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EPORT CO.,LTD

Yongin-si,  Gyeonggi 
Korea (South)
http://www.e-port.co.kr
  • Booth: L0909

Eport, The Professional Manufacturer of Advanced Materials!

Overview

Since its establishment in 2010, Eport Co., Ltd. has been importing and selling thermally conductive ceramic powders such as spherical alumina and spherical silicon nitride, used as ceramic fillers in TIM (thermal interface materials). Furthermore, in 2018, Eport established its own R&D center and began developing high-purity spherical alumina using proprietary technology and supplying it to the semiconductor industry. This has enabled it to become a leading thermal conductive material company in South Korea.

Leveraging its expertise in ceramic synthesis, spheroidization, grading, surface treatment, and compounding, Eport Co., Ltd. collaborates with customers to review and evaluate the suitability of thermal conductive materials, thereby providing innovative heat dissipation solutions. Eport also continues to invest in the development of fillers optimized for cutting-edge semiconductor packaging materials (EMC) such as GDDR7/HBM.

To embrace the upcoming space age, AI (artificial intelligence), and autonomous driving era, Eport is committed to contributing to the advancement of human civilization through the development of sustainable new materials.

  Products

  • Low Alpha Spherical Alumina
    1. Unique Low-α spherical alumina synthesis technology
    2. Excellent spheroidal manufacturing technology
    3. Dedicated blending technology for EMC/LMC
    4. Low alpha content: U, Th content (<5 ppb)...

    • Low Alpha Spherical Alumina

    1. Size : 

    -. 1㎛/3㎛/5㎛/10㎛/20㎛ Low-α Spherical Alumina Product Line up

    2. Characteristics 

    -. Alumina heat-dissipating filler, which has high Thermal Conductivity and low radioactivity material content

    3. Core Technology

     1) Unique Synthesis Tech.

     2) Powder Blending & Classification Tech.

     3) Surface Treatment Tech.

Categories

300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Marking ink
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Packages; Ceramic and Other High Temp Compounds
  • Packages; Plastic
  • Preforms; Lids
  • Printed Circuit Boards (PCB); Printed Wire Boards (PWB)
  • Printing Masks; Screens
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Solder; Solder Balls and other Soldering Materials
  • Tape Automated Bonding (TAB) Accessories
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 305 Materials, Nanotechnology
  • Materials, Nanotechnology

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