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SIGMA Technology Corporation

Taoyuan City,  Taiwan
http://www.sigmatekcorp.com
  • Booth: J2546

Welcome to Sigma and let us create a win-win situation

Overview

希馬科技成立於1972年, 致力於提供電子製造生產及檢測設備與耗材已四十餘載, 秉持“誠信待人”及“永續發展”之經營理念, 專注於代理銷售, 引領業界開發創新製程, 提供完整的技術支持與售後服務, 在終端用戶與產品原廠之間建立了穩固可靠的橋樑.

希馬代理產品涵蓋的產業包括SMT/PCBA電路板組裝, IC Packaging半導體封裝, LED發光二極體製造, FPD平面顯示器, Solar Cell/Module太陽能電池/模組, Fuel Cell燃料電池, Nano Material Inkjet奈米材料噴印, 客戶遍及台灣, 大陸與香港之代工製造廠, 大專院校與科研院所, 累積了無數寶貴的經驗.

希馬總部位於台灣桃園, 在大陸華南及華東地區設有合作機構, 華中/華北地區則為維修工程師駐點服務, 銷售人員共約二十人, 維修工程師約五十人, 提供客戶更迅速而即時的服務.

  Products

  • Finetech 微小零件及Underfill返修機
    針對SMT零件小型化(008004/01005)、POP(Package on Package)零件、QFN、Chip-on-Flex、Flip Chip、Underfill(底部填膠)及MiniLED 0305/0408/0509及單顆錫球提供維修解決方案。
    ...

    1. MiniLED 維修可達到晶片解焊取下、去除pad上殘錫、點錫膏並取新的零件放上並焊接完成，全部動作於一台機器上完成。
    2. Finetech 擁有對大型零件(如BGA)專利的影像分割功能，因此可以對大型零件做到精準對位
    3. 設備透過基板及零件影像對位方式作維修，操作簡單易學。
    4. 可以自訂上方及底部溫度加熱曲線因應不同材料，最高設定溫度達400℃並且可以接兩組測溫線並顯示量測溫度於螢幕上。
    5. 設備透過基板及零件影像對位方式作維修，操作簡單易學。
    6. 可以自訂上方及底部溫度加熱曲線因應不同材料，最高設定溫度達400℃並且可以接兩組測溫線並顯示量測溫度於螢幕上。
    7. 可加裝點膠模組做點錫膏或其他膠材。
    8. Rework設備可依客戶製程要求挑選適合的配備(如單顆零件印刷鋼板、除錫裝置、植球鋼板、...等)。

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Finishing; Straightening Equipment
  • Lead Frame Taping Systems
  • Marking; Imprinting; Labeling Equipment
  • Printing Equipment; Screen-printing; Alignment ; Film Printing
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
    • 201 Equipment, Flat Panel Display
  • Laser Treatment; Cutting Systems for Panels & Photocells
  • Low Pressure Plasma Spray (LPPS) Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Repair; Rework Equipment
    • 203 Equipment, Inspection & Measurement
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Thin Film
  • Wafers
    • 207 Equipment, Process
  • Bumping Systems
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Transfer Systems for Wafer; Reticles or FPD's
    • 300 Materials, Assembly
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Molding; Encapsulation; Potting; Resin Materials
    • 301 Materials, Chemicals & Solids
  • Cleaning Chemicals; Solvents; Strippers
  • Dopants; liquid or solid
    • 401 Sub-systems
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers
  • Ultrasonic Generators; Transducer and Monitoring Systems

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