Elephantech Inc.

A novel solution of Elephantech’s proprietary Nano Copper Deposition technology platform, which combines inkjet technology and copper nanoink to realize selective formation or augmentation of seed layer only where needed.

It enables reliable seed-layer formation for challenging high-aspect-ratio microvias beyond the coverage limits of conventional electroless plating approach to change designing rules and achieving significant routing efficiency. enabling easy and precise control of conductive via depth in advanced HDI boards.

A novel solution of Elephantech’s proprietary Nano Copper Deposition technology platform, which combines inkjet technology and copper nanoink to realize selective formation or augmentation of seed layer only where needed.

It optimizes the SAP approach to decouple surface and via seed-layer requirements. Through combining conventional surface seed layer formation with selective via seed reinforcement, DS-SAP ^TM achieves both continuous via seed coverage and fine patterns on the surface

A member of Elephantech’s SAphire™ family of sintering copper nanopastes, which are built upon the company’s Self-Assembling Copper Nanoparticle technology. The series provides advanced material interface solutions spanning bonding, filling and interconnection applications.

SAphire^TM B delivers low-resistance copper interconnects to support modular manufacturing of ultra-high-layer-count PCBs, improving design freedom, scalability and thermal stability for demanding devices.

A member of Elephantech’s SAphire™ family of sintering copper nanopastes, which are built upon the company’s Self-Assembling Copper Nanoparticle technology. The series provides advanced material interface solutions spanning bonding, filling and interconnection applications.

SAphire^TM G achieves low-shrinkage filling in high-aspect-ratio TGV to minimize void and crack risks in the long-term, and reduce stress on glass during sintering, boosting reliability and manufacturing yield in glass-based advanced packaging.