SUSS MicroTec (Taiwan) Co., Ltd.

ACS300 Gen2 Coater & Developer

Production Spin Coat / Develop Cluster for Wafer Level Packaging

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB). SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

ACS300 Gen3 Coater & Developer

Powerful Solution for Advanced Packaging Applications

The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.

ACS200 Gen3 Coater & Developer

Combining Expertise with Innovation

The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM. The enhanced version of the platform, ACS200 Gen3 TE, increases flexibility even further with up to 6 spinner and spray modules and an integrated inkjet module.

ACS200 Gen3 TE Coater & Developer

Fully automated platform for maximum throughput

The SUSS ACS200 Gen3 TE platform takes the very successful and well-known ACS200 Gen3 platform to a new level. It increases throughput and makes operation and maintenance more comfortable. The SUSS ACS200 Gen3 TE offers unmatched configuration flexibility of modules and technologies, thus covering the requirements of Advanced Packaging, MEMS, LED, and other markets and serving R&D as well as HVM.

XBC300 Gen2 D2W/W2W Hybrid Bonding Platform

The XBC300 Gen2 D2W/W2W is the world's first hybrid bonding platform that integrates wafer-to-wafer (W2W), collective die-to-wafer (D2W), and sequential D2W bonding in a cluster ​​​​system. Developed in collaboration with our partner SET Corporation SA, it supports substrates ranging from 200 mm to 300 mm and allows for handling dies on tape frame carriers​​​​.

Highlights

• Alignment Accuracy of ​< 100 nm for W2W bonding
• Die-Spacing Down to 40 µm
• Superior Cleanliness
• Integrated In-Situ Metrology
• Carrier Versatility: Silicon & Glass
• State-of-the-Art Performance with Compact Footprint

XBC300 Gen2 D2W Hybrid Bonding Platform

Increase production capacity, minimize yield losses: XBC300 Gen2 D2W platform is your fully automated solution for sequential die-to-wafer hybrid bonding on 200mm and 300mm substrates.

Highlights

• < 40 µm Inter-Die Spacing
• D​ie Handling Down to 30 µm
• Up to 1,000 dph
• Ultra-High Accuracy
• Integrated In-Situ Metrology
• Ultra-High Accuracy, alignment accuracy of +/- 100nm
• State-of-the-Art Performance with Industry-leading Footprint

XBC300 Gen2 SP Surface Preparation Cluster

The XBC300 Gen2 SP is a dedicated surface preparation platform specifically engineered for Wafer-to-Wafer (W2W) as well as sequential and collective Die-to-Wafer (D2W) hybrid bonding applications, delivering exceptional process stability and cleanliness levels compliant with front-end-of-line (FEOL) standards.

Highlights

• Unmatched plasma activation, various process gases such as Ar, O2, N2 etc. can be used and are controlled via mass flow controllers (MFCs).
• High-performance aqueous cleaner, combines a controlled back-side rinse with N₂-assisted spin-dry to remove residues efficiently and deliver a consistently dry surface. The module supports SC1 chemistry compatibility and citric acid capability for targeted contaminant residue.
• In-line IR void detection, with automatic classification of voids >500 µm
• Compact footprint

XBS300 W2W Hybrid Bonding Platform

XBS300 W2W is designed for automated hybrid bonding and fusion bonding of aligned 200mm and 300mm wafers. The platform supports both wafer-to-wafer (W2W) and collective die-to-wafer (D2W) bonding, offering maximum flexibility for advanced integration processes.

Highlights

• Outstanding Alignment Performance: The patented XBA technology with Inter Substrate Alignment (ISA) provides high-accuracy alignment for most demanding pitch applications with < 100 nm overlay.
• Precise Alignment Control in Three Dimensions

• SUSS Unique In situ Wafer Deflection Monitoring: compensates for incoming wafer variations, run-out, and substrate properties – delivering significantly higher process precision and consistently reliable bonding results.
• Integrated In situ Metrology: A key advantage of the integrated in-situ metrology is the closed-loop feedback of offset parameters directly to the bond aligner, enabling consistent overlay performance with every run.
• Closed-loop feedback between integrated metrology and bond aligner

XBS300 Temporary Bonding Platform

SUSS‘s XBS300 platform for temporary bonding represents the next generation of high-volume manufacturing temporary bonder solutions. The 200/300 mm wafer bonding platform can be configured for a low cost of ownership and maximum process flexibility.

Highlights

• Best-in-class TTV
• Built-in metrology
• Supporting a wide range of temporary bonding materials
• Individual configuration
• Compatible with silicon and glass carriers
• Proprietary technology for highest precision

XBC300 Gen2 Debonder & Cleaner

The XBC300 Gen2 is a versatile platform for debonding and cleaning at room temperature. Designed for tape-mounted wafers and carriers in 200 mm and 300 mm formats, as well as oversized variants, it enables safe handling of ultra-thin device wafers down to 50 µm or below.   

Highlights

• Laser-Assisted Debonding For Transparent Carriers
• Mechanical Peel-Off With Minimal Mechanical Stress
• Precise Debond Front Control
• Efficient Thinned-Wafer Cleaning
• Reliable Carrier Cleaning
• Patented Tape Protection Ring
• Patented Dock and Lock​​​​™ Technology

XBS200 Wafer Bonder

Maximum flexibility and consistent process results: the universal XBS200 wafer bonder for wafer sizes up to 200 mm is specifically designed for high-volume production of MEMS, LED and 3D advanced packaging.

Highlights

• Alignment Accuracy < 100 nm
• Bond force 0.9 kN - 100 kN
• Precise Temperature Control: from 30 °C to 500 °C, controlled independently via closed-loop systems. Ramping speeds of up to 30 K/min and uniformity within ±1.5 % ensure fast, consistent processing.
• World`s First Fixture-Less Automated Platform
• Unique Fusion Bonding Technique