ePAK International, Inc.

• SEMI Compliant Across the Fab

  Engineered to SEMI E47.1, E57, E62, E15.1, E84, and E87. Drop-in interoperable with load ports, OHT, AGV, stockers, and AMHS controllers.
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  Cleanable Without Disassembly

  Every eFOUP variant cleans in an automatic washer with door and internals in place. Shorter cycles, fewer reassembly errors.
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  Robust Wafer Retention

  Static dissipative PC+CF shell with PEEK wafer contacts and controlled 10mm pitch (+/-0.5mm non-cumulative). Limits shock and vibration during AMHS transport.
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  Three Configurations on One Shell

  eFOUP300-A (two-port general fab), eFOUP300-AF (four-port enhanced N2 purge), or eFOUP300-DF (LMA shell + diffusers). Same footprint and SEMI interface across all three.
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  Advanced Material Construction

  Ultra clean, low outgassing, ESD safe PC+CF shell (300-A / AF) or LMA+CF shell (300-DF) with integrated purge diffusers and PEEK at every wafer contact area.
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  AMHS and Automation Ready

  Top robotic flange and SEMI E57 kinematic coupling on every variant. Drop-in compatible with OHT, AGV, stockers, and SEMI E62 load ports in 300mm wafer handling lines.

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  SEMI/FIMS Compliant

  Direct interface with standard load ports and AMHS systems
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  Pre-installed filter

  Particle filter protects wafer surfaces from airborne contamination during transit
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  ESD-Safe Robotic Flange

  Carbon fiber filled PC flange with 10⁴–10⁷ ohms/sq surface resistivity
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  Superior Dimensional Stability

  Tight non-cumulative ±0.5mm tolerances maintain wafer alignment and reliable AMHS handoff
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  Low Outgassing Materials

  Ultrapure construction protects wafers from volatile compound contamination
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  Modular Configuration

  10 order variants with filter, D-Ring, and info tag options

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  Integrated N₂ Purge Ports

  Built-in nitrogen purge capability allows internal atmosphere control before opening, reducing particle exposure and oxidation risk during wafer transfer.
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  Washable Construction

  Fully washable design enables spray wash or DI rinse cycles for particle decontamination, supporting stringent cleanroom maintenance protocols.
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  150mm & 200mm SMIF Interface

  Designed for 150mm and 200mm SMIF workflows using interfaces defined by SEMI E19.3 and E19.4. Confirm load-port compatibility for the selected configuration with ePAK engineering.
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  Dual Wafer Size Support

  Available in both 150mm and 200mm configurations with a sealed mini-environment that protects wafers from contamination during storage and transport.
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  Flexible RFID Integration

  Optional RFID mounting on the left-side, right-side, or back-side of the pod enables real-time wafer lot tracking across automated production lines.
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  UV-Resistant Lid Option

  Amber-tinted polycarbonate lid blocks UV light to protect photosensitive wafers during storage and transport between process steps.

• Best overall wafer protection with the lowest cost of ownership in the industry

• Ultimate in wafer breakage protection

• Bond pad and bump integrity through zero-inter-wafer movement feature

• Interfaces with leading automated equipment

• Available in 4”, 5”, 6” & 8” sizes

• Multiple designs of cushions and cassette slot sizes

• Ultra clean Materials to meet your specification

As silicon carbide (SiC) technology continues to drive advancements in high-temperature and high-frequency devices, ePAK’s eSiC wafer handling solutions offer critical protection and precise handling for silicon carbide wafers in applications such as power electronics, renewable energy systems, and electric vehicles.

Our eSiC solutions are meticulously engineered for SiC wafers, offering advanced protection against surface defects, contamination, and physical stress. This ensures greater efficiency and superior performance in the semiconductor industry and enhances the reliability of SiC-based devices in demanding conditions.

As a material, silicon carbide is valued for its high-temperature resilience, excellent thermal conductivity, and robust structural integrity. However, SiC wafers also require careful handling to avoid damage during manufacturing and transport stages.

ePAK’s eSiC solutions offer tailored protection to meet these needs, enabling safer, contamination-free handling across each stage of silicon carbide wafer processing. Our comprehensive solutions support SiC production from boule growth to wafer dicing and final packaging.