Dah Young Vacuum Equipment Co., Ltd.

A Plasma-Resistant Coating System Built for Semiconductor Process Components

The critical processes of semiconductor manufacturing — etching, Chemical Vapor Deposition (CVD), and plasma cleaning — all require generating high-energy, highly reactive plasma environments inside the chamber. Chamber components exposed to plasma over time (Edge Rings, Shower Heads, Cover Plates, Liners, etc.) gradually erode under plasma bombardment, releasing particles that contaminate wafers, reduce process stability, and shorten component lifetime.

To extend the service life of critical components and improve fab process stability and yield, plasma-resistant thick-film coatings using rare-earth oxides (primarily Y₂O₃, yttrium oxide) have become the industry-standard solution. The Dah Young Vacuum SPC (Semiconductor Plasma-resistant Coater) is a coating system optimized for this application — providing stable, reliable rare-earth oxide thick-film production capability for semiconductor equipment makers, component manufacturers, and in-fab maintenance service providers.

Y₂O₃ Thick-Film Capability | 10–50 Micron Continuous Deposition Without Compromise

The core of plasma-resistant coatings lies in thick-film deposition of rare-earth oxides (Y₂O₃, YF₃, etc.). Industry-standard film thickness typically falls in the 10–50 µm range, with some extreme applications requiring 100 µm or more. Conventional evaporation systems often face technical challenges depositing such thick layers — film stress accumulation, microcracking, internal porosity, and adhesion degradation.

The SPC employs a large-crucible design with optimized evaporation rate control, completing 10–50 µm continuous thick-film deposition without process interruption. Combined with the high-energy assist mode of Dah Young's in-house high-performance ion source, Y₂O₃ and other rare-earth oxide films achieve over 95% of theoretical density with porosity controlled within 1%. Such a high-density film structure maintains excellent erosion resistance even under prolonged exposure to highly corrosive plasma environments such as CF₄, SF₆, and Cl₂ — significantly extending component service life.

Fab-Grade Cleanliness Design | Meeting the Most Demanding Semiconductor Particle Standards

Semiconductor processes have an extremely low tolerance for particle contamination — any particles released from the equipment itself directly impact wafer yield. The SPC is designed from the equipment level for fab-grade cleanliness — chamber materials selected for low particle release, internal volume maintained at Class 1000 cleanliness, and all workpiece-contact components subjected to rigorous cleaning and inspection procedures.

In addition, the SPC offers an optional ISO 5 (Class 100) load/unload zone, paired with fab-grade workpiece cleaning procedures, ensuring coated components can be sent directly into the fab without secondary cleaning. For advanced processes (sub-7nm) demanding extreme particle control, the SPC delivers industry-leading contamination control.

Integrated with Dah Young Core Technologies | Stable High-Yield Thick-Film Production

Although the SPC is built for thick films, it retains the core technology assets of Dah Young's optical evaporation series: the proprietary Optical Monitoring System (OMS) tracks thick-film deposition progress in real time; the FAST coating uniformity simulator optimizes coating uniformity on complex-shaped components; and planetary rotation fixtures ensure batch-to-batch consistency in high-volume production.

The SPC offers chamber sizes including 1350, 1550, and 1800 — flexibly configured to customer component scale (from R&D prototypes to large Edge Rings and 12-inch Shower Heads). It delivers stable, reliable, fab-certification-grade thick-film production equipment for the semiconductor plasma-resistant coating market.

A High-Throughput Sputtering Platform Built for Mobile Panels and Consumer Electronics Touch Glass

Smartphone cover glass, tablet touch panels, and smart wearable display panels have become some of the largest-scale optical coating applications in modern consumer electronics. Billions of touch and display panels shipped globally each year require coating equipment with high throughput, high uniformity, and high consistency to meet the consumer electronics market's core requirements of short cycle time, high turnaround, and high yield.

