PIE Co., LTD

GAVIH is a transmission holotomography system—a precision phase-imaging technology that reconstructs, from the phase of transmitted light, a sample’s internal refractive-index distribution in 3D.

It targets optically transparent samples such as glass substrates and waveguides (AR/VR, PICs) for non-destructive analysis of internal structure and defects. It delivers 161 nm lateral resolution and acquires multi-angle phase information without rotating the sample, building the refractive-index map quickly.

Without cutting or surface prep, it resolves internal structure, layer boundaries, and micro-defects, and visualizes micro-cracks, laser-induced modification, and voids quantitatively and qualitatively. It also measures process variation, material uniformity, and induced stress. Typical inspections include TGV surface and surrounding micro-cracks, TGV inner-wall roughness, TGV modification, post-singulation glass-edge micro-cracks, and glass CPO inspection.

GAVI is a high-resolution automated optical inspection (AOI) system developed for through-glass-via (TGV) holes on glass-core substrates. In a single scan it captures multiple hole cross-sections and evaluates key hole characteristics—diameter, roundness, and position—while simultaneously screening the glass surface for defects such as cracks, foreign material, and residues. Rule-based logic combined with an in-house AI platform automatically classifies defect types and adapts the inspection to each customer’s product and process. By consolidating dimensional measurement, position mapping, and surface inspection into one high-throughput pass, GAVI provides the accuracy and repeatability that high-volume glass-substrate production requires, while remaining flexible enough to support evolving substrate designs.