整合性量測與智慧自動化技術突破製程瓶頸，搶佔次世代半導體市場先機。

    • 展覽：SEMICON Taiwan 2026 國際半導體展
    • 日期：2026 年 9 月 2 日（三）至 9 月 4 日（五）
    • 地點：台北南港展覽館
    • 攤位號碼：

    筑波科技（ACE Solution）：L0609 (4F)

    英國館 TherMap Solutions：I3000 (1F)

     

    聯絡筑波科技

    筑波科技股份有限公司ACE Solution, Co., Ltd.

    地址：新竹縣竹北市台元街28號2樓之1

    電話：03-5500909

    電子郵件：[email protected]

    網站：https://www.acesolution.com.tw/en/index/

    關於筑波科技（ACE Solution）

    筑波科技專注於高階系統集成，涵蓋半導體測試、矽光子學 (SiPh)、高速數位和無線/行動通訊領域。憑藉跨學科的專業知識，我們提供智慧自動化解決方案，融合精密儀器、客製化夾具和 AMR/機械手臂整合。為因應高功率晶片和異質整合的發展趨勢，我們提供世界領先的高解析度熱成像分析和微區故障診斷服務。我們致力於優化資本支出、提高設備利用率並降低研發風險。

    聯絡筑波系統

    地址：新竹縣竹北市台元街28號2樓之2

    電話：03-5500909

    電子郵件: [email protected]

    網站：https://www.acesystek.com/web/index/index.jsp

    關於筑波系統（ACE Systemtek）

    筑波系統股份有限公司（ACE Systemtek Co., Ltd.）深耕於高階系統整合解決方案領域，技術能量橫跨無線通訊、行動通訊、半導體測試、矽光子、高速數位傳輸及光通訊等尖端產業。憑藉卓越的跨領域整合實力，我們提供包含精密儀器、客製化治具，以及結合機械手臂與自走車（AMR）的智慧自動化解決方案。

    針對當前高功耗晶片與異質整合趨勢，筑波系統提供國際領先的「高解析熱顯像分析」與「微區失效診斷技術」（包含高階熱成像分析系統與熱特性量測方案），協助客戶精準掌握元件的熱行為。透過量身打造的測試路徑，我們致力於優化設備稼動率、精控資本支出（CapEx）並大幅降低研發風險。筑波系統將持續致力於科技創新，成為您最值得信賴的系統整合戰略合作夥伴。

  Products

  • TherMap Opto-Thermal Metrology System
    TherMap provides non-destructive 3D thermal characterization for advanced packaging & heterogeneous integration. Driven by TDTR/FDTR laser tech, it accurately measures thermal conductivity, diffusivity & interface resistance from 100nm to mm....

    • TherMap is an advanced opto-thermal metrology platform designed to tackle thermal bottlenecks in heterogeneous integration and advanced packaging (AI/HPC, SiPh, GaN/SiC). By leveraging transient pump-probe laser techniques, Time-Domain (TDTR) and Frequency-Domain (FDTR) Thermoreflectance, TherMap delivers precise, non-destructive measurements across complex multi-layer stacks.

    Key Features & Capabilities:

    • Multi-Layer Thermal Characterization: Measures thermal conductivity, diffusivity, and boundary resistance from 100 nm to millimeter depths.
    • Layer & Interface Decoupling: Decouples thermal properties of buried layers and bonded interfaces.
    • Defect Inspection: Detects buried voids, delaminations, and thermal anomalies in die attach layers and microbumps.
    • High-Fidelity Simulations: Provides accurate physical data to feed thermal simulations, accelerating R&D and predicting chip thermal behavior prior to mass manufacturing.
  • QFI InfraScope™ & QuantumScope™ Thermal & FA Syste
    Advanced thermal characterization & failure analysis platform for semiconductors. Features InfraScope™ true temperature mapping, QuantumScope™ integrating emmi™ photoemission, XIVA™ LSIM, and sub-micron defect localization for high-power/UWBG devices....

    • QFI is the industry-leading multi-technique microscope platform for non-contact temperature measurement, reliability, and semiconductor failure analysis (FA), optimized for advanced devices and high-power Ultra Wide Band-Gap (UWBG) materials (GaN/SiC). Key Features & Capabilities: • InfraScope™ Temperature Mapping: Delivers true 2D emissivity-corrected IR temperature maps (2 µm spatial resolution) and high-speed transient IR for hot spot detection and dynamic thermal analysis. • QuantumScope™ All-in-One FA: Integrates emmi™ Photoemission Microscopy (320 nm–1,900 nm), XIVA™ LSIM ohmic defect detection (up to 3 kV capability), and Thermal-HS lock-in thermography on a single system. • Multi-Modal Characterization: Features Thermoreflectance (250 nm resolution) and Raman temperature point measurement (0.5 µm spot size). Direct sensor-to-lens turret couples NIR, Visible, and MWIR lenses for maximum throughput. • Partner Synergy: Combines with TherMap Solutions for full 3D thermal profiling.

  • TZ-Series Terahertz Inspection System
    Non-destructive, non-contact Terahertz (THz) inspection system for semiconductors, thin films, and advanced packaging. Enables precise 3D internal defect analysis, wafer characterization, and material property measurements....

    • The TZ-Series utilizes advanced Terahertz (THz) time-domain and frequency-domain technologies to deliver non-destructive, non-contact inspection solutions for advanced semiconductor manufacturing and packaging.

