SSK provides high-performance FFKM (Perfluoroelastomer) sealing solutions for the semiconductor and display industries. Leveraging its proprietary Nano-Organic Filler and Non-Filler technologies, SSK develops advanced FFKM materials that deliver exceptional plasma resistance, superior chemical stability, and ultra-low particle generation.
Our FFKM compounds, including S360, S543, and S549, are engineered to withstand aggressive process gases and plasma chemistries such as NF₃, O₂, O₃, and fluorine-based plasmas while maintaining reliable sealing performance at temperatures up to 310°C. These advanced materials provide outstanding durability, excellent compression set resistance, high thermal stability, and long-term sealing integrity under extreme operating conditions. Proven reliability.