IDTechEx

The independent market report "Materials and Processing for Advanced Semiconductor Packaging 2027-2037: Technologies, Players, Forecasts" provides a comprehensive analysis of the materials, manufacturing processes, technology trends, player landscape, and market outlook for advanced semiconductor packaging. Building on IDTechEx's established coverage of advanced packaging technologies, the report examines how material choices and process integration are becoming increasingly critical as the industry moves toward larger package sizes, higher interconnect densities, and demands higher power efficiency.
 
Technology Trends in Materials and Processing
 

• Advanced Semiconductor Packaging Materials and Process Landscape: Introduce the key technology drivers behind 2.5D and 3D advanced semiconductor packaging, and examine the materials and process technologies required to support next-generation package architectures.
• Performance Evaluation and 2.5D Process Flows: Analyze how fabrication processes, material selection, and package architecture influence electrical, thermal, and mechanical performance. Cover RDL formation, microvia fabrication, dielectric material selection, interconnect scaling, EMC, and MUF.
• Glass Panel-Based Advanced Packaging: Provide a dedicated analysis of glass substrates and glass interposers, covering technology roadmaps, manufacturing processes, technical challenges, development directions, supply chain analysis, company activities, and future outlook.
• Cu-Cu Hybrid Bonding for 3D Integration: Examine Cu-Cu hybrid bonding manufacturing processes, bonding equipment, material requirements, dielectric integration, and implementation case studies. This edition also emphasizes the development of low-temperature and room-temperature hybrid bonding.
• Thermal Interface Materials for 2.5D and 3D Packaging: Explore the growing importance of thermal management in advanced packaging, including TIM roadmaps, material selection criteria, emerging material candidates, and relevant case studies.

 
10-Year Market Forecasts & Analysis

This report provides 10-year market forecasts for organic dielectric and glass-based advanced semiconductor packaging modules, covering both unit shipments and annual module area demand. The forecast examines adoption across key application areas, including AI accelerators, server CPUs, autonomous vehicle/ADAS chips, and consumer electronics, highlighting both volume growth and the increasing importance of large-area package platforms in AI and HPC applications.
 

• Organic dielectric advanced semiconductor packaging module forecast by unit shipment and annual module area for different applications including AI server CPUs, accelerators, and consumer electronics 2027-2037
• Glass-based advanced semiconductor packaging module forecast by unit shipment and annual module area for AI server CPUs and accelerators