The Dah Young Vacuum MPS (Mobile Panel Sputter) is built on Dah Young's proprietary ARMS high-precision sputtering platform, optimized specifically for large-area mobile / touch panel mass production. The MPS employs a high-throughput configuration with dual sputter systems and dual ICP plasma sources, paired with rotational planar fixtures and large-area uniformity optimization — delivering industry-leading mobile panel sputtering production solutions for consumer electronics brands and panel manufacturers.

Dual Sputter System + Dual ICP Plasma Source｜High-Throughput Configuration Without Compromise

The core requirement of mobile panel mass production is throughput — markets shipping tens of thousands of panels daily require equipment that maintains coating quality while delivering industry-leading single-machine throughput efficiency. The MPS employs a dual sputter system high-throughput configuration, depositing two different film layers synchronously within the same chamber — substantially shortening the overall process time of complex film systems.

Paired with two sets of Dah Young in-house ICP inductively coupled plasma sources, the MPS maintains excellent gas dissociation efficiency and film density even under high-deposition-rate conditions. The dual-ICP configuration not only boosts throughput but also ensures reaction consistency across large-area substrates — effectively avoiding the center-edge film quality differences common with large panels. For mass-production applications including smartphone cover glass and touch panels, the MPS delivers the industry's optimal balance of throughput and quality.

Dah Young's Latest Proprietary Super-Hard Coating｜Mohs Hardness Up to 7, 10,000 Steel Wool Cycles

Mobile panels endure thousands of finger touches per day, pocket friction, and scratches from keys — coating surface hardness and abrasion performance directly determine long-term user experience and brand reputation. While conventional sputtered optical films outperform evaporation, they still leave room for improvement when facing increasingly stringent consumer market standards.

The MPS integrates Dah Young's latest proprietary super-hard coating technology — through the precise combination of separated activated reactive sputtering architecture, ICP high-density plasma source, and proprietary film structure design, the deposited film achieves Mohs hardness 7 (equivalent to natural quartz crystal hardness) and passes the demanding 10,000-cycle steel wool abrasion test with no significant film integrity degradation. This breakthrough hardness performance places mobile panel coatings deposited by the MPS at industry-leading levels in scratch and abrasion resistance — substantially extending smartphone cover glass service life and providing smartphone brand customers with a powerful product differentiation.

Beyond the super-hard coating process, the MPS also passes 9H pencil hardness testing, eraser abrasion testing, cross-cut adhesion testing, and other demanding consumer electronics reliability standards. It solves conventional reactive sputtering's target poisoning problem at the root, ensuring deposition-rate stability and film consistency under high-volume mass production — suitable for the long-term high-frequency use environment of smartphone touch panels.

Large-Area Substrate Uniformity｜Critical Advantage for Mobile Panel Mass Production

Mobile / tablet touch panel sizes continue to scale up — from 5-inch smartphones to 13-inch tablets — posing extreme challenges for coating uniformity on large-area substrates. The MPS employs a rotational planar fixture design optimized specifically for large-area planar substrates. Combined with the uniform sputtering flow field of the separated target zone, it ensures coating uniformity from center to edge on large-format substrates.

The MPS achieves full-load thickness uniformity within ±1.5%, ensuring high consistency in optical properties (color performance, reflectance, transmittance) across every panel — substantially improving production yield and brand consistency. For mobile panel mass-production applications requiring balance across large area, high throughput, and high consistency, the MPS provides the industry's most complete solution.

An Atomic-Level Coating System Built for Next-Generation Precision Optical Mass Production

From high-curvature AR coatings on smartphone camera modules, precision narrow bandpass filters in 3D sensing components, nanoscale optical structures in AR/VR waveguides, to high-cleanliness film layers in bio-medical optical instruments — the core characteristic of contemporary precision optical components has evolved from 'planar optics' to '3D microstructured optics'. As optical component functional surfaces grow ever more complex, conventional evaporation and sputtering technologies are gradually approaching their process limits. At this industry inflection point, Atomic Layer Deposition (ALD) technology has emerged as the core solution to next-generation optical coating challenges.

