IBARAKI GRINDING WHEEL Co.,Ltd.

Diamond or CBN abrasive grains are fixed in a single layer onto a metal body by nickel electroplating. The high grain concentration and large grain exposure provide sharp cutting action and efficient chip removal. We design custom tools based on drawings, workpiece materials, machine conditions, and required accuracy. Complex shapes, prototypes, small lots, and volume production are available. 

CFRP (carbon-fiber-reinforced plastic), alumina, and optical glass have long been regarded as difficult to grind: poor chip evacuation causes the wheel to clog, making high-efficiency, high-quality machining hard to achieve.

The wire-mesh grinding wheel employs a patented design in which diamond is electroplated onto a wire mesh or an ultra-thin base metal. The resulting high chip-evacuation performance enables machining of these difficult-to-cut materials with high efficiency, high quality, and low cost.

In CFRP, the diamond grains shear the carbon fibers finely—as if shaving through them—while in brittle materials such as alumina and optical glass they remove stock in fine increments. This suppresses burrs, delamination, and chipping, delivering a high-quality finish.