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SmarAct GmbH

Oldenburg,  Germany
https://www.smaract.com
  • Booth: S8237

Your Partner for High Precision Solutions

Overview

SmarAct Group develops high-performance solutions for precision positioning, automation, and metrology for semiconductor manufacturing, silicon photonics, and advanced research. Headquartered in Germany with offices in the US and China, SmarAct delivers solutions ranging from precision components to fully integrated automation systems.

As semiconductor devices shrink, 3D integration advances, and electronic and photonic technologies converge, manufacturing demands ever greater precision, stability, and throughput. At SEMICON Taiwan, SmarAct showcases solutions for lithography and alignment, wafer-level metrology and inspection, photonic device testing, automated nanoprobing and failure analysis, as well as advanced packaging and heterogeneous integration. By combining precision motion, intelligent automation, and application expertise, SmarAct helps customers overcome today's manufacturing challenges and prepare for the next generation of semiconductor and photonic technologies. Visit SmarAct's booth and meet our experts to discuss your next application.

  Press Releases

  • High-precision wafer stages combine advanced motion technologies with direct interferometric feedback for demanding semiconductor processes.

    At SEMICON Taiwan, SmarAct will present its latest solutions for semiconductor manufacturing, positioning, metrology, and automation at booth S8237. A key focus will be SmarAct’s customizable wafer stages, which combine high-performance motion technologies with advanced metrology for precise, closed-loop wafer positioning.

    Designed for wafers up to 300 mm, SmarAct wafer stages can be configured with two to six degrees of freedom and combine piezo-based and electromagnetic drive technologies according to the application. For advanced position feedback, the stages can incorporate the PICOSCALE Interferometer together with METIRIO® optical encoders. Direct measurement on the wafer or chuck surface enables picometer-level feedback and closed-loop control, combining high-performance motion with interferometric metrology.

    This combination reflects SmarAct’s broader approach to semiconductor manufacturing. Rather than focusing solely on individual positioning components, the SmarAct Group combines expertise in motion, metrology, and automation to develop solutions tailored to specific processes and system architectures. In-house engineering and production provide flexibility to address requirements ranging from individual motion and measurement tasks to complex automated systems.

    Visitors to SEMICON Taiwan can experience several technologies behind these solutions. A SMARBOTIC® TRIPOD demonstrator illustrates precise motion in six degrees of freedom using a hybrid kinematic design. It provides a tangible example of how different axis arrangements and kinematic concepts can be applied to complex positioning tasks, including wafer positioning.

    The PICOSCALE Interferometer demonstrates SmarAct’s metrology expertise and the possibilities of direct position feedback and closed-loop control. SmarAct’s SMARPROBE nanoprobing platform extends the showcase into automated semiconductor characterization, combining closed-loop positioning of probes and samples with automated probing workflows.

    Together, the demonstrators provide an insight into how SmarAct brings motion, metrology, and automation together to address increasingly complex requirements in semiconductor manufacturing and research.

    Meet SmarAct at SEMICON Taiwan, booth S8237, and discuss your next positioning, metrology, or automation challenge with our experts.

    More Information:

    Visit SmarAct’s website: https://www.smaract.com

  Products

  • Wafer Stages
    SmarAct's wafer stages provide customizable high-precision positioning for wafers up to 300 mm. Combining piezo and electromagnetic drive technologies, they offer 2 to 6 degrees of freedom for demanding semiconductor processes....

    • SmarAct's wafer stages provide high-performance positioning for semiconductor manufacturing, inspection, metrology, and research. Configurable for wafers up to 300 mm and 2 to 6 degrees of freedom, they combine piezo-based and/or electromagnetic drive technologies to meet application-specific requirements for fine positioning, travel range, and dynamics. Optional PICOSCALE Interferometers and METIRIO® optical encoders add high-resolution position feedback and closed-loop control. Wafer chucks, granite bases, single- or double-sided wafer access, and configurations for HV and UHV environments are available. With in-house engineering and extensive customization, SmarAct wafer stages can be tailored to specific processes and system architectures.

  • Wafer Alignment Systems
    SmarAct provides customizable solutions for mask-to-wafer, chip-to-wafer, and wafer-to-wafer alignment. Motion, metrology, and automation technologies can be combined to meet specific semiconductor process requirements....