The Dah Young Vacuum ALD (Atomic Layer Deposition System) draws its technology from a technology transfer with the National Center for Instrumentation Research (NCIR), under the National Institutes of Applied Research (NIAR), Taiwan — grounded in years of ALD research achievements at a Taiwanese national research institute, combined with Dah Young Vacuum's years of optical coating mass production integration experience to build this next-generation flagship equipment. ALD employs a Plasma-Enhanced architecture, supports diverse precursors and SEMI-standard handling, with target spec covering wafer sizes from 4 inches and above. ALD is one of Dah Young's 2026 key development models, currently in Pilot phase, and we sincerely invite Taiwan's optics and semiconductor industry early adopter partners to jointly participate in specification definition and mass production validation.

ALD Core Advantages｜Three Process Capabilities Beyond the Reach of Evaporation and Sputtering

ALD's emergence as a key technology for contemporary precision optics stems from three process capabilities beyond the reach of conventional evaporation and sputtering: First, 3D Conformal Coating — through self-limiting chemical reactions, films uniformly cover complex 3D microstructures and high-curvature surfaces. Even on the inner walls of micropores with 100:1 aspect ratios, the back surfaces of high-curvature lenses, and the 3D patterns of AR waveguides, complete and uniform coating coverage is achieved. Second, sub-nanometer thickness precision — layer-by-layer atomic deposition enables 0.1 nm-class single-layer precision control, achieving the industry's highest grade of spectral precision. Third, Pinhole-free dense film quality — the atomically packed film structure eliminates pinhole defects, providing industry-leading environmental durability and long-term reliability.

These three capabilities make ALD an indispensable process for next-generation optical applications including high-curvature smartphone lens AR coatings, 3D sensing precision filters, CMOS / VCSEL semiconductor optical sensing, and AR/VR optical waveguides. For customers pursuing ultimate optical performance and mass production yield, ALD provides a core solution that conventional processes cannot deliver.

Plasma-Enhanced Architecture｜Key to Low-Temperature High-Quality Films

The core technical choice in ALD processes lies in whether plasma assistance is introduced. Conventional Thermal ALD requires high temperatures (typically 200–400°C) to complete the full chemical reaction — placing severe constraints on temperature-sensitive substrates such as plastic lenses, PC lenses, and compound semiconductors (InP / GaAs). Furthermore, thermal ALD's reaction rate is slower, and incomplete reactions may lead to elevated film absorption.

Dah Young ALD employs a Plasma-Enhanced architecture, providing high-density reactive radicals at low temperatures to achieve complete atomic layer reactions. Process temperature targets the 50–250°C range, making ALD suitable for temperature-sensitive substrates such as plastic lenses, PC lenses, and compound semiconductors. Plasma assistance also delivers superior film density, lower optical absorption, and more stable refractive index — providing industry-top film quality for precision optical applications.

NCIR Technology Transfer｜Taiwan National Research Institute Endorsement

The technology foundation of Dah Young ALD comes from a technology transfer with the National Center for Instrumentation Research (NCIR). NCIR, as a core R&D institution for Taiwan's semiconductor and optics industries, has long invested in critical research on ALD process development, equipment design, and mass production validation — accumulating rich thin-film process knowledge assets. Through formal technology transfer, Dah Young has obtained the industrialization application rights for years of research achievements, while maintaining a long-term technical collaboration relationship with NCIR.

This technology endorsement carries significant meaning for customers: (1) Technical Credibility — as a national research institute, NCIR's technology has undergone rigorous academic and industrial validation; (2) Continuous Innovation Support — Dah Young's long-term collaboration with NCIR ensures ALD technology can continuously advance with industry needs; (3) Local Industrial Chain Integration — the NCIR + Dah Young collaboration model represents Taiwan's establishment of a complete 'research → development → manufacturing' end-to-end capability in the ALD field. Customers purchasing Dah Young ALD are not merely acquiring equipment, but building a long-term strategic partnership with Taiwan's ALD industrial ecosystem.