1. Machining and manufacturing of ceramic parts such as Al2O3、AlN、Si3N4、SiC、piezoelectric components、glass、quartz materials, etc.
2. Transparent Alumina ceramics.
3. CVD SiC wafer/semiconductor components.
4. Vacuum chucks with heaters.
5. Advanced uniform heating system in Panel-Level Packaging for CoPoS and FOPLP.
6. ESC.
7. The Advanced chuck with warpage control sensing system.