TDMC is dedicated to becoming a global leader in "New Diamond Material" solutions. We specialize in semiconductor and packaging applications, placing diamond materials at the core of our innovation. Leveraging diamond’s exceptional properties—including an ultra-high thermal conductivity of 2200 W/m·K, low Coefficient of Thermal Expansion (CTE), superior electrical insulation, and extreme hardness—we provide the ultimate material solution for the thermal management challenges of next-generation high-power electronic components.
To meet the diverse demands of various market applications, we offer a wide range of diamond material forms, including Single-Crystal Diamond Plates, Polycrystalline Diamond Plates, and Diamond Powders (Single-Crystal/Polycrystalline). Beyond material supply, our team brings over 20 years of integration experience in the electronics industry. We provide clients with customized, one-stop OEM services and tailored fabrication, including Precision Cutting, Grinding, Polishing, Drilling, Surface Modification, and Metallization.
We are committed to being a steadfast pillar in the global semiconductor thermal management field, assisting our customers in overcoming heat dissipation barriers to achieve peak performance. We welcome any inquiries or collaborative ideas regarding diamond material applications. Let us work together to drive the technological revolution powered by "New Diamond Materials."
鑽石的導熱是最頂尖的材料,我們著重於鑽石材料的新應用開發
在台灣，我們提供客製化訂製服務, 結合超過20年電子產業整合能力,我們實現鑽石元件OEM代工服務,切割、研磨、拋光、鑽孔、黃光線路、TDV、背部供電、封裝代工