Powering Possibilities.
Overview
Headquartered in Hsinchu, Taiwan, 3S was founded in 1998 with a capital of USD 13M. We have a dedicated team of about 120 professionals focused on the development of smart system, solution, and service for power modules and wafer-level packages.
We deliver a comprehensive range of high-reliability systems, including vacuum reflow ovens, formic acid vacuum reflow ovens, and integrated solutions tailored to diverse packaging processes.
Trusted by leading companies, 3S is committed to being a reliable partner for all customers worldwide, including IDMs, OSATs, EMS, and fabless companies.
#Shaping the Future of Semiconductor Packaging
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