TAIWAN, China, September 2, 2026 — Dow (NYSE: DOW) today announced its participation in SEMICON Taiwan 2026. From September 2 to 4, Dow will showcase materials solutions for advanced semiconductor packaging, microelectronics integration, sensor packaging, and wafer-level and panel-level packaging applications at Booth X0035 on the 3rd floor of TaiNEX 2.
As artificial intelligence (AI), high-performance computing (HPC), data centers and other demanding applications continue to advance, advanced packaging is evolving beyond a traditional back-end process into a critical technology pathway that influences chip performance, power consumption, reliability and manufacturing efficiency. Higher power densities, more complex heterogeneous integration architectures and increasingly stringent requirements for sustainable manufacturing are making thermal management, stress control, materials compatibility and long-term reliability core challenges for semiconductor companies developing next-generation products.
“AI, high-performance computing and advanced packaging are accelerating the evolution of chip architectures, making thermal management and advanced packaging increasingly important to product performance and reliability. Materials innovation needs to be integrated earlier into customers’ product design and validation processes,” said Chu Minsi, Global Strategic Marketing Director, Consumer Solutions, Dow. “Through the DOW™ Cooling Science platform and our Cooling Science Studios in Shanghai, China and Auburn, the United States, Dow aims to collaborate and co-develop with customers from the early stages of R&D. By jointly defining critical-to-quality (CTQ) attributes and supporting materials screening, application testing and system-level validation, we help customers identify risks earlier, shorten development cycles and accelerate the introduction of next-generation semiconductor products.”
As advanced packaging continues to evolve, semiconductor companies must balance thermal performance, mechanical stability, process adaptability, materials compliance and manufacturing yield. Dow’s featured solutions are designed to support customers with materials science expertise and application validation capabilities, helping them identify potential risks early in the product design process and build a stronger foundation for subsequent reliability testing and high-volume manufacturing.
Focusing on Key Advanced Packaging Applications to Address Thermal Management, Performance and Reliability Challenges
For thermal interface material layer 1 (TIM 1) applications between the chip and heat spreader, Dow will present silicone materials solutions designed to reduce interfacial thermal resistance and support heat dissipation requirements for high-power chips. These solutions can support high thermal conductivity, ultra-thin bond line thickness (BLT) control, low outgassing and conformability requirements, while helping mitigate package warpage risks caused by thermal cycling. Dow can also tailor material formulations and physical properties to different package architectures and process windows, helping customers meet integrated requirements for performance, reliability and materials compatibility.
For microelectromechanical systems (MEMS) and sensor packaging, Dow will highlight silicone materials solutions formulated without intentionally added PFAS.* In response to rising global requirements for materials compliance and sustainable manufacturing, these materials use molecular design and formulation optimization to help customers balance device protection, process stability and sustainability objectives while maintaining chemical resistance, stress relief and long-term reliability.
For high-speed optical interconnect applications, Dow will showcase silicone optical materials solutions for optical modules and fiber array units. As AI, HPC and data center applications continue to grow rapidly, optical modules and related optoelectronic devices must maintain stable optical performance and long-term reliability at higher data transmission speeds. Dow’s silicone materials can be used for bonding, encapsulation and protection in optical modules, fiber array units and precision optical components, helping customers improve device protection, optical stability and process adaptability for next-generation high-speed optical interconnect applications.
To address process requirements in wafer-level and panel-level packaging, Dow will also present innovative silicone hot-melt technology. This technology is designed to support warpage control and stress management during packaging processes. After curing, it offers stress dissipation capabilities and can support a broad processing window and bonding strength requirements. For customers seeking higher process efficiency and more stable yields, this solution can serve as an important materials option for packaging process optimization.
Cooling Science Studios Support Customer Co-Creation and Application Validation
Dow’s Cooling Science Studios in Shanghai, China and Auburn, the United States are important platforms that support customer co-creation and application validation. The platform integrates materials characterization and application testing capabilities, providing customers with support from proof of concept and prototyping to process development. By moving materials validation earlier into the design stage, Dow aims to help customers more quickly evaluate material fit under real package structures and process conditions, improving R&D efficiency and reducing risks during subsequent product introduction.
TechXPOT Forum: Dow Experts to Share Materials Innovation and Application Practices
During the show, three Dow technical experts will present at the TechXPOT stage on the 4th floor of TaiNEX 1. Their sessions will cover optoelectronic devices, thermal interface materials for advanced packaging, and silicone hot-melt technology, sharing technical trends and application practices for related materials solutions:
- September 2, 13:40–14:00: Silicone solutions for optical devices; Speaker: Amako Masaaki
- September 3, 16:20–16:40: Silicone Thermal Interface Materials for Advanced Packaging; Speaker: Jiang Qi
- September 4, 14:20–14:40: Introduction of novel silicone hot-melts; Speaker: Yamazaki Ryosuke
Dow welcomes customers, partners and media representatives to Booth X0035 to learn more about the DOW™ Cooling Science platform and its latest developments in advanced packaging thermal management and microelectronics materials applications.
About Dow
Dow (NYSE: DOW) is one of the world’s leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, focused innovation and leading business positions enable us to achieve profitable growth and help deliver a sustainable future. As of year-end 2025, Dow operated manufacturing sites in 29 countries and employed approximately 34,600 people worldwide. Dow delivered sales of approximately $40 billion in 2025. References to “Dow” or the “Company” mean Dow Inc. and its subsidiaries. For more information, please visit www.dow.com.
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*Formulated without intentionally added PFAS.
NOTICE: The information contained herein is provided for informational purposes only and should not be construed as product specifications. Customers should confirm results through their own testing.
NOTICE: This information is offered in good faith for your consideration, but without guarantee or warranty, express or implied, because conditions of analysis and methods of using the information and materials described herein may vary and are beyond Dow’s control. Although this information is based on data Dow believes to be reliable and accurate, Dow does not intend for you to rely on the contents of this document, and you should not construe the contents as business, technical or any other form of advice. We recommend that you determine the suitability of the information and materials described herein before adopting or using them on a commercial scale. Dow assumes no liability for the use of this information.