JIANN SHENG MACHINERY & ELECTRIC INDUSTRIAL CO., LTD.

The JSEDM 12-Inch Diamond Wire Saw is specifically developed for large-diameter single-crystal SiC slicing.

Designed for the characteristics of hard and brittle materials, the machine utilizes diamond wire cutting to achieve stable slicing with low cutting force, reduced kerf loss, and improved material utilization.

The newly developed 12-inch model expands JSEDM’s existing 6-inch and 8-inch cutting capabilities, providing a solution for next-generation large-diameter SiC processing.

In addition to SiC, the Diamond Wire Saw can also be applied to sapphire, ceramics, optical glass, CVD diamond, and other advanced hard-brittle materials.

Key Features

• Up to 12-inch material cutting capability
• Designed for single-crystal SiC slicing
• Low cutting force
• Reduced kerf and material loss
• High material utilization
• Suitable for various hard and brittle materials

JSEDM CNC Wire EDM provides high-precision machining solutions for a wide range of conductive materials.

Using electrical discharge machining with a continuously moving wire electrode, the system enables non-contact cutting without direct mechanical cutting force, making it suitable for intricate profiles, fine features, and high-precision components.

With precise motion control and stable discharge technology, JSEDM Wire EDM supports applications across semiconductor, electronics, precision engineering, and advanced material processing.

Key Applications

• Semiconductor and precision electronic components
• Data center thermal management components
• High-precision male-female mating parts
• Complex profiles and precision components
• Advanced conductive materials

Key Features

• High-precision non-contact machining
• Complex profile cutting
• Fine feature machining
• Suitable for various conductive materials
• Stable and precise cutting performance

JSEDM — The Best Cutting Solutions for Your Materials.