    Key Features & Capabilities:

    • Non-Destructive 3D NDT: Penetrates internal structures to detect hidden voids, delaminations, and structural anomalies in sub-surface layers. 
    • Material & Thin-Film Characterization: Accurately analyzes wafer thickness, dielectric properties, and multi-layer material consistency. 
    • Advanced Packaging Integrity: Supports non-invasive quality verification for complex heterogeneous integration, interposers, and IC substrates. 
    • Fast & Non-Contact Workflow: Ensures accurate measurements without sample preparation, improving yield and accelerating failure analysis (FA).
  • EOTPR Advanced Failure Analysis System
    Electro-Optical Pulse Reflectometry (EOTPR) solution for ultra-high precision, non-destructive fault localization in advanced packaging, 2.5D/3D ICs, sub-micron interconnects, and complex semiconductor devices....

    • EOTPR (Electro-Optical Pulse Reflectometry) is a high-precision failure analysis (FA) system specifically designed for sub-micron fault localization in next-generation advanced packaging architectures, including 2.5D/3D ICs, TSVs, and flip-chips.

    Key Features & Capabilities: 

    • Sub-Micron Fault Localization: Pinpoints open/short circuits, microcrack anomalies, and high-resistance faults with micrometer-level accuracy. 
    • Non-Destructive Analysis: Allows precise internal interconnect testing without physical cross-sectioning or damaging the DUT. 
    • High Temporal Resolution: Enables accurate impedance profiling across long trace lengths and complex multi-die stackings. 
    Yield & R&D Optimization: Significantly reduces FA cycle times, accelerates root-cause debugging, and improves overall packaging yield.
  • Nexustest 1.6T 224G/lane Optical Transceiver Test
    A comprehensive solution for 224G/lane optical transceiver testing. It empowers R&D to quickly and accurately verify eye margin, signal integrity, BER, and FEC, ensuring high system stability and exceptional performance....

    • The 1.6T test solution by ACE Systemtek and Nexustest integrates a BERT, DCA, and CDR. It meets cutting-edge 1.6T development demands and flexibly supports 800G/400G applications, comprehensively satisfying test requirements from R&D to production.
     

    Key Features & Capabilities: 

    • High-Speed BER Analysis: Supports 8×224G BER testing with ms-level transient capabilities to capture burst errors, plus comprehensive PCS/RS-FEC pre/post BER analysis.
    • Electro-Optical Integration: Seamlessly coordinates the 1.6T BERT (PBT3058), 65GHz DCA (DCA1065), and 120GBaud CRU (CR3302) into a complete 1.6T measurement chain.
    • Flexible MCB & Cooling: Pairs with direct-plug OSFP/QSFP-DD MCBs with built-in water cooling, effectively reducing hardware integration and heat dissipation costs.
    Reliability & Automation: Covers Eye Diagram, TDECQ, and Jitter. SIRC response correction and up to 64-tap TDECQ FFE, remote command control (USB/LAN) enables one-click automated testing.
  • Teradyne ETS Power & Mixed-Signal Test Platform
    High-precision, high-power test solution for GaN & SiC power modules, power discrete devices, and mixed-signal PMICs. Delivers high-voltage/high-current test capabilities for Final Test (FT), wafer sorting, and failure analysis (FA)....

    • Teradyne ETS is a premier high-performance test platform specifically architected for compound semiconductors (GaN, SiC), power discrete devices, power modules, and mixed-signal PMICs. Leveraging ACE Solution’s custom test fixture integration and turnkey application engineering, it delivers exceptional test throughput and reliability from wafer sort to final package test. 

    Key Features & Capabilities: 

    • High-Voltage & High-Current Capability: Delivers high-power pulsing and precision multi-quadrant V/I sourcing for next-generation wide band-gap power devices. 
    • True Mixed-Signal Architecture: Combines high-speed digital, precision analog, and high-power instrumentation on a flexible, scalable matrix. 
    • Comprehensive FT & FA Testing: Enables rapid dynamic switching, static Rds(on), breakdown voltage, and thermal stress characterization for automotive and industrial ICs. 
    High Multi-Site Efficiency: Maximizes parallel test throughput, lowering Cost of Test (CoT) while ensuring zero-defect quality.

Categories

101 Photovoltaic Device Manufacturing
  • PV: Modules
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Fiber Optic Inspection Instruments
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Instruments; Bench Top Test
  • Microscopes: Optical Microscopes
  • Package Inspection; Lead Scanners
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
  • Thermal Sensing, Measurement, Analysis
  • Wire Bonding Inspection; Test
    • 208 Equipment, Test
  • Discrete Component Test Systems
  • Failure Analysis Systems
  • FPD Test; Measurement; Repair Equipment
  • Functional Test Systems
  • Handlers; Positioner Systems
  • Linear Test Systems
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  • Memory Test Systems
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  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
  • System on a Chip (SOC); Mixed Signal Test Systems
  • Test Head Manipulators and Docking Stations
  • Wireless, non-contact Test Systems
    • 308 Materials, Substrate
  • Test; Monitor Wafers; Reclaim or Virgin
    • 309 Materials, Test
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Structural Circuits; Test; Thermal Fixturing
  • Test Sockets; Contactors and Contact accessories
    • 402 PV Systems
  • Measurement and Control Technology
    • 502 Material Handling Systems
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    • 600 Communication Software
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    • 602 Manufacturing Software
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    • 701 Manufacturing Services or Consulting
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  • Static; ESD Testing & Control Services
  • Test Services or Consulting
    • 804 Professional Services
  • Sales; Manufacturers Representation or Distributors
    • 805 PV Services
  • Testing Institutes
    • 900 Support Products
  • Laboratory Apparatus and Supplies

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