ViaMaster is an automated metrology system specifically developed by OmniMeasure for semiconductor advanced packaging and 3D IC. It measures Through Silicon Vias (TSVs)
with aspect ratios (AR) of up to 30 or higher.
(AR ≥ 30)
Utilizing non-destructive optical technology, ViaMaster delivers high-resolution, fast, and reliable measurement solutions to help customers precisely control critical dimensions during manufacturing, thereby improving product yield and process stability.
Main Applications
TSV Structure Measurement and Process Challenges
TSV technology is at the core of 3D IC packaging. Creating vertical vias through silicon wafers and metallizing them enables interlayer connections that enhance integration and reduce product size. However, as fabrication technologies advance, TSV structures become smaller and more complex, presenting several challenges:
- Precise Control of Via Depth and Diameter
- Control of Via-To-Via Pitch
- Measurement Challenges of High Aspect Ratio (HAR) Structures
These challenges call for high-precision metrology tools during manufacturing to enable real-time monitoring and adjustment of process parameters, ensuring the quality and reliability of TSV structures.
Product Advantages
Non-destructive High-Speed Metrology System
ViaMaster offers the following advantages:
- High-Speed Automated Measurements
- Non-Contact Optical Metrology
- High Precision and High Resolution
- Integrated Multi-Parameter Measurement
- Applicable to Critical Process Stages
With ViaMaster, customers can detect deviations in real time during the manufacturing process, make necessary adjustments, and ensure the precision and reliability of TSV structures—ultimately improving product yield and reducing production costs.