Changzhou Mingseal Robot Technology Co., Ltd

Changzhou City,  Jiangsu Province 
China
https://www.mingseal.com/

• Booth: N1192

Overview

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven high-end equipment manufacturing enterprise that is committed to providing process, connection, assembly & testing equipment, key core components, and other technology solutions for industry-leading customers in the field of semiconductor packaging and precision electronic manufacturing so as to jointly promote the industry technique and technology progress. Our products are widely used by top-tier customers of advanced semiconductor packaging, consumer precision electronics, and intelligent automotive electronics, etc., and our business and technology support network covers such countries as China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has got a number of qualifications and honors, such as National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, Mingseal Technology will continue to increase investment in technological innovation and R&D, adhere to the values of cooperation and sharing, and work with customers, suppliers, employees, and other partners to achieve more high-end intelligent manufacturing.

  Press Releases

• About Mingseal (Apr 21, 2026)
  Founded in 2008, Mingseal Technology is a global leader in high-end equipment manufacturing, dedicated to advancing the frontiers of semiconductor packaging and precision electronics assembly. We provide comprehensive technology solutions—including sophisticated process equipment and core components—designed to meet the rigorous demands of the digital era.

  Our expertise is anchored in three core technology pillars:

  • Precision Dispensing: High-speed, sub-micron fluid control for underfill, encapsulation, and silver paste applications.
  • Precision Mounting: Ultra-accurate placement solutions for complex micro-assemblies and SIP (System-in-Package).
  • Water-Jet Guided Laser: A revolutionary "cold processing" technology for the damage-free dicing and drilling of hard-brittle materials.

  Mingseal’s solutions are engineered for high-growth sectors where reliability is non-negotiable. Our equipment is widely adopted in Integrated Circuits (IC) and Advanced Packaging, ensuring the performance of the next generation of Consumer Electronics. In the Automotive Electronics sector, we support the shift toward electrification and smart cockpits, while our specialized laser systems provide critical breakthroughs in Aerospace component manufacturing and Biomedical device fabrication.

  Mingseal sustains a robust R&D pipeline to solve the industry’s most "impossible" manufacturing challenges. With a global service network spanning South Korea, Vietnam, Singapore, and Mexico, we provide local technical support to ensure our partners achieve seamless, high-yield production.

• GS600 Inline Jet Underfill Dispensing Machine (Aug 26, 2026)

  The GS600 is a state-of-the-art solution designed specifically for high-precision applications in FCCSP (Fan-Out Chip Scale Packages), SiP (System in Package), and FCBGA (Flip Chip Ball Grid Array) semiconductor packaging. Engineered by Mingseal, this advanced dispensing machine leverages cutting-edge piezoelectric jetting technology combined with a dual-track configuration, making it ideal for modern cleanroom environments while maximizing production space.

  One of the standout features of the GS600 is its unparalleled precision, capable of dispensing micro volumes as low as 0.001mg per dot. This level of accuracy ensures optimal underfill coverage with minimal voids, significantly enhancing the reliability and performance of semiconductor devices. Reliable underfill is critical for extending the lifespan of chips, especially in demanding applications where thermal cycling and mechanical stresses are prevalent.

  In addition to its precision, the GS600 is designed for operational efficiency. Users can choose between a standalone system with manual loading and unloading or a fully automated setup that integrates seamlessly into existing SMT (Surface Mount Technology) and SiP production lines. This flexibility allows manufacturers to tailor the GS600 to their specific workflow needs, ultimately contributing to reduced downtime and increased output.

  Moreover, the GS600 features real-time weight monitoring and vacuum-assisted substrate holding, ensuring consistent and accurate material application. With bottom heating capabilities, it also facilitates optimal adhesive performance, accounting for temperature fluctuations during production.

  In the competitive landscape of semiconductor manufacturing, the GS600 stands out as a reliable partner, offering precision, efficiency, and stability in every drop. Elevate your production capabilities and meet the growing demands of next-generation chip packaging with the GS600.