By revitalizing existing G3.5 production lines and integrating advanced panel-level plating equipment, Innolux has developed the world’s largest RDL (Redistribution Layer) substrate (620 mm x 750 mm). Featuring fully automated production, our process enables fine-pitch copper wiring and multi-layer routing. A single G3.5 substrate can be segmented into 18 strips, compatible with standard flip-chip back-end packaging equipment, while also supporting customized dimensions. Compared to traditional ABF or BT substrates, our glass-based RDL packaging offers superior advantages, including a thinner profile for portable applications and the ability to achieve tighter die-to-die spacing due to our finer line/space (L/S) capabilities.