Nanofilm Technologies International Limited

NTI Nanofilm’s FCVA Batch System integrates proprietary FCVA thin-film coating technology with a flexible multi-source configuration, including an FCVA source, an ion-beam source, a magnetron-sputtering source, and pulsed DC bias. The system delivers dense, uniform and high-quality coatings for semiconductor backend packaging and precision manufacturing applications.

Its patented double-bend electromagnetic filtration system removes macro particles, enabling smooth, clean ta-C coatings with strong wear resistance, anti-sticking performance, corrosion protection, and low friction. Dedicated coating recipes support cavity bars, lead frames, precision tooling, ESD coating applications and other complex parts.

Drum-based planetary motion supports uniform coating on 3D objects and different substrate materials, while coating temperature below 100 °C expands suitability for heat-sensitive and dimension-critical components. The fully automated system supports efficient production, consistent coating quality and a coating range up to 1,300 Ø x 900 H mm.

NTI Nanofilm’s FCVA Load Lock Mold Coater is designed for wafer chucks, precision molds and critical semiconductor components that require ultra-smooth ta-C coatings with ultra-low particles, clean contact surfaces, wear resistance and stable release performance. Its separated load lock and process chambers reduce vacuum cycle time while helping limit contamination.

A key USP is NTI Nanofilm’s proprietary X-Bend filtration technology, which removes macro particles during FCVA deposition to enable cleaner, smoother and more particle-controlled coatings for semiconductor manufacturing.

The system supports FCVA, magnetron sputtering and ion beam options for flexible coating development and production needs. A self-rotating, angle-tunable, and biasable substrate holder improves coating uniformity on complex parts, while room-temperature coating without added heat expands suitability for heat sensitive and dimension critical components.

With a 12 inch coating range, the system supports larger molds and broader semiconductor production requirements.

MiCC® is NTI Nanofilm’s nanocrystalline chromium nitride ceramic coating developed for semiconductor backend packaging tools. Using patented FCVA technology, MiCC® forms a dense protective layer with low surface energy, low friction and smooth release performance to help reduce material sticking on critical tooling surfaces.

With high hardness and strong surface durability, MiCC® helps protect cavity bars, precision molds and backend tooling from deformation, scratches and wear caused by repeated production and cleaning cycles. This supports longer tool lifespan, reduced cleaning frequency, fewer defects and improved productivity.

MiCC® is suitable for semiconductor packaging components where anti-sticking performance, wear resistance, surface cleanliness and stable release are required.

NTI Nanofilm’s F-TAC coating is engineered for lead frame carriers used in high-temperature semiconductor backend processes such as baking and thermal handling. During production, carriers clamp and hold thin lead frames in position. Conventional PTFE, silicone and selected hard coatings may soften, degrade or create higher friction under heat, causing sticking during release, lead frame tearing, warpage, frequent cleaning and downtime.

F-TAC protects the carrier’s inner contact surfaces with an ultra-low-friction and heat-resistant coating. It supports stable clamping during high-temperature processing and helps lead frames release cleanly after processing, reducing adhesion-related damage and process interruption.

With heat resistance above 265 °C, low friction below 0.1, contact angle above 110 ° and longer coating lifespan than traditional coatings, F-TAC helps reduce cleaning cycles, improve uptime, lower scrap risk and support more stable semiconductor packaging productivity.

NTI Nanofilm’s TAC-ON® coating is an FCVA based ta-C coating solution designed for semiconductor backend tools and precision components that require high hardness, low friction and ultra-smooth surface performance. It is suitable for wafer lapping carriers, wire bonding capillaries, wedge bonding tools, precision tooling and other critical contact components.

In semiconductor backend processes, repeated contact, sliding and abrasive interaction can cause tool wear, particle adhesion, surface damage and unstable process performance. TAC-ON® helps protect functional surfaces by forming a dense and smooth carbon-based coating that reduces friction and wear while maintaining surface cleanliness.

With a hardness of around 40 GPa, a friction coefficient around 0.1 and strong wear resistance, TAC-ON® supports longer tool life, fewer replacements, reduced particle-related issues and more stable production yield. Its low-temperature FCVA process also expands suitability for precision and dimension-critical components.

NTI Nanofilm’s ESD coating is an FCVA-based anti-static discharge coating for semiconductor wafer contact components that require controlled charge dissipation, clean surfaces and reliable handling. It is suitable for wafer chucks, end effectors, metrology and testing fixtures, carrier parts and other components that contact wafers during transfer, holding and inspection.

Static charge on tooling surfaces can attract particles and increase the risk of ESD-related defects. ASD coating provides a controlled conductive surface to help dissipate charge gradually while reducing static-induced particle adhesion on critical contact areas.

Applied at room temperature, ASD coating is suitable for ceramics, metals, elastomers and temperature-sensitive components. With tunable surface resistivity from 10^5 to 10^9 Ω/sq, it can be adjusted to different ESD protection needs while supporting cleaner wafer handling, lower contamination risk and more stable process performance.