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Hightec Systems Corporation

Yokohama,  Kanagawa 
Japan
http://www.hightec-sys.com
  • Booth: L0306

Used Equipment partner Oversea relocation service

Overview

R&D～Production equipment with various services

Front and back end process machine/ Technical relocation service/ Modify & Refurbish

Over 5,000 performances over 35 years experience.

Cost control and reduction!

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Removal Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Equipment, Flat Panel Display
  • Alignment Film Coating Equipment
  • Laser Treatment; Cutting Systems for Panels & Photocells
  • Liquid Crystal Injection or Filling Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Lamination; Sheet Laminating Equipment
  • Repair; Rework Equipment
  • Sealing; Bagging; Packing Equipment
  • Space simulation; Vacuum chambers
    • 203 Equipment, Inspection & Measurement
  • Acoustic Spectroscopy; Electron Spectroscopy for Chemical Analysis (ESCA); Ultrasonic; Acoustical Mi
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Line Width; Critical Dimension (CD) Measurement
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Overlay Measurement
  • Wire Bonding Inspection; Test
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
  • Double sided mask aligner
    • 206 PV Equipment
  • Cells
    • 207 Equipment, Process
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion Implantation Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 208 Equipment, Test
  • Memory Test Systems
  • Optical Test Systems
  • Package Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 400 Components, Parts & Accessories
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants; p
    • 401 Sub-systems
  • Power Supplies; RF Generators; Converters; Electrical Conditioning
  • Pumps, for Fluids
    • 402 PV Systems
  • Stand-Alone Systems
    • 700 Manufacturing Services
  • Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts
  • Used; Rental Equipment; Inventory Reduction, Appraisal - Brokers; Resellers
    • 701 Manufacturing Services or Consulting
  • Equipment; Hardware; Product Design, Integration and Manufacturing

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