    • High-precision alignment is essential throughout semiconductor manufacturing, from lithography and wafer testing to advanced assembly and integration processes. SmarAct develops customizable motion and metrology solutions for mask-to-wafer, chip-to-wafer, and wafer-to-wafer alignment. Depending on the application, different positioning technologies can be combined to control lateral, rotational, vertical, and angular motion. Solutions can incorporate wafer handling, force sensing, metrology, microscopy, and automation according to the process requirements. SmarAct’s modular approach and in-house engineering support both application-specific subsystems and more complex automated equipment.

  • Wafer-Level Testing of Photonic Chips
    SmarAct provides modular hardware and software for wafer-level PIC testing, combining fast fiber-to-PIC alignment, wafer positioning, electrical probing, and automated processes for optical and electro-optical characterization....

    • SmarAct provides modular motion, alignment, and control technologies for optical and electro-optical testing of photonic integrated circuits at wafer level. High-resolution piezo scanning, multi-axis fiber positioning, wafer motion, and automated alignment algorithms can be combined according to the test process. SmarAct solutions support fast fiber-to-PIC alignment and can be extended with electrical probing, measurement equipment, and application-specific automation. Modular hardware and software allow machine builders and system integrators to create customized test equipment for R&D, device characterization, validation, and scalable photonics production testing.

  • Automated Nanoprobing Systems
    SMARPROBE combines closed-loop positioning of probes and samples with automated probing workflows for advanced semiconductor characterization. Up to eight probes enable repeatable electrical measurements inside electron microscopes....

    • SmarAct provides electrical probing solutions ranging from configurable positioning systems to the fully integrated SMARPROBE nanoprober. Designed for advanced semiconductor characterization, SMARPROBE combines closed-loop positioning of probes and samples with active position holding, low thermal drift, automated probe landing, CAD navigation, and predefined probing workflows. Up to eight probes can be positioned for electrical characterization, while the system can be integrated into existing electron microscopes. Its encoded motion system with 1 nm resolution supports repeatable and highly automated nanoprobing workflows while minimizing electron-beam exposure.

  • Expanding into Wafer Metrology
    SmarAct Metrology is developing a phase-shifting Fizeau interferometer for wafer metrology, capturing the full surface topology of wafers up to 300 mm within 1 ms with nanometer-scale resolution in a single shot....

    • SmarAct Metrology is expanding into wafer metrology with a new phase-shifting interferometer currently in development. Based on a Fizeau configuration, the system is designed to capture the full surface topology of wafers up to 300 mm within just 1 ms with nanometer-scale resolution. Unlike point-by-point measurement approaches, the entire surface is captured in a single shot, opening new possibilities for fast, imaging-based wafer characterization. In addition to surface profilometry, the technology enables the rapid dynamic detection of height changes, targeting applications such as leak testing of semiconductor packages.

Categories

200 Equipment, Assembly
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wafer Level Bonders
    • 201 Equipment, Flat Panel Display
  • Panel Alignment; Cell Assembly Equipment
    • 203 Equipment, Inspection & Measurement
  • Fiber Optic Inspection Instruments
  • Instruments; Bench Top Test
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 204 Equipment, Mems
  • Double sided mask aligner
  • Wafer Level Bonders
    • 205 Equipment, Nanotechnology
  • Equipment, Nanotechnology Tools
    • 207 Equipment, Process
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 208 Equipment, Test
  • Failure Analysis Systems
  • Handlers; Positioner Systems
  • Optical Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 309 Materials, Test
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
  • Enclosures; Cabinets
  • Piezo Electronic Components
  • Sensors
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants; p
    • 401 Sub-systems
  • Motion control systems; Servo control systems & Components
    • 602 Manufacturing Software
  • Factory Automation; Cell Controller Software
    • 700 Manufacturing Services
  • Measurement; Inspection Service
    • 701 Manufacturing Services or Consulting
  • Assembly
  • Automation & Robotics
  • Equipment; Hardware; Product Design, Integration and Manufacturing
  • Product Development; Software Design; Product Lifecycle Management
  • Wafer Handling

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